FR2636493B1 - Unite de refroidissement des equipements electroniques d'un grand appareillage de traitement de donnees - Google Patents

Unite de refroidissement des equipements electroniques d'un grand appareillage de traitement de donnees

Info

Publication number
FR2636493B1
FR2636493B1 FR8911715A FR8911715A FR2636493B1 FR 2636493 B1 FR2636493 B1 FR 2636493B1 FR 8911715 A FR8911715 A FR 8911715A FR 8911715 A FR8911715 A FR 8911715A FR 2636493 B1 FR2636493 B1 FR 2636493B1
Authority
FR
France
Prior art keywords
processing apparatus
data processing
electronic equipment
cooling unit
large data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8911715A
Other languages
English (en)
Other versions
FR2636493A1 (fr
Inventor
Umezawa Kazuhiko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of FR2636493A1 publication Critical patent/FR2636493A1/fr
Application granted granted Critical
Publication of FR2636493B1 publication Critical patent/FR2636493B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/092—Heat exchange with valve or movable deflector for heat exchange fluid flow
    • Y10S165/101—Heat exchange with valve or movable deflector for heat exchange fluid flow for controlling supply of heat exchange fluid flowing between hydraulically independent heat exchange sections
    • Y10S165/104—Hydraulically independent heat exchange sections connected in parallel
    • Y10S165/106—Valves each controls a heat exchange section
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87265—Dividing into parallel flow paths with recombining

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR8911715A 1988-09-09 1989-09-07 Unite de refroidissement des equipements electroniques d'un grand appareillage de traitement de donnees Expired - Fee Related FR2636493B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22584388A JPH06100408B2 (ja) 1988-09-09 1988-09-09 冷却装置

Publications (2)

Publication Number Publication Date
FR2636493A1 FR2636493A1 (fr) 1990-03-16
FR2636493B1 true FR2636493B1 (fr) 1996-05-03

Family

ID=16835697

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8911715A Expired - Fee Related FR2636493B1 (fr) 1988-09-09 1989-09-07 Unite de refroidissement des equipements electroniques d'un grand appareillage de traitement de donnees

Country Status (3)

Country Link
US (1) US4945980A (fr)
JP (1) JPH06100408B2 (fr)
FR (1) FR2636493B1 (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5023695A (en) * 1988-05-09 1991-06-11 Nec Corporation Flat cooling structure of integrated circuit
JPH0827109B2 (ja) * 1990-07-12 1996-03-21 甲府日本電気株式会社 液体冷却装置
CA2053055C (fr) * 1990-10-11 1997-02-25 Tsukasa Mizuno Systeme de refroidissement par liquide pour boitiers lsi
JP2748732B2 (ja) * 1991-07-19 1998-05-13 日本電気株式会社 液体冷媒循環システム
US5831824A (en) * 1996-01-31 1998-11-03 Motorola, Inc. Apparatus for spray-cooling multiple electronic modules
US5675473A (en) * 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5687577A (en) * 1996-04-10 1997-11-18 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5718117A (en) * 1996-04-10 1998-02-17 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5731542A (en) * 1996-05-23 1998-03-24 Motorola, Inc. Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
FR2767380B1 (fr) * 1997-08-18 1999-09-24 Gec Alsthom Stein Ind Dispositif d'echange thermique pour une chaudiere a lit fluidise circulant
WO2000058673A1 (fr) * 1999-03-29 2000-10-05 Caterpillar Inc. Systeme de fluide refrigere modulaire et procede de fourniture de fluide refrigere a des fins de refroidissement
US6460353B2 (en) 2001-03-02 2002-10-08 Honeywell International Inc. Method and apparatus for improved aircraft environmental control system utilizing parallel heat exchanger arrays
US6937471B1 (en) 2002-07-11 2005-08-30 Raytheon Company Method and apparatus for removing heat from a circuit
US7000691B1 (en) 2002-07-11 2006-02-21 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US6957550B2 (en) * 2003-05-19 2005-10-25 Raytheon Company Method and apparatus for extracting non-condensable gases in a cooling system
EP1515098A1 (fr) * 2003-09-12 2005-03-16 Ingenjörsfirma Kontrollelektronik Hjärtström & Kalén Aktiebolag Méthode et dispositif pour le conditionnement d'un environnement
US20050262861A1 (en) * 2004-05-25 2005-12-01 Weber Richard M Method and apparatus for controlling cooling with coolant at a subambient pressure
US20050274139A1 (en) * 2004-06-14 2005-12-15 Wyatt William G Sub-ambient refrigerating cycle
US8341965B2 (en) 2004-06-24 2013-01-01 Raytheon Company Method and system for cooling
US7254957B2 (en) * 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US20070119572A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
US20070119568A1 (en) * 2005-11-30 2007-05-31 Raytheon Company System and method of enhanced boiling heat transfer using pin fins
US20070209782A1 (en) * 2006-03-08 2007-09-13 Raytheon Company System and method for cooling a server-based data center with sub-ambient cooling
US7908874B2 (en) * 2006-05-02 2011-03-22 Raytheon Company Method and apparatus for cooling electronics with a coolant at a subambient pressure
US8025097B2 (en) * 2006-05-18 2011-09-27 Centipede Systems, Inc. Method and apparatus for setting and controlling temperature
US8151872B2 (en) 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
US8651172B2 (en) 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
US7921655B2 (en) 2007-09-21 2011-04-12 Raytheon Company Topping cycle for a sub-ambient cooling system
US7934386B2 (en) * 2008-02-25 2011-05-03 Raytheon Company System and method for cooling a heat generating structure
US7907409B2 (en) * 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
US8820351B1 (en) * 2013-06-25 2014-09-02 Chilldyne, Inc. No drip hot swap connector and method of use
TW201515563A (zh) * 2013-10-08 2015-04-16 Hon Hai Prec Ind Co Ltd 散熱系統

