FR2485866B1 - Substrat de cablage mince - Google Patents

Substrat de cablage mince

Info

Publication number
FR2485866B1
FR2485866B1 FR8112887A FR8112887A FR2485866B1 FR 2485866 B1 FR2485866 B1 FR 2485866B1 FR 8112887 A FR8112887 A FR 8112887A FR 8112887 A FR8112887 A FR 8112887A FR 2485866 B1 FR2485866 B1 FR 2485866B1
Authority
FR
France
Prior art keywords
wiring substrate
thin wiring
thin
substrate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8112887A
Other languages
English (en)
Other versions
FR2485866A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9012980A external-priority patent/JPS5715447A/ja
Priority claimed from JP9012880A external-priority patent/JPS5715492A/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of FR2485866A1 publication Critical patent/FR2485866A1/fr
Application granted granted Critical
Publication of FR2485866B1 publication Critical patent/FR2485866B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
FR8112887A 1980-06-30 1981-06-30 Substrat de cablage mince Expired FR2485866B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9012980A JPS5715447A (en) 1980-06-30 1980-06-30 Production of substrate for carrying components
JP9012880A JPS5715492A (en) 1980-06-30 1980-06-30 Wiring board structure

Publications (2)

Publication Number Publication Date
FR2485866A1 FR2485866A1 (fr) 1981-12-31
FR2485866B1 true FR2485866B1 (fr) 1985-08-02

Family

ID=26431633

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8112887A Expired FR2485866B1 (fr) 1980-06-30 1981-06-30 Substrat de cablage mince

Country Status (3)

Country Link
US (1) US4544989A (fr)
DE (1) DE3125518C2 (fr)
FR (1) FR2485866B1 (fr)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4514042A (en) * 1981-09-30 1985-04-30 Sharp Kabushiki Kaisha Thin structure of display panel
FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
DE3409146A1 (de) * 1984-03-13 1985-09-19 Siemens AG, 1000 Berlin und 8000 München Optoelektronisches mudul
US4859633A (en) * 1985-01-31 1989-08-22 Texas Instruments Incorporated Process for fabricating monolithic microwave diodes
US4673958A (en) * 1985-01-31 1987-06-16 Texas Instruments Incorporated Monolithic microwave diodes
US4647959A (en) * 1985-05-20 1987-03-03 Tektronix, Inc. Integrated circuit package, and method of forming an integrated circuit package
US4835598A (en) * 1985-06-13 1989-05-30 Matsushita Electric Works, Ltd. Wiring board
US4692839A (en) * 1985-06-24 1987-09-08 Digital Equipment Corporation Multiple chip interconnection system and package
GB2199182A (en) * 1986-12-18 1988-06-29 Marconi Electronic Devices Multilayer circuit arrangement
US4755866A (en) * 1987-02-27 1988-07-05 United Technologies Corporation Electronic circuit module
US4855871A (en) * 1987-03-05 1989-08-08 Optical Materials, Inc. Thin film semiconductor interconnect module
US4837407A (en) * 1987-03-30 1989-06-06 Aisin Seiki Company, Ltd. Plastic electrically insulating substrates for wiring circuit boards and a method of manufacturing thereof
JP2579937B2 (ja) * 1987-04-15 1997-02-12 株式会社東芝 電子回路装置およびその製造方法
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
US5208450A (en) * 1988-04-20 1993-05-04 Matsushita Electric Industrial Co., Ltd. IC card and a method for the manufacture of the same
DE3910699A1 (de) * 1989-04-03 1990-10-04 Omt Oberflaechen Materialtech Leiterplatte fuer integrierte schaltungen
US5135890A (en) * 1989-06-16 1992-08-04 General Electric Company Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
US5103290A (en) * 1989-06-16 1992-04-07 General Electric Company Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
US5166773A (en) * 1989-07-03 1992-11-24 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5209390A (en) * 1989-07-03 1993-05-11 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
WO1991007777A1 (fr) * 1989-11-22 1991-05-30 Tactical Fabs, Inc. Boitier multipuce a haute densite
US5182632A (en) * 1989-11-22 1993-01-26 Tactical Fabs, Inc. High density multichip package with interconnect structure and heatsink
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
US5120572A (en) * 1990-10-30 1992-06-09 Microelectronics And Computer Technology Corporation Method of fabricating electrical components in high density substrates
US5254493A (en) * 1990-10-30 1993-10-19 Microelectronics And Computer Technology Corporation Method of fabricating integrated resistors in high density substrates
US5106308A (en) * 1991-03-04 1992-04-21 Allied-Signal Inc. Planar contact grid array connector
EP0598914B1 (fr) * 1992-06-05 2000-10-11 Mitsui Chemicals, Inc. Plaquette de circuit imprime en relief, boitier de circuit electronique utilisant cette plaquette et procede de realisation de cette plaquette
US6274391B1 (en) * 1992-10-26 2001-08-14 Texas Instruments Incorporated HDI land grid array packaged device having electrical and optical interconnects
US5305186A (en) * 1993-01-27 1994-04-19 International Business Machines Corporation Power carrier with selective thermal performance
US5418687A (en) * 1994-02-01 1995-05-23 Hewlett-Packard Company Wafer scale multi-chip module
JP2842378B2 (ja) * 1996-05-31 1999-01-06 日本電気株式会社 電子回路基板の高密度実装構造
DE19642488A1 (de) * 1996-10-15 1998-04-16 Bernd Klose Verfahren zur Kontaktierung von Mikrochips und zur Herstellung von Mehrlagen-Dünnschichtleiterplatten, insbesondere für superflache Multichip-Modul- und Chipcard-Anwendungen
TW463336B (en) 1997-11-19 2001-11-11 Matsushita Electric Ind Co Ltd Method for planarizing circuit board and method for manufacturing semiconductor device
KR20000032827A (ko) * 1998-11-18 2000-06-15 구자홍 다층 회로기판의 접점부 형성방법
US6154366A (en) * 1999-11-23 2000-11-28 Intel Corporation Structures and processes for fabricating moisture resistant chip-on-flex packages
US6586682B2 (en) 2000-02-23 2003-07-01 Kulicke & Soffa Holdings, Inc. Printed wiring board with controlled line impedance
US6480395B1 (en) 2000-05-25 2002-11-12 Hewlett-Packard Company Device and method for interstitial components in a printed circuit board
JP2002134875A (ja) * 2000-10-26 2002-05-10 Murata Mfg Co Ltd モジュール部品、モジュール部品の実装構造、および電子装置
JP2003347741A (ja) * 2002-05-30 2003-12-05 Taiyo Yuden Co Ltd 複合多層基板およびそれを用いたモジュール
WO2005002303A1 (fr) * 2003-06-30 2005-01-06 Ibiden Co.,Ltd. Carte imprimee
DE10358422B3 (de) * 2003-08-26 2005-04-28 Muehlbauer Ag Verfahren zur Herstellung von Modulbrücken
DE102004055616B4 (de) * 2004-11-18 2007-02-01 Mühlbauer Ag Verfahren zum Verbinden einer Modulbrücke mit einem Substrat und mehrschichtiger Transponder
DE102005032489B3 (de) * 2005-07-04 2006-11-16 Schweizer Electronic Ag Leiterplatten-Mehrschichtaufbau mit integriertem elektrischem Bauteil und Herstellungsverfahren
KR100726240B1 (ko) * 2005-10-04 2007-06-11 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조방법
KR100987688B1 (ko) * 2005-10-14 2010-10-13 가부시키가이샤후지쿠라 프린트 배선 기판 및 프린트 배선 기판의 제조 방법
DE102008026765A1 (de) * 2008-04-16 2009-10-22 Rohde & Schwarz Gmbh & Co. Kg Mikrowellen-Baugruppe
TWI442526B (zh) * 2010-09-17 2014-06-21 Subtron Technology Co Ltd 導熱基板及其製作方法
US10433414B2 (en) * 2010-12-24 2019-10-01 Rayben Technologies (HK) Limited Manufacturing method of printing circuit board with micro-radiators
DE102012013920A1 (de) 2011-07-14 2013-01-17 Hotoprint Elektronik GmbH & Co. KG Identifizierbare mehrschichtige Leiterplatte sowie Herstellungsverfahren dazu
TWI446501B (zh) * 2012-01-20 2014-07-21 矽品精密工業股份有限公司 承載板、半導體封裝件及其製法
KR102671975B1 (ko) * 2019-08-29 2024-06-05 삼성전기주식회사 전자부품 내장기판

