FR2454672A1 - Memoire fixe programmable par laser - Google Patents
Memoire fixe programmable par laserInfo
- Publication number
- FR2454672A1 FR2454672A1 FR8008376A FR8008376A FR2454672A1 FR 2454672 A1 FR2454672 A1 FR 2454672A1 FR 8008376 A FR8008376 A FR 8008376A FR 8008376 A FR8008376 A FR 8008376A FR 2454672 A1 FR2454672 A1 FR 2454672A1
- Authority
- FR
- France
- Prior art keywords
- memory
- laser
- fixed memory
- memory programmable
- memory transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
- H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/08—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements
- G11C17/10—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM
- G11C17/12—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM using field-effect devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
Abstract
UN TRANSISTOR DE MEMOIRE ETANT PLACE A CHAQUE INTERSECTION DE LIGNES D'ADRESSES ET DE MOTS, CHAQUE TRANSISTOR DE MEMOIRE REPRESENTE UN EMPLACEMENT DE BIT ET COMPREND UNE LIAISON CONDUCTRICE, POUVANT ETRE ROMPUE, MONTEE EN SERIE ET PLACEE SUR LE DESSUS D'UNE ZONE D'OXYDE ENTOURANT LES TRANSISTORS DE MEMOIRE. LA MEMOIRE EST PROGRAMMEE A VOLONTE APRES LA FABRICATION DES CIRCUITS, AU COURS DE L'OPERATION DE TRI DES GALETTES SUR MATRICES, EN SECTIONNANT DES LIAISONS CHOISIES A L'AIDE D'UN FAISCEAU LASER. LA MEMOIRE COMPREND AUSSI UN CIRCUIT EXTERIEUR DE SIMULATION DES PROGRAMMES QUI PERMET DE FORMER EXTERIEUREMENT UN MOT NUMERIQUE PARTICULIER POUR SIMULER LE CONTENU DE LA MEMOIRE AVANT LA PROGRAMMATION.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/031,562 US4238839A (en) | 1979-04-19 | 1979-04-19 | Laser programmable read only memory |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2454672A1 true FR2454672A1 (fr) | 1980-11-14 |
FR2454672B1 FR2454672B1 (fr) | 1986-05-30 |
Family
ID=21860143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8008376A Expired FR2454672B1 (fr) | 1979-04-19 | 1980-04-15 | Memoire fixe programmable par laser |
Country Status (5)
Country | Link |
---|---|
US (1) | US4238839A (fr) |
JP (1) | JPS55160464A (fr) |
DE (1) | DE3015096A1 (fr) |
FR (1) | FR2454672B1 (fr) |
GB (1) | GB2047963B (fr) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4335371A (en) * | 1979-04-09 | 1982-06-15 | National Semiconductor Corporation | Digital error correcting trimming in an analog to digital converter |
US4476478A (en) * | 1980-04-24 | 1984-10-09 | Tokyo Shibaura Denki Kabushiki Kaisha | Semiconductor read only memory and method of making the same |
US4396998A (en) * | 1980-08-27 | 1983-08-02 | Mobay Chemical Corporation | Thermally reprogrammable memory array and a thermally reprogrammable memory cell therefor |
JPS5856355A (ja) * | 1981-09-30 | 1983-04-04 | Hitachi Ltd | 半導体集積回路装置 |
DE3276981D1 (en) * | 1981-10-09 | 1987-09-17 | Toshiba Kk | Semiconductor device having a fuse element |
JPS58169940A (ja) * | 1982-03-30 | 1983-10-06 | Fujitsu Ltd | 半導体装置の製造方法 |
US4578751A (en) * | 1982-06-25 | 1986-03-25 | At&T Technologies, Inc. | System for simultaneously programming a number of EPROMs |
US4583201A (en) * | 1983-09-08 | 1986-04-15 | International Business Machines Corporation | Resistor personalized memory device using a resistive gate fet |
US5008729A (en) * | 1984-06-18 | 1991-04-16 | Texas Instruments Incorporated | Laser programming of semiconductor devices using diode make-link structure |
IL86162A (en) * | 1988-04-25 | 1991-11-21 | Zvi Orbach | Customizable semiconductor devices |
US5545904A (en) * | 1986-01-17 | 1996-08-13 | Quick Technologies Ltd. | Personalizable gate array devices |
US5679967A (en) * | 1985-01-20 | 1997-10-21 | Chip Express (Israel) Ltd. | Customizable three metal layer gate array devices |
US4924287A (en) * | 1985-01-20 | 1990-05-08 | Avner Pdahtzur | Personalizable CMOS gate array device and technique |
JPS62139198A (ja) * | 1985-12-11 | 1987-06-22 | Mitsubishi Electric Corp | 半導体記憶装置 |
IL78730A (en) * | 1986-05-08 | 1990-03-19 | Avner Pdahtzur | Protective optical coating and method for use thereof |
US5367208A (en) * | 1986-09-19 | 1994-11-22 | Actel Corporation | Reconfigurable programmable interconnect architecture |
