FR2603740A1 - Combinaison d'un substrat en ceramique supportant des composants electroniques et d'un dissipateur thermique pour ceux-ci - Google Patents
Combinaison d'un substrat en ceramique supportant des composants electroniques et d'un dissipateur thermique pour ceux-ciInfo
- Publication number
- FR2603740A1 FR2603740A1 FR8706985A FR8706985A FR2603740A1 FR 2603740 A1 FR2603740 A1 FR 2603740A1 FR 8706985 A FR8706985 A FR 8706985A FR 8706985 A FR8706985 A FR 8706985A FR 2603740 A1 FR2603740 A1 FR 2603740A1
- Authority
- FR
- France
- Prior art keywords
- electronic components
- combination
- heat sink
- ceramic substrate
- substrate supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
UN DISSIPEUR THERMIQUE 14 DESTINE A DES COMPOSANTS ELECTRONIQUES COMPRENANT UNE PLAQUE EN CERAMIQUE 10 PRESENTANT UNE PREMIERE SURFACE DESTINEE A RECEVOIR LA CHALEUR DEGAGEE PAR LES COMPOSANTS ELECTRONIQUES 12 ET UNE SECONDE SURFACE, ET UNE PLURALITE D'ELEMENTS 24 CONDUCTEURS DE CHALEUR SEPARES, ESPACES, METALLIQUES, MONTES SUR ET S'ETENDANT DEPUIS LA SECONDE SURFACE DE LA PLAQUE EN CERAMIQUE 20.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/908,779 US4682269A (en) | 1984-10-11 | 1986-09-09 | Heat dissipation for electronic components on a ceramic substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2603740A1 true FR2603740A1 (fr) | 1988-03-11 |
FR2603740B1 FR2603740B1 (fr) | 1991-06-14 |
Family
ID=25426234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR878706985A Expired - Lifetime FR2603740B1 (fr) | 1986-09-09 | 1987-05-19 | Combinaison d'un substrat en ceramique supportant des composants electroniques et d'un dissipateur thermique pour ceux-ci |
Country Status (6)
Country | Link |
---|---|
US (1) | US4682269A (fr) |
JP (1) | JPS6370498A (fr) |
CA (1) | CA1257010A (fr) |
DE (1) | DE3716196A1 (fr) |
FR (1) | FR2603740B1 (fr) |
GB (1) | GB2195056B (fr) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4854986A (en) * | 1987-05-13 | 1989-08-08 | Harris Corporation | Bonding technique to join two or more silicon wafers |
DE3738506A1 (de) * | 1987-11-13 | 1989-06-01 | Dornier System Gmbh | Antennenstruktur |
FR2625038B1 (fr) * | 1987-12-22 | 1990-08-17 | Cit Alcatel | Procede et dispositif de refroidissement d'un boitier de circuit integre |
US4965699A (en) * | 1989-04-18 | 1990-10-23 | Magnavox Government And Industrial Electronics Company | Circuit card assembly cold plate |
US5282111A (en) * | 1989-06-09 | 1994-01-25 | Labinal Components And Systems, Inc. | Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate |
US5485351A (en) * | 1989-06-09 | 1996-01-16 | Labinal Components And Systems, Inc. | Socket assembly for integrated circuit chip package |
US5031071A (en) * | 1990-04-30 | 1991-07-09 | Motorola, Inc. | Heat spreading device for component leads |
US5158136A (en) * | 1991-11-12 | 1992-10-27 | At&T Laboratories | Pin fin heat sink including flow enhancement |
US5146981A (en) * | 1991-11-14 | 1992-09-15 | Digital Equipment Corporation | Substrate to heatsink interface apparatus and method |
DE4234022C2 (de) * | 1992-10-09 | 1995-05-24 | Telefunken Microelectron | Schichtschaltung mit mindestens einem Leistungswiderstand |
US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
KR0126781Y1 (ko) * | 1994-08-23 | 1999-05-01 | 이형도 | 반도체소자 방열장치 |
DE4437971C2 (de) * | 1994-10-24 | 1997-09-11 | Siemens Ag | Kühleinrichtung für elektrische Baugruppen |
FI946047A (fi) * | 1994-12-22 | 1996-06-23 | Abb Industry Oy | Menetelmä jäähdytyselementtien kiinnittämiseksi tehopuolijohdekomponenttiin sekä jäähdytetty tehonpuolijohde |