Family Cites Families (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2357706A (en) * 1942-06-29 1944-09-05 Rca Corp Heating and cooling system
BE540197A (fr) * 1954-06-22
US2999034A (en) * 1960-10-21 1961-09-05 Wenczler & Heidenhain Method of manufacture of line plates, scales, and the like
US3205469A (en) * 1961-07-12 1965-09-07 Gen Precision Inc Pin board
US3211969A (en) * 1961-11-15 1965-10-12 Westinghouse Electric Corp High voltage rectifier
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
US3881181A (en) * 1973-02-22 1975-04-29 Rca Corp Semiconductor temperature sensor
US3827457A (en) * 1973-06-22 1974-08-06 Westinghouse Air Brake Co Fluid pressure system for converting digital signals to analog signals
US3912001A (en) * 1974-03-11 1975-10-14 Gen Electric Water cooled heat sink assembly
US3908188A (en) * 1974-08-14 1975-09-23 Us Air Force Heat sink for microstrip circuit
SU572951A1 (ru) * 1974-10-24 1977-09-15 Предприятие П/Я А-3162 Устройство дл охлаждени элементов радиоаппаратуры
US4110549A (en) * 1974-11-30 1978-08-29 Robert Bosch Gmbh Environmentally protected electronic housing and heat sink structure, particularly for automotive use
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4204246A (en) * 1976-02-14 1980-05-20 Sony Corporation Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block
US4037270A (en) * 1976-05-24 1977-07-19 Control Data Corporation Circuit packaging and cooling
US4093971A (en) * 1976-12-10 1978-06-06 Burroughs Corporation D-I-P On island
US4115836A (en) * 1977-04-25 1978-09-19 Burroughs Corporation Cooling system for dual-in-line packages
JPS6011830B2 (ja) * 1977-05-24 1985-03-28 日本電気株式会社 電子部品の冷却装置
US4196775A (en) * 1977-09-19 1980-04-08 The Unites States Of America As Represented By The Secretary Of The Navy Shock-mounted, liquid cooled cold plate assembly
JPS5586130A (en) * 1978-12-25 1980-06-28 Hitachi Ltd Connection of semiconductor element
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
JPS5612760A (en) * 1979-07-10 1981-02-07 Nec Corp Multi chip lsi package
JPS5670655A (en) * 1979-11-15 1981-06-12 Matsushita Electric Ind Co Ltd Manufacture of electronic circuit mounting device
US4588023A (en) * 1980-06-16 1986-05-13 Showa Aluminum Corporation Device for releasing heat
JPS57106062A (en) * 1980-12-24 1982-07-01 Hitachi Ltd Package for integrated circuit
FR2498814B1 (fr) * 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
US4381032A (en) * 1981-04-23 1983-04-26 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US4468717A (en) * 1982-06-09 1984-08-28 Sperry Corporation Apparatus for cooling integrated circuit chips
US4493010A (en) * 1982-11-05 1985-01-08 Lockheed Corporation Electronic packaging module utilizing phase-change conductive cooling
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package
JPS59130450A (ja) * 1983-01-17 1984-07-27 Nec Corp Ｉｃパツケ−ジの冷却構造
GB8304890D0 (en) * 1983-02-22 1983-03-23 Smiths Industries Plc Chip-carrier substrates
US4536824A (en) * 1983-03-28 1985-08-20 Goodyear Aerospace Corporation Indirect cooling of electronic circuits
