FR2497054A1 - Materiau de blindage contre les parasites electromagnetiques - Google Patents
Materiau de blindage contre les parasites electromagnetiques Download PDFInfo
- Publication number
- FR2497054A1 FR2497054A1 FR8122369A FR8122369A FR2497054A1 FR 2497054 A1 FR2497054 A1 FR 2497054A1 FR 8122369 A FR8122369 A FR 8122369A FR 8122369 A FR8122369 A FR 8122369A FR 2497054 A1 FR2497054 A1 FR 2497054A1
- Authority
- FR
- France
- Prior art keywords
- particles
- material according
- layer
- silver
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 30
- 244000045947 parasite Species 0.000 title description 2
- 239000002245 particle Substances 0.000 claims abstract description 38
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052709 silver Inorganic materials 0.000 claims abstract description 24
- 239000004332 silver Substances 0.000 claims abstract description 24
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 11
- 239000011701 zinc Substances 0.000 claims abstract description 11
- 239000011159 matrix material Substances 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 4
- 238000004078 waterproofing Methods 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 230000003993 interaction Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 25
- 229910052782 aluminium Inorganic materials 0.000 abstract description 14
- 230000001788 irregular Effects 0.000 abstract description 3
- 239000000843 powder Substances 0.000 description 25
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 21
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- 239000011787 zinc oxide Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 3
- -1 fluoride ions Chemical class 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920006122 polyamide resin Polymers 0.000 description 3
- 229940079864 sodium stannate Drugs 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 239000000908 ammonium hydroxide Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000003721 gunpowder Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- ZNHPPXDUJKXBNM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)hexane Chemical compound CC(C)(C)OOC(C)CCC(C)OOC(C)(C)C ZNHPPXDUJKXBNM-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 241001676573 Minium Species 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920005560 fluorosilicone rubber Polymers 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000008823 permeabilization Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- BSWGGJHLVUUXTL-UHFFFAOYSA-N silver zinc Chemical compound [Zn].[Ag] BSWGGJHLVUUXTL-UHFFFAOYSA-N 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 125000005402 stannate group Chemical group 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12181—Composite powder [e.g., coated, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/219,069 US4434541A (en) | 1980-12-22 | 1980-12-22 | Electromagnetic shielding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2497054A1 true FR2497054A1 (fr) | 1982-06-25 |
| FR2497054B1 FR2497054B1 (en, 2012) | 1985-01-04 |
Family
ID=22817726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8122369A Granted FR2497054A1 (fr) | 1980-12-22 | 1981-11-30 | Materiau de blindage contre les parasites electromagnetiques |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4434541A (en, 2012) |
| JP (1) | JPS57154897A (en, 2012) |
| DE (1) | DE3147931A1 (en, 2012) |
| FR (1) | FR2497054A1 (en, 2012) |
| GB (1) | GB2089817B (en, 2012) |
| IL (1) | IL64429A (en, 2012) |
| IT (1) | IT8183503A0 (en, 2012) |
| SE (1) | SE452088B (en, 2012) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5920917A (ja) * | 1982-07-26 | 1984-02-02 | 三菱電線工業株式会社 | インタフエイス用バスケ−ブル装置 |
| FR2537786B1 (fr) * | 1982-12-14 | 1990-01-12 | Caplatex Sa | Joint electriquement conducteur, notamment pour blindages electromagnetiques et procede de fabrication d'un tel joint |
| US5786785A (en) * | 1984-05-21 | 1998-07-28 | Spectro Dynamics Systems, L.P. | Electromagnetic radiation absorptive coating composition containing metal coated microspheres |
| US4624798A (en) * | 1984-05-21 | 1986-11-25 | Carolina Solvents, Inc. | Electrically conductive magnetic microballoons and compositions incorporating same |