US6208513B1 (en) * | 1995-01-17 | 2001-03-27 | Compaq Computer Corporation | Independently mounted cooling fins for a low-stress semiconductor package |
DE19505180A1 (de) * | 1995-02-16 | 1996-08-22 | Telefunken Microelectron | Elektronisches Steuermodul |
EP0793407B1 (fr) * | 1996-02-23 | 2003-04-16 | Tyco Electronics Logistics AG | Installation électronique de distribution, particulièrement relais électronique, pour montage enfichage |
JP2914342B2 (ja) * | 1997-03-28 | 1999-06-28 | 日本電気株式会社 | 集積回路装置の冷却構造 |
US6705388B1 (en) | 1997-11-10 | 2004-03-16 | Parker-Hannifin Corporation | Non-electrically conductive thermal dissipator for electronic components |
US5933324A (en) * | 1997-12-16 | 1999-08-03 | Intel Corporation | Apparatus for dissipating heat from a conductive layer in a circuit board |
DE19835127A1 (de) * | 1998-08-04 | 2000-02-10 | Wuerth Elektronik Gmbh | Leiterplatte mit einem Heatsink und Verfahren zum Anbringen eines Heatsink |
DE29915465U1 (de) * | 1999-09-03 | 2001-01-18 | Schneider-Clauss GmbH & Co. KG Metallwarenfabrikation, 50677 Köln | Kühlelement |
US6418007B1 (en) * | 2000-08-28 | 2002-07-09 | Motorola, Inc. | Trimmable chip stub |
US6621705B1 (en) * | 2002-04-12 | 2003-09-16 | Cisco Technology, Inc. | Miniature surface mount heatsink element and method of use |
CN201854534U (zh) * | 2010-06-24 | 2011-06-01 | 景德镇正宇奈米科技有限公司 | 陶瓷辐射散热结构 |
US9302747B2 (en) | 2013-04-10 | 2016-04-05 | Technip France | Floating offshore platform with pontoon-coupled extension plates for reduced heave motion |
CN105392758B (zh) * | 2014-03-27 | 2019-04-09 | 日本碍子株式会社 | 陶瓷板与金属制圆筒部件的接合结构 |
US10062950B2 (en) * | 2016-04-20 | 2018-08-28 | Chih-Yuan Wang | Heat dissipater with an antenna structure |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0124421A1 (fr) * | 1983-04-29 | 1984-11-07 | Alcatel Thomson Faisceaux Hertziens | Procédé de fabrication d'un dissipateur thermique à picots et dissipateur obtenu par ce procédé |
GB2165704A (en) * | 1984-10-11 | 1986-04-16 | Teraydne Inc | Heat dissipation for electronic components |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5069558A (fr) * | 1973-10-24 | 1975-06-10 | ||
DE7821509U1 (de) * | 1978-07-18 | 1978-10-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Kühlvorrichtung für LSI-Plättchen |
JPS6016206B2 (ja) * | 1981-07-29 | 1985-04-24 | 東洋水産機械株式会社 | 魚体の分割切断処理装置 |
US4541004A (en) * | 1982-11-24 | 1985-09-10 | Burroughs Corporation | Aerodynamically enhanced heat sink |
-
1986
- 1986-09-09 US US06/908,779 patent/US4682269A/en not_active Expired - Fee Related
-
1987
- 1987-05-12 CA CA000536922A patent/CA1257010A/fr not_active Expired
- 1987-05-14 GB GB8711364A patent/GB2195056B/en not_active Expired - Lifetime
- 1987-05-14 DE DE19873716196 patent/DE3716196A1/de active Granted
- 1987-05-19 FR FR878706985A patent/FR2603740B1/fr not_active Expired - Lifetime
- 1987-06-11 JP JP62146179A patent/JPS6370498A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0124421A1 (fr) * | 1983-04-29 | 1984-11-07 | Alcatel Thomson Faisceaux Hertziens | Procédé de fabrication d'un dissipateur thermique à picots et dissipateur obtenu par ce procédé |
GB2165704A (en) * | 1984-10-11 | 1986-04-16 | Teraydne Inc | Heat dissipation for electronic components |
Also Published As
Publication number | Publication date |
---|---|
GB2195056B (en) | 1990-01-10 |
GB2195056A (en) | 1988-03-23 |
CA1257010A (fr) | 1989-07-04 |
GB8711364D0 (en) | 1987-06-17 |
JPS6370498A (ja) | 1988-03-30 |
DE3716196A1 (de) | 1988-03-17 |
US4682269A (en) | 1987-07-21 |
DE3716196C2 (fr) | 1991-06-27 |
FR2603740B1 (fr) | 1991-06-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse | ||
ST | Notification of lapse |