FR2387568A1 - Plaquette a circuit imprime comportant au moins deux couches de cablage - Google Patents

Plaquette a circuit imprime comportant au moins deux couches de cablage

Info

Publication number
FR2387568A1
FR2387568A1 FR7809924A FR7809924A FR2387568A1 FR 2387568 A1 FR2387568 A1 FR 2387568A1 FR 7809924 A FR7809924 A FR 7809924A FR 7809924 A FR7809924 A FR 7809924A FR 2387568 A1 FR2387568 A1 FR 2387568A1
Authority
FR
France
Prior art keywords
layer
printed circuit
circuit board
wiring
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7809924A
Other languages
English (en)
French (fr)
Other versions
FR2387568B1 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2387568A1 publication Critical patent/FR2387568A1/fr
Application granted granted Critical
Publication of FR2387568B1 publication Critical patent/FR2387568B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
FR7809924A 1977-04-14 1978-04-04 Plaquette a circuit imprime comportant au moins deux couches de cablage Granted FR2387568A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772716545 DE2716545A1 (de) 1977-04-14 1977-04-14 Gedruckte schaltungsplatte mit mindestens zwei verdrahtungslagen

Publications (2)

Publication Number Publication Date
FR2387568A1 true FR2387568A1 (fr) 1978-11-10
FR2387568B1 FR2387568B1 (de) 1982-06-04

Family

ID=6006294

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7809924A Granted FR2387568A1 (fr) 1977-04-14 1978-04-04 Plaquette a circuit imprime comportant au moins deux couches de cablage

Country Status (9)

Country Link
JP (1) JPS53128765A (de)
BE (1) BE866001A (de)
CH (1) CH628195A5 (de)
DE (1) DE2716545A1 (de)
FR (1) FR2387568A1 (de)
GB (1) GB1577713A (de)
IT (1) IT1096057B (de)
NL (1) NL7803993A (de)
SE (1) SE7804192L (de)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0067231A1 (de) * 1980-12-08 1982-12-22 Sony Corporation Substrat mit mehrschichtiger verdrahtung
FR2557755A1 (fr) * 1983-12-28 1985-07-05 Nec Corp Substrat de cablage multi-couche
WO1988004877A1 (en) * 1986-12-17 1988-06-30 The Foxboro Company Multilayer circuit board fabrication process
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
EP0540104A1 (de) * 1991-10-31 1993-05-05 Koninklijke Philips Electronics N.V. Zwei- oder mehrlagige Leiterplatte, Verfahren zur Herstellung von solchen Leiterplatten und Laminat für die Herstellung von solchen Leiterplatten durch ein solches Verfahren
EP0540101A1 (de) * 1991-10-31 1993-05-05 Koninklijke Philips Electronics N.V. Zwei- oder mehrlagige Leiterplatte
EP0744884A2 (de) * 1995-05-23 1996-11-27 Hitachi Chemical Company, Ltd. Verfahren zur Herstellung einer mehrschichtigen Leiterplatte

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0062084A1 (de) * 1981-04-06 1982-10-13 Herbert Irwin Schachter Mehrschicht-Schaltkreis und Verfahren zu dessen Herstellung
JPS60137092A (ja) * 1983-12-19 1985-07-20 株式会社東芝 回路基板の製造方法
DE4135839A1 (de) * 1991-10-31 1993-05-06 Huels Troisdorf Ag, 5210 Troisdorf, De Verfahren zur herstellung einer mehrlagigen gedruckten schaltung sowie mehrlagige gedruckte schaltung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3528173A (en) * 1966-08-15 1970-09-15 Andrew S Gall Making circuit boards
DE2424002A1 (de) * 1973-05-18 1974-11-28 Hitachi Ltd Schwerentflammbare mehrschichtleiterplatte und verfahren zu deren herstellung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3528173A (en) * 1966-08-15 1970-09-15 Andrew S Gall Making circuit boards
DE2424002A1 (de) * 1973-05-18 1974-11-28 Hitachi Ltd Schwerentflammbare mehrschichtleiterplatte und verfahren zu deren herstellung

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0067231A1 (de) * 1980-12-08 1982-12-22 Sony Corporation Substrat mit mehrschichtiger verdrahtung
EP0067231A4 (de) * 1980-12-08 1985-02-28 Sony Corp Substrat mit mehrschichtiger verdrahtung.
FR2557755A1 (fr) * 1983-12-28 1985-07-05 Nec Corp Substrat de cablage multi-couche
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
WO1988004877A1 (en) * 1986-12-17 1988-06-30 The Foxboro Company Multilayer circuit board fabrication process
EP0540104A1 (de) * 1991-10-31 1993-05-05 Koninklijke Philips Electronics N.V. Zwei- oder mehrlagige Leiterplatte, Verfahren zur Herstellung von solchen Leiterplatten und Laminat für die Herstellung von solchen Leiterplatten durch ein solches Verfahren
EP0540101A1 (de) * 1991-10-31 1993-05-05 Koninklijke Philips Electronics N.V. Zwei- oder mehrlagige Leiterplatte
EP0744884A2 (de) * 1995-05-23 1996-11-27 Hitachi Chemical Company, Ltd. Verfahren zur Herstellung einer mehrschichtigen Leiterplatte
EP0744884A3 (de) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Verfahren zur Herstellung einer mehrschichtigen Leiterplatte
US5690837A (en) * 1995-05-23 1997-11-25 Hitachi Chemical Company, Ltd. Process for producing multilayer printed circuit board

Also Published As

Publication number Publication date
NL7803993A (nl) 1978-10-17
SE7804192L (sv) 1978-10-15
JPS53128765A (en) 1978-11-10
DE2716545A1 (de) 1978-10-19
IT1096057B (it) 1985-08-17
BE866001A (fr) 1978-07-31
CH628195A5 (en) 1982-02-15
FR2387568B1 (de) 1982-06-04
IT7822145A0 (it) 1978-04-10
GB1577713A (en) 1980-10-29

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