| US4698197A (en) * | 1985-02-12 | 1987-10-06 | The United States Of America As Represented By The United States Department Of Energy | Magnetic shielding |
| SE446924B (sv) * | 1985-02-22 | 1986-10-13 | Devex Sa | Sett vid utforande av en for elektromagnetisk stralning vesentligen opak skerm |
| JPS61265890A (ja) * | 1985-05-20 | 1986-11-25 | 日本シイエムケイ株式会社 | プリント配線板とシ−ルド用トナ− |
| US4678716A (en) * | 1985-08-06 | 1987-07-07 | Chomerics, Inc. | Electromagnetic shielding |
| JPS6257298A (ja) * | 1985-09-06 | 1987-03-12 | リンテック株式会社 | 透光性電磁波シールド用材料 |
| JPS6257297A (ja) * | 1985-09-06 | 1987-03-12 | エフエスケ−株式会社 | 透光性電磁波シ−ルド材 |
| US4900877A (en) * | 1987-01-13 | 1990-02-13 | Raychem Corporation | Shielding and sealing gaskets |
| US4932673A (en) * | 1988-02-01 | 1990-06-12 | Hughes Aircraft Company | Emi suppression gasket for millimeter waveguides |
| JPH01167095U (en, 2012) * | 1988-05-16 | 1989-11-22 | ||
| EP0591126A4 (en) * | 1988-08-29 | 1995-09-06 | Marian J Ostolski | Process for making noble metal coated metallic particles, and resulting conductive materials |
| US5882802A (en) * | 1988-08-29 | 1999-03-16 | Ostolski; Marian J. | Noble metal coated, seeded bimetallic non-noble metal powders |
| US4968854A (en) * | 1988-11-10 | 1990-11-06 | Vanguard Products Corporation | Dual elastomer gasket shield for electronic equipment |
| DE3838652A1 (de) * | 1988-11-15 | 1990-05-17 | Bayer Ag | Verfahren zur antistatischen ausruestung von schmelzkleber-schichten |
| US5070216A (en) * | 1990-04-27 | 1991-12-03 | Chomerics, Inc. | Emi shielding gasket |
| US5399432A (en) * | 1990-06-08 | 1995-03-21 | Potters Industries, Inc. | Galvanically compatible conductive filler and methods of making same |
| US5175056A (en) * | 1990-06-08 | 1992-12-29 | Potters Industries, Inc. | Galvanically compatible conductive filler |
| US5120087A (en) * | 1990-12-07 | 1992-06-09 | The Eastern Company | Bulkhead door locking |
| IT1259568B (it) * | 1992-04-30 | 1996-03-20 | Bertoldo & C Srl | Giunto di collegamento per tubi metallici |
| US5791654A (en) * | 1992-08-19 | 1998-08-11 | The Boeing Company | Corrosion resistant gasket in combination with aircraft antenna |
| US5522602A (en) * | 1992-11-25 | 1996-06-04 | Amesbury Group Inc. | EMI-shielding gasket |
| WO1995000327A1 (en) * | 1993-06-17 | 1995-01-05 | Chomerics, Inc. | Corrosion resistant emi shielding material |
| CA2129073C (en) | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
| US6303180B1 (en) | 1993-09-10 | 2001-10-16 | Parker-Hannifin Corporation | Form-in-place EMI gaskets |
| AU2425495A (en) * | 1994-04-26 | 1995-11-16 | Boeing Company, The | Corrosion resistant gasket for aircraft |
| US5641438A (en) * | 1995-01-24 | 1997-06-24 | Bunyan; Michael H. | Method for forming an EMI shielding gasket |
| US5910524A (en) * | 1995-01-20 | 1999-06-08 | Parker-Hannifin Corporation | Corrosion-resistant, form-in-place EMI shielding gasket |
| US6635354B2 (en) | 1995-01-20 | 2003-10-21 | Parker-Hannifin Corporation | Form-in place EMI gaskets |
| US5674606A (en) * | 1995-04-06 | 1997-10-07 | Parker-Hannifin Corporation | Electrically conductive flame retardant materials and methods of manufacture |
| US6294729B1 (en) | 1997-10-31 | 2001-09-25 | Laird Technologies | Clad polymer EMI shield |
| US6646199B2 (en) | 1999-10-20 | 2003-11-11 | Chemque, Inc. | Polymeric foam gaskets and seals |
| US6625025B1 (en) * | 2000-07-10 | 2003-09-23 | Nortel Networks Limited | Component cooling in electronic devices |
| US20040227688A1 (en) * | 2001-02-15 | 2004-11-18 | Integral Technologies, Inc. | Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles |
| US7079086B2 (en) * | 2001-02-15 | 2006-07-18 | Integral Technologies, Inc. | Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials |
| WO2003030610A1 (en) | 2001-10-02 | 2003-04-10 | Parker Hannifin Corporation | Emi shielding gasket construction |
| US20030170543A1 (en) * | 2002-02-26 | 2003-09-11 | Alltrista Zinc Products Company, L.P. | Zinc fibers, zinc anodes and methods of making zinc fibers |
| WO2004113594A2 (en) * | 2003-06-16 | 2004-12-29 | Integral Technologies, Inc. | Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles |
| WO2005002315A2 (en) * | 2003-07-02 | 2005-01-13 | Integral Technologies, Inc. | Low cost electromagnetic energy absorbers manufactured from conductive loaded resin-based materials |
| JP4653406B2 (ja) * | 2004-03-10 | 2011-03-16 | 株式会社アルバック | 水崩壊性Ａｌ複合材料、水崩壊性Ａｌ溶射膜、及び水崩壊性Ａｌ粉の製造方法、並びに成膜室用構成部材及び成膜材料の回収方法 |
| DE102005016340B3 (de) * | 2005-04-09 | 2006-08-10 | Adc Gmbh | Vorrichtung und Verfahren zur universellen Kabeldurchführung |
| CN104321464A (zh) * | 2011-12-15 | 2015-01-28 | 汉高知识产权控股有限责任公司 | 镀银铜的暴露铜的选择性涂覆 |
| US10347961B2 (en) * | 2016-10-26 | 2019-07-09 | Raytheon Company | Radio frequency interconnect systems and methods |
| US11043727B2 (en) | 2019-01-15 | 2021-06-22 | Raytheon Company | Substrate integrated waveguide monopulse and antenna system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3140342A (en) * | 1963-07-05 | 1964-07-07 | Chomerics Inc | Electrical shielding and sealing gasket |
| DE2050581A1 (de) * | 1969-10-17 | 1971-04-29 | Raychem Corp | Elektroisoliermatenal |
| US3583930A (en) * | 1968-04-16 | 1971-06-08 | Chomerics Inc | Plastics made conductive with coarse metal fillers |
| FR2396388A1 (fr) * | 1977-06-30 | 1979-01-26 | Chomerics Inc | Garniture etanche resistant a la corrosion pour blindage electromagnetique |
| FR2454450A1 (fr) * | 1979-04-16 | 1980-11-14 | Dart Ind Inc | Composition de resine thermoplastique renforcee par des fibres et produits ou articles moules en comportant application |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3194860A (en) * | 1962-10-02 | 1965-07-13 | John E Ehrreich | Manufacture of reinforced conductive plastic gaskets |
| US3202488A (en) | 1964-03-04 | 1965-08-24 | Chomerics Inc | Silver-plated copper powder |
| US3476530A (en) | 1966-06-10 | 1969-11-04 | Chomerics Inc | Iron based conductive filler for plastics |
| JPS504328A (en, 2012) * | 1973-04-26 | 1975-01-17 | ||
| JPS50158626A (en, 2012) * | 1974-06-14 | 1975-12-22 | ||
| JPS51135938A (en) * | 1975-05-21 | 1976-11-25 | Seiko Epson Corp | Anisotropic electroconductive adhesive |
| JPS5833732B2 (ja) * | 1978-09-12 | 1983-07-21 | ロ−ム株式会社 | Ｆｍステレオ受信機用妨害パルス抑圧装置 |
-
1980
- 1980-12-22 US US06/219,069 patent/US4434541A/en not_active Expired - Lifetime
-
1981
- 1981-11-30 FR FR8122369A patent/FR2497054A1/fr active Granted
- 1981-11-30 IT IT8183503A patent/IT8183503A0/it unknown
- 1981-12-01 JP JP56191892A patent/JPS57154897A/ja active Granted
- 1981-12-01 IL IL64429A patent/IL64429A/xx not_active IP Right Cessation
- 1981-12-01 GB GB8136146A patent/GB2089817B/en not_active Expired
- 1981-12-01 SE SE8107157A patent/SE452088B/sv not_active IP Right Cessation
- 1981-12-03 DE DE19813147931 patent/DE3147931A1/de active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3140342A (en) * | 1963-07-05 | 1964-07-07 | Chomerics Inc | Electrical shielding and sealing gasket |
| US3583930A (en) * | 1968-04-16 | 1971-06-08 | Chomerics Inc | Plastics made conductive with coarse metal fillers |
| DE2050581A1 (de) * | 1969-10-17 | 1971-04-29 | Raychem Corp | Elektroisoliermatenal |
| FR2396388A1 (fr) * | 1977-06-30 | 1979-01-26 | Chomerics Inc | Garniture etanche resistant a la corrosion pour blindage electromagnetique |
| FR2454450A1 (fr) * | 1979-04-16 | 1980-11-14 | Dart Ind Inc | Composition de resine thermoplastique renforcee par des fibres et produits ou articles moules en comportant application |
Non-Patent Citations (1)
| Title |
|---|
| PRODUCT ENGINEERING, vol. 50, no. 12, décembre 1979, pages 43-46, New York, USA * |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2089817A (en) | 1982-06-30 |
| IT8183503A0 (it) | 1981-11-30 |
| DE3147931C2 (en, 2012) | 1990-08-23 |
| IL64429A0 (en) | 1982-03-31 |
| JPS57154897A (en) | 1982-09-24 |
| GB2089817B (en) | 1984-09-19 |
| US4434541A (en) | 1984-03-06 |
| DE3147931A1 (de) | 1982-06-24 |
| IL64429A (en) | 1987-11-30 |
| SE452088B (sv) | 1987-11-09 |
| FR2497054B1 (en, 2012) | 1985-01-04 |
| JPH0239120B2 (en, 2012) | 1990-09-04 |
| SE8107157L (sv) | 1982-06-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |