FR2581657B1 - Materiau en alliage de cuivre pour fils conducteurs d'un dispositif semi-conducteur - Google Patents
Materiau en alliage de cuivre pour fils conducteurs d'un dispositif semi-conducteurInfo
- Publication number
- FR2581657B1 FR2581657B1 FR868600187A FR8600187A FR2581657B1 FR 2581657 B1 FR2581657 B1 FR 2581657B1 FR 868600187 A FR868600187 A FR 868600187A FR 8600187 A FR8600187 A FR 8600187A FR 2581657 B1 FR2581657 B1 FR 2581657B1
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- copper alloy
- percent
- leads
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60097589A JPS61257443A (ja) | 1985-05-08 | 1985-05-08 | 半導体装置用Cu合金リ−ド素材 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2581657A1 FR2581657A1 (fr) | 1986-11-14 |
FR2581657B1 true FR2581657B1 (fr) | 1991-12-27 |
Family
ID=14196424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR868600187A Expired - Fee Related FR2581657B1 (fr) | 1985-05-08 | 1986-01-08 | Materiau en alliage de cuivre pour fils conducteurs d'un dispositif semi-conducteur |
Country Status (5)
Country | Link |
---|---|
US (1) | US4668471A (fr) |
JP (1) | JPS61257443A (fr) |
DE (1) | DE3613594C3 (fr) |
FR (1) | FR2581657B1 (fr) |
GB (1) | GB2175008B (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4805009A (en) * | 1985-03-11 | 1989-02-14 | Olin Corporation | Hermetically sealed semiconductor package |
US5463247A (en) * | 1992-06-11 | 1995-10-31 | Mitsubishi Shindoh Co., Ltd. | Lead frame material formed of copper alloy for resin sealed type semiconductor devices |
CN1102177C (zh) * | 1998-03-10 | 2003-02-26 | 三菱伸铜株式会社 | 具有优异的冲裁模耐磨性的铜基合金及其薄板 |
JP4329967B2 (ja) * | 2000-04-28 | 2009-09-09 | 古河電気工業株式会社 | プラスチック基板に設けられるピングリッドアレイ用icリードピンに適した銅合金線材 |
US6632300B2 (en) | 2000-06-26 | 2003-10-14 | Olin Corporation | Copper alloy having improved stress relaxation resistance |
US6996897B2 (en) * | 2002-07-31 | 2006-02-14 | Freescale Semiconductor, Inc. | Method of making a mount for electronic devices |
DE10330192B4 (de) * | 2003-07-03 | 2008-11-13 | Infineon Technologies Ag | Verfahren zum Abscheiden einer porösen Haftvermittlungsschicht auf einer Oberfläche eines elektrisch leitenden Körpers sowie Verwendung des Verfahrens |
DE102005052563B4 (de) * | 2005-11-02 | 2016-01-14 | Infineon Technologies Ag | Halbleiterchip, Halbleiterbauteil und Verfahren zu deren Herstellung |
JP5210540B2 (ja) * | 2007-05-08 | 2013-06-12 | 株式会社日立製作所 | 半導体レーザ |
US20230067714A1 (en) * | 2021-08-26 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company Limited | Three-dimensional device structure including seal ring connection circuit |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2155406A (en) * | 1938-04-28 | 1939-04-25 | Chase Brass & Copper Co | Electrical conductor |
US3522039A (en) * | 1967-06-26 | 1970-07-28 | Olin Mathieson | Copper base alloy |
US3677745A (en) * | 1969-02-24 | 1972-07-18 | Cooper Range Co | Copper base composition |
US3639119A (en) * | 1970-05-04 | 1972-02-01 | Olin Corp | Copper base alloy |
DE2253994B2 (de) * | 1972-11-04 | 1975-11-06 | Vereinigte Deutsche Metallwerke Ag, 6000 Frankfurt | Kupfer-Eisen-Legierung für elektrische Letter |
DE2419157C3 (de) * | 1974-04-20 | 1979-06-28 | W.C. Heraeus Gmbh, 6450 Hanau | Metallischer Träger für Halbleiterbauelemente und Verfahren zu seiner Herstellung |
US4012765A (en) * | 1975-09-24 | 1977-03-15 | Motorola, Inc. | Lead frame for plastic encapsulated semiconductor assemblies |
GB1561922A (en) * | 1976-01-13 | 1980-03-05 | Olin Corp | High strength high conductivity copper alloys |
JPS5426219A (en) * | 1977-07-30 | 1979-02-27 | Furukawa Electric Co Ltd:The | Electric conductive copper alloy of superior solderability |
JPS5541955A (en) * | 1978-09-19 | 1980-03-25 | Furukawa Electric Co Ltd:The | Copper alloy for connecting wire |
DE3040676A1 (de) * | 1980-10-29 | 1982-05-27 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zum herstellen von halbleiteranordnugen |
-
1985
- 1985-05-08 JP JP60097589A patent/JPS61257443A/ja active Pending
- 1985-12-17 US US06/809,895 patent/US4668471A/en not_active Expired - Lifetime
- 1985-12-20 GB GB08531523A patent/GB2175008B/en not_active Expired
-
1986
- 1986-01-08 FR FR868600187A patent/FR2581657B1/fr not_active Expired - Fee Related
- 1986-04-22 DE DE3613594A patent/DE3613594C3/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3613594A1 (de) | 1986-11-13 |
GB8531523D0 (en) | 1986-02-05 |
DE3613594C3 (de) | 1995-02-09 |
GB2175008A (en) | 1986-11-19 |
DE3613594C2 (fr) | 1990-06-21 |
US4668471A (en) | 1987-05-26 |
FR2581657A1 (fr) | 1986-11-14 |
JPS61257443A (ja) | 1986-11-14 |
GB2175008B (en) | 1988-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
ST | Notification of lapse |