FR2388457A1 - Carte de circuit imprime a couches multiples - Google Patents
Carte de circuit imprime a couches multiplesInfo
- Publication number
- FR2388457A1 FR2388457A1 FR7811357A FR7811357A FR2388457A1 FR 2388457 A1 FR2388457 A1 FR 2388457A1 FR 7811357 A FR7811357 A FR 7811357A FR 7811357 A FR7811357 A FR 7811357A FR 2388457 A1 FR2388457 A1 FR 2388457A1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- circuit board
- layer printed
- circuits
- intended
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004048 modification Effects 0.000 abstract 2
- 238000012986 modification Methods 0.000 abstract 2
- 230000010354 integration Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
L'invention concerne une carte de circuit imprimé à couches multiples. Elle comporte des première et seconde cartes de circuit imprimé séparées par une couche isolante. Des surfaces de modification sont associées avec les surfaces de contact destinées à recevoir des composants et sont reliées à des couches intérieures par des trous métallisés. Cette disposition a pour but de faciliter les modifications de circuits après leur réalisation. L'invention s'applique notamment à des cartes destinées à recevoir des circuits d'intégration poussée.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4469477A JPS53129863A (en) | 1977-04-19 | 1977-04-19 | Multilayer printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2388457A1 true FR2388457A1 (fr) | 1978-11-17 |
FR2388457B1 FR2388457B1 (fr) | 1981-08-28 |
Family
ID=12698514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7811357A Granted FR2388457A1 (fr) | 1977-04-19 | 1978-04-18 | Carte de circuit imprime a couches multiples |
Country Status (5)
Country | Link |
---|---|
US (1) | US4150421A (fr) |
JP (1) | JPS53129863A (fr) |
DE (1) | DE2816857A1 (fr) |
FR (1) | FR2388457A1 (fr) |
GB (1) | GB1571367A (fr) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5586200A (en) * | 1978-12-25 | 1980-06-28 | Fujitsu Ltd | Back panel for mounting printed board |
US4245273A (en) * | 1979-06-29 | 1981-01-13 | International Business Machines Corporation | Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices |
DE3020196C2 (de) * | 1980-05-28 | 1982-05-06 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Mehrebenen-Leiterplatte und Verfahren zu deren Herstellung |
JPS57205179U (fr) * | 1981-06-24 | 1982-12-27 | ||
JPS582054A (ja) * | 1981-06-26 | 1983-01-07 | Fujitsu Ltd | 半導体装置 |
FR2512315A1 (fr) * | 1981-09-02 | 1983-03-04 | Rouge Francois | Ebauche de circuit electrique multicouche et procede de fabrication de circuits multicouches en comportant application |
US4489364A (en) * | 1981-12-31 | 1984-12-18 | International Business Machines Corporation | Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface |
FR2555011B1 (fr) * | 1983-11-15 | 1986-01-24 | Thomson Csf | Carte imprimee a empreintes |
US4628411A (en) * | 1984-03-12 | 1986-12-09 | International Business Machines Corporation | Apparatus for directly powering a multi-chip module from a power distribution bus |
US4598166A (en) * | 1984-08-06 | 1986-07-01 | Gte Communication Systems Corporation | High density multi-layer circuit arrangement |
JPS61131498A (ja) * | 1984-11-29 | 1986-06-19 | 富士通株式会社 | 終端回路配線構造 |
US4729061A (en) * | 1985-04-29 | 1988-03-01 | Advanced Micro Devices, Inc. | Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom |
JPS6288346A (ja) * | 1985-10-15 | 1987-04-22 | Hitachi Ltd | 多層配線基板 |
DE3605474A1 (de) * | 1986-02-20 | 1987-08-27 | Siemens Ag | Mehrlagen-leiterplatte |
US4688151A (en) * | 1986-03-10 | 1987-08-18 | International Business Machines Corporation | Multilayered interposer board for powering high current chip modules |