CA1229155A (fr) * 1983-03-29 1987-11-10 Toshihiko Watari Progiciel lsi a grande densite pour circuite logiques
US4535385A (en) * 1983-04-22 1985-08-13 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US4602678A (en) * 1983-09-02 1986-07-29 The Bergquist Company Interfacing of heat sinks with electrical devices, and the like
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
US4546410A (en) * 1983-10-31 1985-10-08 Kaufman Lance R Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink
JPS60160150A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路の冷却装置
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
JPS60257156A (ja) * 1984-06-01 1985-12-18 Hitachi Ltd 熱伝導冷却モジユ−ル装置
US4666545A (en) * 1984-06-27 1987-05-19 The Bergquist Company Method of making a mounting base pad for semiconductor devices
US4628990A (en) * 1984-08-17 1986-12-16 Nec Corporation Cooling equipment for an integrated circuit chip
JPS61171157A (ja) * 1985-01-25 1986-08-01 Nec Corp 集積回路パツケ−ジ
JPS61189657A (ja) * 1985-02-18 1986-08-23 Fuji Photo Film Co Ltd 半導体素子温度制御装置
JPS61189658A (ja) * 1985-02-18 1986-08-23 Fuji Photo Film Co Ltd 半導体素子温度制御装置
JPH06101523B2 (ja) * 1985-03-04 1994-12-12 株式会社日立製作所 集積回路チツプ冷却装置
JPS61222242A (ja) * 1985-03-28 1986-10-02 Fujitsu Ltd 冷却装置
JPS61226946A (ja) * 1985-04-01 1986-10-08 Hitachi Ltd 集積回路チツプ冷却装置
FR2580060B1 (fr) * 1985-04-05 1989-06-09 Nec Corp
US4602125A (en) * 1985-05-10 1986-07-22 The Bergquist Company Mounting pad with tubular projections for solid-state devices
JPS61276242A (ja) * 1985-05-30 1986-12-06 Hitachi Ltd 半導体モジユ−ル
US4748495A (en) * 1985-08-08 1988-05-31 Dypax Systems Corporation High density multi-chip interconnection and cooling package
US4724611A (en) * 1985-08-23 1988-02-16 Nec Corporation Method for producing semiconductor module
EP0217676B1 (fr) * 1985-10-04 1993-09-01 Fujitsu Limited Système de refroidissement pour un dispositif de circuit électronique
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
DE3766384D1 (de) * 1986-02-25 1991-01-10 Nec Corp Fluessigkeitskuehlungssystem fuer integrierte schaltungschips.
JPS62238653A (ja) * 1986-04-09 1987-10-19 Nec Corp 冷却構造
DE8617820U1 (fr) * 1986-07-03 1987-12-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
JPS6381959A (ja) * 1986-09-26 1988-04-12 Hitachi Ltd 半導体装置
US4721996A (en) * 1986-10-14 1988-01-26 Unisys Corporation Spring loaded module for cooling integrated circuit packages directly with a liquid
JPS63157449A (ja) * 1986-12-22 1988-06-30 Nec Corp 集積回路の冷却構造
JPH07112033B2 (ja) * 1987-03-16 1995-11-29 富士通株式会社 冷却モジユ−ル構造
JPS63308943A (ja) * 1987-06-10 1988-12-16 Mitsubishi Electric Corp 半導体装置
US4791983A (en) * 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly
CA1283225C (fr) * 1987-11-09 1991-04-16 Shinji Mine Systeme de refroidissement pour bloc de circuit integre tridimensionnel

Also Published As

Publication number Publication date
FR2636493A1 (fr) 1990-03-16
JPH06100408B2 (ja) 1994-12-12
US4945980A (en) 1990-08-07
JPH0275873A (ja) 1990-03-15

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Legal Events

Date Code Title Description
ST Notification of lapse