FR2562751B1 - Mecanisme de positionnement destine, notamment au positionnement de composants electroniques sur un substrat. - Google Patents

Mecanisme de positionnement destine, notamment au positionnement de composants electroniques sur un substrat.

Info

Publication number
FR2562751B1
FR2562751B1 FR858504145A FR8504145A FR2562751B1 FR 2562751 B1 FR2562751 B1 FR 2562751B1 FR 858504145 A FR858504145 A FR 858504145A FR 8504145 A FR8504145 A FR 8504145A FR 2562751 B1 FR2562751 B1 FR 2562751B1
Authority
FR
France
Prior art keywords
positioning
substrate
electronic components
positioning mechanism
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR858504145A
Other languages
English (en)
French (fr)
Other versions
FR2562751A1 (fr
Inventor
Stanley Robert Vancelette
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USM Corp
Original Assignee
USM Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USM Corp filed Critical USM Corp
Publication of FR2562751A1 publication Critical patent/FR2562751A1/fr
Application granted granted Critical
Publication of FR2562751B1 publication Critical patent/FR2562751B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
FR858504145A 1984-04-06 1985-03-20 Mecanisme de positionnement destine, notamment au positionnement de composants electroniques sur un substrat. Expired - Fee Related FR2562751B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59734184A 1984-04-06 1984-04-06

Publications (2)

Publication Number Publication Date
FR2562751A1 FR2562751A1 (fr) 1985-10-11
FR2562751B1 true FR2562751B1 (fr) 1991-05-24

Family

ID=24391111

Family Applications (1)

Application Number Title Priority Date Filing Date
FR858504145A Expired - Fee Related FR2562751B1 (fr) 1984-04-06 1985-03-20 Mecanisme de positionnement destine, notamment au positionnement de composants electroniques sur un substrat.

Country Status (7)

Country Link
JP (1) JPS60229396A (ko)
KR (1) KR920005074B1 (ko)
BE (1) BE902032A (ko)
CA (1) CA1246625A (ko)
DE (1) DE3511132A1 (ko)
FR (1) FR2562751B1 (ko)
GB (1) GB2156710B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4799854A (en) * 1987-07-20 1989-01-24 Hughes Aircraft Company Rotatable pick and place vacuum sense head for die bonding apparatus
FR2632480B1 (fr) * 1988-06-03 1990-08-24 Loupot Sa J Machine de montage en surface semi-automatique et tete de montage
US5446323A (en) * 1991-09-25 1995-08-29 Systems, Machines, Automation Components Corporation Actuator with translational and rotational control

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3597824A (en) * 1968-03-19 1971-08-10 Matsushita Electric Ind Co Ltd Full-automatic electric part mounting apparatus
JPS5325368A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Pellet attaching collet
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
US4231153A (en) * 1979-02-22 1980-11-04 Browne Lawrence T Article placement system
NL8001114A (nl) * 1980-02-25 1981-09-16 Philips Nv Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
GB2096498B (en) * 1980-06-02 1983-10-26 Tdk Electronics Co Ltd Apparatus for mounting chip type circuit elements
US4503606A (en) * 1980-12-26 1985-03-12 Citizen Watch Company Limited Automatic assembling machine
US4458412A (en) * 1981-05-06 1984-07-10 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
NL8201593A (nl) * 1982-04-16 1983-11-16 Philips Nv Inrichting voor het overbrengen van een elektrisch of elektronisch onderdeel naar een montagepaneel.
JPS5928399A (ja) * 1982-08-09 1984-02-15 三洋電機株式会社 電子部品装着装置

Also Published As

Publication number Publication date
GB2156710A (en) 1985-10-16
KR920005074B1 (ko) 1992-06-26
FR2562751A1 (fr) 1985-10-11
JPS60229396A (ja) 1985-11-14
GB8508413D0 (en) 1985-05-09
GB2156710B (en) 1987-08-05
CA1246625A (en) 1988-12-13
BE902032A (fr) 1985-07-16
KR850007364A (ko) 1985-12-02
DE3511132A1 (de) 1985-10-17

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Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
CA Change of address
TP Transmission of property
CA Change of address
TP Transmission of property
ST Notification of lapse