JPS56116697A - Method of forming conductor layer on multilayer circuit board - Google Patents

Method of forming conductor layer on multilayer circuit board

Info

Publication number
JPS56116697A
JPS56116697A JP2016480A JP2016480A JPS56116697A JP S56116697 A JPS56116697 A JP S56116697A JP 2016480 A JP2016480 A JP 2016480A JP 2016480 A JP2016480 A JP 2016480A JP S56116697 A JPS56116697 A JP S56116697A
Authority
JP
Japan
Prior art keywords
circuit board
conductor layer
multilayer circuit
forming conductor
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016480A
Other languages
Japanese (ja)
Other versions
JPS6155797B2 (en
Inventor
Tatsuo Inoue
Hikari Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP2016480A priority Critical patent/JPS56116697A/en
Publication of JPS56116697A publication Critical patent/JPS56116697A/en
Publication of JPS6155797B2 publication Critical patent/JPS6155797B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2016480A 1980-02-19 1980-02-19 Method of forming conductor layer on multilayer circuit board Granted JPS56116697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016480A JPS56116697A (en) 1980-02-19 1980-02-19 Method of forming conductor layer on multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016480A JPS56116697A (en) 1980-02-19 1980-02-19 Method of forming conductor layer on multilayer circuit board

Publications (2)

Publication Number Publication Date
JPS56116697A true JPS56116697A (en) 1981-09-12
JPS6155797B2 JPS6155797B2 (en) 1986-11-29

Family

ID=12019509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016480A Granted JPS56116697A (en) 1980-02-19 1980-02-19 Method of forming conductor layer on multilayer circuit board

Country Status (1)

Country Link
JP (1) JPS56116697A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119694A (en) * 1982-01-12 1983-07-16 株式会社日立製作所 Method of producing circuit board
JPS58121698A (en) * 1982-01-12 1983-07-20 株式会社日立製作所 Multilayer printed board
JPS58128797A (en) * 1982-01-27 1983-08-01 日本電気株式会社 Method of producing multilayer ceramic board
US6428942B1 (en) 1999-10-28 2002-08-06 Fujitsu Limited Multilayer circuit structure build up method
US6869750B2 (en) 1999-10-28 2005-03-22 Fujitsu Limited Structure and method for forming a multilayered structure
US6882045B2 (en) 1999-10-28 2005-04-19 Thomas J. Massingill Multi-chip module and method for forming and method for deplating defective capacitors

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58119694A (en) * 1982-01-12 1983-07-16 株式会社日立製作所 Method of producing circuit board
JPS58121698A (en) * 1982-01-12 1983-07-20 株式会社日立製作所 Multilayer printed board
JPH0451998B2 (en) * 1982-01-12 1992-08-20 Hitachi Ltd
JPH0544199B2 (en) * 1982-01-12 1993-07-05 Hitachi Ltd
JPS58128797A (en) * 1982-01-27 1983-08-01 日本電気株式会社 Method of producing multilayer ceramic board
US6428942B1 (en) 1999-10-28 2002-08-06 Fujitsu Limited Multilayer circuit structure build up method
US6869750B2 (en) 1999-10-28 2005-03-22 Fujitsu Limited Structure and method for forming a multilayered structure
US6882045B2 (en) 1999-10-28 2005-04-19 Thomas J. Massingill Multi-chip module and method for forming and method for deplating defective capacitors

Also Published As

Publication number Publication date
JPS6155797B2 (en) 1986-11-29

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