FR2575026B1 - Mecanisme de decollement d'un ruban sur une bande support de composants electriques - Google Patents

Mecanisme de decollement d'un ruban sur une bande support de composants electriques

Info

Publication number
FR2575026B1
FR2575026B1 FR858518706A FR8518706A FR2575026B1 FR 2575026 B1 FR2575026 B1 FR 2575026B1 FR 858518706 A FR858518706 A FR 858518706A FR 8518706 A FR8518706 A FR 8518706A FR 2575026 B1 FR2575026 B1 FR 2575026B1
Authority
FR
France
Prior art keywords
tape
taking
electric components
support strip
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR858518706A
Other languages
English (en)
Other versions
FR2575026A1 (fr
Inventor
Waldo Bates Hanson
John William Dacey
Stanley Robert Vancelette
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USM Corp
Original Assignee
USM Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USM Corp filed Critical USM Corp
Publication of FR2575026A1 publication Critical patent/FR2575026A1/fr
Application granted granted Critical
Publication of FR2575026B1 publication Critical patent/FR2575026B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/935—Delaminating means in preparation for post consumer recycling
    • Y10S156/937—Means for delaminating specified electronic component in preparation for recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1906—Delaminating means responsive to feed or shape at delamination

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Advancing Webs (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
FR858518706A 1984-12-17 1985-12-17 Mecanisme de decollement d'un ruban sur une bande support de composants electriques Expired - Fee Related FR2575026B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/682,708 US4586670A (en) 1984-12-17 1984-12-17 Tape stripper for electrical component tape feeder

Publications (2)

Publication Number Publication Date
FR2575026A1 FR2575026A1 (fr) 1986-06-20
FR2575026B1 true FR2575026B1 (fr) 1991-05-24

Family

ID=24740800

Family Applications (1)

Application Number Title Priority Date Filing Date
FR858518706A Expired - Fee Related FR2575026B1 (fr) 1984-12-17 1985-12-17 Mecanisme de decollement d'un ruban sur une bande support de composants electriques

Country Status (7)

Country Link
US (1) US4586670A (fr)
JP (1) JPS61144899A (fr)
CA (1) CA1247058A (fr)
DE (1) DE3544221A1 (fr)
FR (1) FR2575026B1 (fr)
GB (1) GB2169262B (fr)
SG (1) SG49191G (fr)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8513297D0 (en) * 1985-05-28 1985-07-03 Dynapert Precima Ltd Machines for handling electrical components
US4735341A (en) * 1986-05-12 1988-04-05 Universal Instruments Corporation Feeder for electrical component supply tapes
JP2662948B2 (ja) * 1986-10-30 1997-10-15 ニツト− システム テクノロジ− インコ−ポレ−テツド チップテープのトップテープ除去装置
JPH0770858B2 (ja) * 1987-01-19 1995-07-31 三洋電機株式会社 部品供給装置
JPH0691343B2 (ja) * 1987-01-20 1994-11-14 松下電器産業株式会社 電子部品供給装置
JP2630782B2 (ja) * 1987-08-31 1997-07-16 三洋電機株式会社 部品供給装置
US4869393A (en) * 1988-06-01 1989-09-26 Universal Instruments Corporation Method and apparatus for peeling a covering tape from a component supply tape
US4887778A (en) * 1988-06-01 1989-12-19 Universal Instruments Corporation Feeder drive assembly and replaceable section for tape supplying and cover peeling
DE3829249C2 (de) * 1988-08-29 1997-03-27 Siemens Ag Verfahren und Vorrichtung von mit Bauelementen gefüllten Blister-Verpackungen
DE3903865C1 (en) * 1989-02-10 1990-07-12 Zevatech Ag, Bellach, Ch Supply unit for components packed in belts for feeding automatic fitting machines
JP2519589B2 (ja) * 1989-12-12 1996-07-31 ヤマハ発動機株式会社 テ―プフィ―ダのカバ―テ―プ処理装置
US5031848A (en) * 1990-01-22 1991-07-16 Zip-Pak Incorporated Guiding spirally wound zippered film to a constant infeed point
US5054704A (en) * 1990-03-14 1991-10-08 Minnesota Mining And Manufacturing Company Level wound reel of component carrier tape
JPH0697717B2 (ja) * 1990-05-10 1994-11-30 永田精機株式会社 電子部品供給装置
JP2767976B2 (ja) * 1990-05-25 1998-06-25 ソニー株式会社 電子部品取出装置
US5213653A (en) * 1990-09-05 1993-05-25 Yamaha Hatsudoki Kabushiki Kaisha Waste tape disposing means of tape feeder
JPH07114319B2 (ja) * 1991-01-22 1995-12-06 松下電器産業株式会社 チップ形電子部品の供給装置
KR940003241B1 (ko) * 1991-05-23 1994-04-16 금성일렉트론 주식회사 To-220 반도체 제조기의 리드프레임 자동 공급장치
JPH077292A (ja) * 1993-06-18 1995-01-10 Toshiba Corp 部品供給装置
JP2556816B2 (ja) * 1993-11-29 1996-11-27 ヤマハ発動機株式会社 テープフィーダーのテープ処理装置
JP3404431B2 (ja) * 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
JP3467079B2 (ja) * 1994-07-07 2003-11-17 富士機械製造株式会社 電子部品供給カートリッジ
US5941674A (en) * 1996-06-12 1999-08-24 Tempo G Interchangeable electronic carrier tape feeder adaptable to various surface mount assembly machines
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
DE69835583T2 (de) * 1997-02-20 2006-12-07 Matsushita Electric Industrial Co., Ltd., Kadoma Zuführungseinrichtung von elektronischen bauteilen
ATE361549T1 (de) 1997-12-07 2007-05-15 Oerlikon Assembly Equipment Ag Halbleiter-montageeinrichtung mit einem hin und her geführten chipgreifer
US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
JP4014296B2 (ja) * 1998-06-24 2007-11-28 富士機械製造株式会社 テーピング電気部品送り装置および電気部品供給方法
JP4117859B2 (ja) 1998-06-24 2008-07-16 富士機械製造株式会社 部品供給ユニット
US6162007A (en) * 1999-01-14 2000-12-19 Witte; Stefan Apparatus for feeding electronic component tape
US6402452B1 (en) 1999-04-26 2002-06-11 Hover-Davis, Inc. Carrier tape feeder with cover tape parting
KR100348406B1 (ko) * 2000-11-24 2002-08-10 미래산업 주식회사 표면실장기의 부품공급장치
TW507492B (en) * 2000-11-24 2002-10-21 Mirae Corpration Feeder for surface mounting device
US6652706B1 (en) * 2000-12-01 2003-11-25 Delaware Capital Formation, Inc. Tape feeder with improved cover tape disposition path and drive
US6691859B2 (en) * 2001-12-20 2004-02-17 Autosplice Systems, Inc. Automatic feeder for strip-supported contacts
US7073696B2 (en) * 2003-11-24 2006-07-11 Tyco Electronics Corporation High repeatability tape feeder for electronic component carrier tapes
US7380581B2 (en) * 2005-01-26 2008-06-03 Samsung Techwin Co., Ltd. Tape feeder and tape feeding and recovering modules therefor
ITFI20050232A1 (it) * 2005-11-14 2007-05-15 Lcm S R L Caricatore multiplo lineare per macchine di posizionamento automatico di componenti elettronici smd
WO2014147799A1 (fr) * 2013-03-21 2014-09-25 富士機械製造株式会社 Dispositif de délivrance de bande
US10159170B2 (en) 2015-03-09 2018-12-18 Fuji Corporation Feeder
TWI640465B (zh) * 2016-02-04 2018-11-11 萬潤科技股份有限公司 Electronic component packaging carrier tape guiding method and device
WO2019026185A1 (fr) * 2017-08-01 2019-02-07 ヤマハ発動機株式会社 Dispositif et procédé de distribution de composants et dispositif de montage de composants comprenant un dispositif de distribution de composants
CN110481920A (zh) * 2019-08-23 2019-11-22 楼显华 一种编带二极管的分离上料装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US440355A (en) * 1890-11-11 Automatic grain-scales
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS57140000A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Electronic part supplying device
US4458412A (en) * 1981-05-06 1984-07-10 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
NL8303816A (nl) * 1983-11-05 1985-06-03 Philips Nv Inrichting voor het toevoeren van in band verpakte electronische onderdelen naar een opneempositie.

Also Published As

Publication number Publication date
DE3544221A1 (de) 1986-06-19
GB8530883D0 (en) 1986-01-29
SG49191G (en) 1991-08-23
GB2169262B (en) 1988-07-13
JPS61144899A (ja) 1986-07-02
GB2169262A (en) 1986-07-09
US4586670A (en) 1986-05-06
FR2575026A1 (fr) 1986-06-20
CA1247058A (fr) 1988-12-20

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Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
CA Change of address
TP Transmission of property
CA Change of address
TP Transmission of property
ST Notification of lapse