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1005943A (en) * 1962-10-18 1965-09-29 Intellux Inc Multilayer electrical circuit assemblies and processes for producing such assemblies
US3249818A (en) * 1963-02-13 1966-05-03 Gen Electric D. c. power distribution arrangement for high frequency applications
US3383564A (en) * 1965-10-22 1968-05-14 Sanders Associates Inc Multilayer circuit
US3546775A (en) * 1965-10-22 1970-12-15 Sanders Associates Inc Method of making multi-layer circuit
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3365620A (en) * 1966-06-13 1968-01-23 Ibm Circuit package with improved modular assembly and cooling apparatus
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
FR1559481A (fr) * 1968-03-19 1969-03-07
US3570115A (en) * 1968-05-06 1971-03-16 Honeywell Inc Method for mounting electronic chips
GB1276095A (en) * 1968-09-05 1972-06-01 Secr Defence Microcircuits and processes for their manufacture
DE2156525A1 (de) * 1971-11-13 1973-05-17 Siemens Ag Traegerplatte fuer die halterung und stromversorgung von bauelementen elektronischer steuer- und regelanlagen
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
GB1386344A (en) * 1972-02-21 1975-03-05 Hochvakuum Dresden Veb Manufacture of multiple laminated conductor boards
US3936866A (en) * 1974-06-14 1976-02-03 Northrop Corporation Heat conductive mounting and connection of semiconductor chips in micro-circuitry on a substrate
US4420364A (en) * 1976-11-02 1983-12-13 Sharp Kabushiki Kaisha High-insulation multi-layer device formed on a metal substrate
JPS5469394A (en) * 1977-11-14 1979-06-04 Fujitsu Ltd Semiconductor device
US4240098A (en) * 1978-09-28 1980-12-16 Exxon Research & Engineering Co. Semiconductor optoelectronic device package

Also Published As

Publication number Publication date
DE3125518A1 (de) 1982-04-15
FR2485866A1 (fr) 1981-12-31
US4544989A (en) 1985-10-01
DE3125518C2 (de) 1984-04-26

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