US5329152A (en) * | 1986-11-26 | 1994-07-12 | Quick Technologies Ltd. | Ablative etch resistant coating for laser personalization of integrated circuits |
US4760249A (en) * | 1986-12-22 | 1988-07-26 | Motorola, Inc. | Logic array having multiple optical logic inputs |
IL82113A (en) * | 1987-04-05 | 1992-08-18 | Zvi Orbach | Fabrication of customized integrated circuits |
GB2206730A (en) * | 1987-05-19 | 1989-01-11 | Gazelle Microcircuits Inc | Semiconductor circuit device parameter optimization |
US4872140A (en) * | 1987-05-19 | 1989-10-03 | Gazelle Microcircuits, Inc. | Laser programmable memory array |
US5281553A (en) * | 1987-07-02 | 1994-01-25 | Bull, S.A. | Method for controlling the state of conduction of an MOS transistor of an integrated circuit |
JPH0691223B2 (ja) * | 1987-07-06 | 1994-11-14 | 三菱電機株式会社 | Rom装置及びその形成方法 |
DE3731621A1 (de) * | 1987-09-19 | 1989-03-30 | Texas Instruments Deutschland | Verfahren zum herstellen einer elektrisch programmierbaren integrierten schaltung |
EP0405849A3 (en) * | 1989-06-30 | 1991-05-02 | American Telephone And Telegraph Company | Severable conductive path in an integrated-circuit device |
US5614756A (en) * | 1990-04-12 | 1997-03-25 | Actel Corporation | Metal-to-metal antifuse with conductive |
US5780323A (en) * | 1990-04-12 | 1998-07-14 | Actel Corporation | Fabrication method for metal-to-metal antifuses incorporating a tungsten via plug |
US5166556A (en) * | 1991-01-22 | 1992-11-24 | Myson Technology, Inc. | Programmable antifuse structure, process, logic cell and architecture for programmable integrated circuits |
US5374590A (en) * | 1993-04-28 | 1994-12-20 | International Business Machines Corporation | Fabrication and laser deletion of microfuses |
US5485031A (en) * | 1993-11-22 | 1996-01-16 | Actel Corporation | Antifuse structure suitable for VLSI application |
US5834824A (en) * | 1994-02-08 | 1998-11-10 | Prolinx Labs Corporation | Use of conductive particles in a nonconductive body as an integrated circuit antifuse |
US5572409A (en) * | 1994-02-08 | 1996-11-05 | Prolinx Labs Corporation | Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board |
US5726482A (en) * | 1994-02-08 | 1998-03-10 | Prolinx Labs Corporation | Device-under-test card for a burn-in board |
US5813881A (en) * | 1994-02-08 | 1998-09-29 | Prolinx Labs Corporation | Programmable cable and cable adapter using fuses and antifuses |
US5537108A (en) * | 1994-02-08 | 1996-07-16 | Prolinx Labs Corporation | Method and structure for programming fuses |
US5917229A (en) * | 1994-02-08 | 1999-06-29 | Prolinx Labs Corporation | Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect |
US5808351A (en) * | 1994-02-08 | 1998-09-15 | Prolinx Labs Corporation | Programmable/reprogramable structure using fuses and antifuses |
US5606242A (en) * | 1994-10-04 | 1997-02-25 | Duracell, Inc. | Smart battery algorithm for reporting battery parameters to an external device |
US5633573A (en) * | 1994-11-10 | 1997-05-27 | Duracell, Inc. | Battery pack having a processor controlled battery operating system |
US5962815A (en) * | 1995-01-18 | 1999-10-05 | Prolinx Labs Corporation | Antifuse interconnect between two conducting layers of a printed circuit board |
US5906042A (en) * | 1995-10-04 | 1999-05-25 | Prolinx Labs Corporation | Method and structure to interconnect traces of two conductive layers in a printed circuit board |
US5767575A (en) * | 1995-10-17 | 1998-06-16 | Prolinx Labs Corporation | Ball grid array structure and method for packaging an integrated circuit chip |
EP0780851B1 (fr) * | 1995-12-20 | 2003-06-11 | International Business Machines Corporation | Circuit intégré semiconducteur avec des structures de résistance ajustables électriquement |
US5872338A (en) * | 1996-04-10 | 1999-02-16 | Prolinx Labs Corporation | Multilayer board having insulating isolation rings |
AU3803097A (en) * | 1996-07-17 | 1998-02-09 | Duracell Inc. | Battery operating system |
US5909049A (en) * | 1997-02-11 | 1999-06-01 | Actel Corporation | Antifuse programmed PROM cell |
US6025695A (en) * | 1997-07-09 | 2000-02-15 | Friel; Daniel D. | Battery operating system |