US4900878A (en) * | 1988-10-03 | 1990-02-13 | Hughes Aircraft Company | Circuit terminations having improved electrical and structural integrity |
US5001605A (en) * | 1988-11-30 | 1991-03-19 | Hughes Aircraft Company | Multilayer printed wiring board with single layer vias |
US5220490A (en) * | 1990-10-25 | 1993-06-15 | Microelectronics And Computer Technology Corporation | Substrate interconnect allowing personalization using spot surface links |
US5264664A (en) * | 1992-04-20 | 1993-11-23 | International Business Machines Corporation | Programmable chip to circuit board connection |
JP2819523B2 (ja) * | 1992-10-09 | 1998-10-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 印刷配線板及びその製造方法 |
US5418689A (en) * | 1993-02-01 | 1995-05-23 | International Business Machines Corporation | Printed circuit board or card for direct chip attachment and fabrication thereof |
US5450290A (en) * | 1993-02-01 | 1995-09-12 | International Business Machines Corporation | Printed circuit board with aligned connections and method of making same |
JP3037043B2 (ja) * | 1993-10-29 | 2000-04-24 | 日本電気株式会社 | プリント基板のテスト容易化回路実装方式 |
KR0157906B1 (ko) * | 1995-10-19 | 1998-12-01 | 문정환 | 더미볼을 이용한 비지에이 패키지 및 그 보수방법 |
US6010058A (en) * | 1995-10-19 | 2000-01-04 | Lg Semicon Co., Ltd. | BGA package using a dummy ball and a repairing method thereof |
US6201194B1 (en) * | 1998-12-02 | 2001-03-13 | International Business Machines Corporation | Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric |
US6535396B1 (en) * | 2000-04-28 | 2003-03-18 | Delphi Technologies, Inc. | Combination circuit board and segmented conductive bus substrate |
US7738249B2 (en) * | 2007-10-25 | 2010-06-15 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with internal cooling structure and electrical assembly utilizing same |
US8851356B1 (en) | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US8007286B1 (en) * | 2008-03-18 | 2011-08-30 | Metrospec Technology, Llc | Circuit boards interconnected by overlapping plated through holes portions |
US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
US11282767B2 (en) * | 2019-02-15 | 2022-03-22 | Advanced Semicondutor Engineering, Inc. | Semiconductor package structure and electronic device |
US11454661B2 (en) | 2020-11-05 | 2022-09-27 | Amplifier Research Corp. | Field probe |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2241946A1 (fr) * | 1973-08-24 | 1975-03-21 | Honeywell Bull Soc Ind |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3571923A (en) * | 1968-12-30 | 1971-03-23 | North American Rockwell | Method of making redundant circuit board interconnections |
GB1356632A (en) * | 1971-07-09 | 1974-06-12 | Plessey Co Ltd | Multiplayer printed-circuit boards |
US3968193A (en) * | 1971-08-27 | 1976-07-06 | International Business Machines Corporation | Firing process for forming a multilayer glass-metal module |
-
1977
- 1977-04-19 JP JP4469477A patent/JPS53129863A/ja active Granted
-
1978
- 1978-04-17 US US05/896,772 patent/US4150421A/en not_active Expired - Lifetime
- 1978-04-18 DE DE19782816857 patent/DE2816857A1/de not_active Ceased
- 1978-04-18 FR FR7811357A patent/FR2388457A1/fr active Granted
- 1978-04-19 GB GB15546/78A patent/GB1571367A/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2241946A1 (fr) * | 1973-08-24 | 1975-03-21 | Honeywell Bull Soc Ind |
Also Published As
Publication number | Publication date |
---|---|
GB1571367A (en) | 1980-07-16 |
JPS5636596B2 (fr) | 1981-08-25 |
JPS53129863A (en) | 1978-11-13 |
DE2816857A1 (de) | 1978-10-26 |
FR2388457B1 (fr) | 1981-08-28 |
US4150421A (en) | 1979-04-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |