FR2650259B1 - Dispositif pour faire avancer des cadres de montage pour semi-conducteurs et procede pour leur fonctionnement - Google Patents
Dispositif pour faire avancer des cadres de montage pour semi-conducteurs et procede pour leur fonctionnementInfo
- Publication number
- FR2650259B1 FR2650259B1 FR9003345A FR9003345A FR2650259B1 FR 2650259 B1 FR2650259 B1 FR 2650259B1 FR 9003345 A FR9003345 A FR 9003345A FR 9003345 A FR9003345 A FR 9003345A FR 2650259 B1 FR2650259 B1 FR 2650259B1
- Authority
- FR
- France
- Prior art keywords
- semiconductors
- mounting frames
- advancing
- advancing mounting
- frames
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G25/00—Conveyors comprising a cyclically-moving, e.g. reciprocating, carrier or impeller which is disengaged from the load during the return part of its movement
- B65G25/02—Conveyors comprising a cyclically-moving, e.g. reciprocating, carrier or impeller which is disengaged from the load during the return part of its movement the carrier or impeller having different forward and return paths of movement, e.g. walking beam conveyors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1194002A JP2635175B2 (ja) | 1989-07-28 | 1989-07-28 | 半導体フレーム搬送装置及び搬送方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2650259A1 FR2650259A1 (fr) | 1991-02-01 |
FR2650259B1 true FR2650259B1 (fr) | 1993-10-08 |
Family
ID=16317337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9003345A Expired - Fee Related FR2650259B1 (fr) | 1989-07-28 | 1990-03-15 | Dispositif pour faire avancer des cadres de montage pour semi-conducteurs et procede pour leur fonctionnement |
Country Status (5)
Country | Link |
---|---|
US (1) | US5082165A (fr) |
JP (1) | JP2635175B2 (fr) |
KR (1) | KR940000739B1 (fr) |
BR (1) | BR9003622A (fr) |
FR (1) | FR2650259B1 (fr) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5264002A (en) * | 1990-04-23 | 1993-11-23 | Mitsubishi Danki Kabushiki Kaisha | Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails |
US5238174A (en) * | 1991-11-15 | 1993-08-24 | Kulicke And Soffa Investments, Inc. | Smart indexing head for universal lead frame work station |
US5322207A (en) * | 1993-05-03 | 1994-06-21 | Micron Semiconductor Inc. | Method and apparatus for wire bonding semiconductor dice to a leadframe |
US5350106A (en) | 1993-05-07 | 1994-09-27 | Micron Semiconductor, Inc. | Semiconductor wire bonding method |
US5813590A (en) | 1995-12-18 | 1998-09-29 | Micron Technology, Inc. | Extended travel wire bonding machine |
US5890644A (en) | 1996-01-26 | 1999-04-06 | Micron Technology, Inc. | Apparatus and method of clamping semiconductor devices using sliding finger supports |
US5673845A (en) * | 1996-06-17 | 1997-10-07 | Micron Technology, Inc. | Lead penetrating clamping system |
JP3488035B2 (ja) * | 1997-01-04 | 2004-01-19 | 株式会社新川 | ボンディング装置 |
JP3264851B2 (ja) * | 1997-01-24 | 2002-03-11 | 株式会社新川 | ボンディング装置 |
KR100245794B1 (ko) * | 1997-09-22 | 2000-03-02 | 윤종용 | 리드 프레임 이송장치 및 이를 구비한 와이어 본딩 장치 |
US6121674A (en) | 1998-02-23 | 2000-09-19 | Micron Technology, Inc. | Die paddle clamping method for wire bond enhancement |
US6977214B2 (en) * | 1998-12-11 | 2005-12-20 | Micron Technology, Inc. | Die paddle clamping method for wire bond enhancement |
US6577019B1 (en) | 2000-01-21 | 2003-06-10 | Micron Technology, Inc. | Alignment and orientation features for a semiconductor package |
JP4371347B2 (ja) * | 2001-04-09 | 2009-11-25 | 株式会社ニフコ | 安全機能付ロック装置及び乗物用収納装置 |
MXPA02007208A (es) * | 2001-07-30 | 2003-02-06 | Esec Trading Sa | Dispositivo para el transporte y dotacion de substratos con chips semiconductores. |
KR20040046949A (ko) * | 2002-11-28 | 2004-06-05 | 엘지전자 주식회사 | 세탁기의 실밥채집 어셈블리 |
US6814277B2 (en) * | 2002-12-16 | 2004-11-09 | Lockheed Martin | Lead frame substrate clamp and method |
FR2886280B1 (fr) * | 2005-05-30 | 2007-07-13 | Vit Sa | Convoyeur a pas de pelerin adapte a supporter des variations thermiques |
FR2886279B1 (fr) * | 2005-05-30 | 2007-07-13 | Vit Sa | Convoyeur a pas de pelerin a conduction thermique reduite |
TWI385812B (zh) | 2007-06-06 | 2013-02-11 | Motech Ind Inc | 一種支撐裝置、基板傳送設備與其方法 |
EP2040290A1 (fr) * | 2007-09-21 | 2009-03-25 | Motech Industries Inc. | Dispositif de support, équipement de transport de substrat et son procédé associé |
GB2473600B (en) * | 2009-08-25 | 2013-09-25 | Pillarhouse Int Ltd | Quick-loading soldering apparatus |
CN104310057B (zh) * | 2014-09-19 | 2017-01-11 | 东莞市精铁机械有限公司 | 抓线装置 |
JP5878219B1 (ja) * | 2014-10-09 | 2016-03-08 | 千住金属工業株式会社 | はんだ付け装置 |
KR20160048301A (ko) * | 2014-10-23 | 2016-05-04 | 삼성전자주식회사 | 본딩 장치 및 그를 포함하는 기판 제조 설비 |
CN105584842B (zh) * | 2016-01-26 | 2017-10-10 | 浙江田中精机股份有限公司 | 凸轮旋转上料装置 |
CN108328316A (zh) * | 2018-03-31 | 2018-07-27 | 广州明森科技股份有限公司 | 一种物料搬运装置 |
CN109607176A (zh) * | 2019-01-15 | 2019-04-12 | 徐州重型机械有限公司 | 工件搬运装置 |
KR102634034B1 (ko) * | 2019-04-05 | 2024-02-08 | 주식회사 디엠에스 | 기판처리장치 |
CN110654851B (zh) * | 2019-08-26 | 2021-03-23 | 上海朋熙半导体有限公司 | 一种晶体二极管的步进夹运装置 |
CN111137678A (zh) * | 2020-01-15 | 2020-05-12 | 江苏北人机器人系统股份有限公司 | 新能源汽车电池盒运输线 |
CN115043184B (zh) * | 2022-06-23 | 2023-09-12 | 广东立迪智能科技有限公司 | 一种单侧电路板露出的背光模组包胶夹持移动设备 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3698620A (en) * | 1970-03-25 | 1972-10-17 | Motorola Inc | Apparatus for connecting lead portions of a lead frame to respective pads on a chip |
DE3240860A1 (de) * | 1982-11-05 | 1984-05-10 | Hans 4320 Hattingen Schoen | Zangenvorschubeinrichtung fuer bearbeitungsmaschinen, insbesondere stanzpressen oder dergleichen |
JPS5991733U (ja) * | 1982-12-09 | 1984-06-21 | 三洋電機株式会社 | リ−ドフレ−ム送り装置 |
JPS6067308A (ja) * | 1983-09-16 | 1985-04-17 | Shinkawa Ltd | リ−ドフレ−ムの移送装置 |
JPS6063935A (ja) * | 1983-09-17 | 1985-04-12 | Mitsubishi Electric Corp | リ−ドフレ−ム送り装置 |
US4763827A (en) * | 1984-08-13 | 1988-08-16 | Hitachi, Ltd. | Manufacturing method |
US4674670A (en) * | 1984-08-13 | 1987-06-23 | Hitachi, Ltd. | Manufacturing apparatus |
JPS62122224A (ja) * | 1985-11-22 | 1987-06-03 | Mitsubishi Electric Corp | フレ−ムフイ−ダ− |
JPS6317714A (ja) * | 1986-07-07 | 1988-01-25 | Hitachi Electronics Eng Co Ltd | Icハンドラ用のic搬送装置 |
JPH069426B2 (ja) * | 1986-08-25 | 1994-02-02 | 三菱電機株式会社 | 保護継電器の点検装置 |
JPS6357329A (ja) * | 1986-08-27 | 1988-03-12 | Mazda Motor Corp | 車両の上部車体構造 |
JPS6356121A (ja) * | 1986-08-27 | 1988-03-10 | 株式会社日立製作所 | 比率差動リレ−装置 |
-
1989
- 1989-07-28 JP JP1194002A patent/JP2635175B2/ja not_active Expired - Lifetime
-
1990
- 1990-03-15 FR FR9003345A patent/FR2650259B1/fr not_active Expired - Fee Related
- 1990-04-04 US US07/504,008 patent/US5082165A/en not_active Expired - Fee Related
- 1990-07-26 BR BR909003622A patent/BR9003622A/pt not_active IP Right Cessation
- 1990-07-26 KR KR1019900011383A patent/KR940000739B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR910002685A (ko) | 1991-02-26 |
BR9003622A (pt) | 1991-08-27 |
FR2650259A1 (fr) | 1991-02-01 |
US5082165A (en) | 1992-01-21 |
KR940000739B1 (ko) | 1994-01-28 |
JP2635175B2 (ja) | 1997-07-30 |
JPH0360132A (ja) | 1991-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
D6 | Patent endorsed licences of rights | ||
ST | Notification of lapse |