US9092595B2 (en) | 1997-10-08 | 2015-07-28 | Pact Xpp Technologies Ag | Multiprocessor having associated RAM units |
US6034427A (en) * | 1998-01-28 | 2000-03-07 | Prolinx Labs Corporation | Ball grid array structure and method for packaging an integrated circuit chip |
US6346427B1 (en) | 1999-08-18 | 2002-02-12 | Utmc Microelectronic Systems Inc. | Parameter adjustment in a MOS integrated circuit |
EP1104935A1 (fr) * | 1999-12-01 | 2001-06-06 | STMicroelectronics S.r.l. | Appareil intergré comportant des elements de l' ajustage |
US7026692B1 (en) * | 2003-11-12 | 2006-04-11 | Xilinx, Inc. | Low voltage non-volatile memory transistor |
JP4685388B2 (ja) * | 2004-09-06 | 2011-05-18 | Okiセミコンダクタ株式会社 | 半導体装置 |
US7888771B1 (en) | 2007-05-02 | 2011-02-15 | Xilinx, Inc. | E-fuse with scalable filament link |
US7834659B1 (en) | 2008-03-05 | 2010-11-16 | Xilinx, Inc. | Multi-step programming of E fuse cells |
US7710813B1 (en) | 2008-03-05 | 2010-05-04 | Xilinx, Inc. | Electronic fuse array |
US7724600B1 (en) | 2008-03-05 | 2010-05-25 | Xilinx, Inc. | Electronic fuse programming current generator with on-chip reference |
US7923811B1 (en) | 2008-03-06 | 2011-04-12 | Xilinx, Inc. | Electronic fuse cell with enhanced thermal gradient |
US8564023B2 (en) * | 2008-03-06 | 2013-10-22 | Xilinx, Inc. | Integrated circuit with MOSFET fuse element |
US20150317255A1 (en) * | 2011-02-15 | 2015-11-05 | Chengdu Haicun Ip Technology Llc | Secure Printed Memory |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2019864A1 (fr) * | 1968-10-03 | 1970-07-10 | North American Rockwell | |
US3529299A (en) * | 1966-10-21 | 1970-09-15 | Texas Instruments Inc | Programmable high-speed read-only memory devices |
US3611319A (en) * | 1969-03-06 | 1971-10-05 | Teledyne Inc | Electrically alterable read only memory |
FR2168368A1 (fr) * | 1972-01-19 | 1973-08-31 | Intel Corp | |
FR2289999A2 (fr) * | 1974-10-31 | 1976-05-28 | Radiotechnique Compelec | Memoire morte programmable |
DE2545047B2 (de) * | 1975-10-08 | 1978-01-26 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur herstellung eines halbleiterfestwertspeichers |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3778886A (en) * | 1972-01-20 | 1973-12-18 | Signetics Corp | Semiconductor structure with fusible link and method |
US4055754A (en) * | 1975-12-22 | 1977-10-25 | Chesley Gilman D | Memory device and method of testing the same |
US4064493A (en) * | 1976-06-03 | 1977-12-20 | Motorola, Inc. | P-ROM Cell having a low current fusible programming link |
US4125880A (en) * | 1977-03-09 | 1978-11-14 | Harris Corporation | Simplified output circuit for read only memories |
-
1979
- 1979-04-19 US US06/031,562 patent/US4238839A/en not_active Expired - Lifetime
-
1980
- 1980-04-15 FR FR8008376A patent/FR2454672B1/fr not_active Expired
- 1980-04-18 JP JP5155280A patent/JPS55160464A/ja active Granted
- 1980-04-19 DE DE19803015096 patent/DE3015096A1/de active Granted
- 1980-04-21 GB GB8013049A patent/GB2047963B/en not_active Expired
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3529299A (en) * | 1966-10-21 | 1970-09-15 | Texas Instruments Inc | Programmable high-speed read-only memory devices |
FR2019864A1 (fr) * | 1968-10-03 | 1970-07-10 | North American Rockwell | |
GB1225086A (fr) * | 1968-10-03 | 1971-03-17 | ||
US3611319A (en) * | 1969-03-06 | 1971-10-05 | Teledyne Inc | Electrically alterable read only memory |
FR2168368A1 (fr) * | 1972-01-19 | 1973-08-31 | Intel Corp | |
GB1422045A (en) * | 1972-01-19 | 1976-01-21 | Intel Corp | Semiconductor read only memories |
FR2289999A2 (fr) * | 1974-10-31 | 1976-05-28 | Radiotechnique Compelec | Memoire morte programmable |
DE2545047B2 (de) * | 1975-10-08 | 1978-01-26 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur herstellung eines halbleiterfestwertspeichers |
Non-Patent Citations (1)
Title |
---|
EXBK/78 * |
Also Published As
Publication number | Publication date |
---|---|
DE3015096A1 (de) | 1980-11-06 |
DE3015096C2 (fr) | 1991-08-08 |
JPS6359261B2 (fr) | 1988-11-18 |
GB2047963A (en) | 1980-12-03 |
US4238839A (en) | 1980-12-09 |
GB2047963B (en) | 1983-11-09 |
JPS55160464A (en) | 1980-12-13 |
FR2454672B1 (fr) | 1986-05-30 |
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