FR2379168A1 - Transistor a effet de champ mis possedant une courte longueur de canal - Google Patents
Transistor a effet de champ mis possedant une courte longueur de canalInfo
- Publication number
- FR2379168A1 FR2379168A1 FR7802331A FR7802331A FR2379168A1 FR 2379168 A1 FR2379168 A1 FR 2379168A1 FR 7802331 A FR7802331 A FR 7802331A FR 7802331 A FR7802331 A FR 7802331A FR 2379168 A1 FR2379168 A1 FR 2379168A1
- Authority
- FR
- France
- Prior art keywords
- field effect
- effect transistor
- channel length
- short channel
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005669 field effect Effects 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
- H01L21/2652—Through-implantation
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L29/7816—Lateral DMOS transistors, i.e. LDMOS transistors
- H01L29/7824—Lateral DMOS transistors, i.e. LDMOS transistors with a substrate comprising an insulating layer, e.g. SOI-LDMOS transistors
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- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
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- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
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- H01L29/0843—Source or drain regions of field-effect devices
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
L'invention concerne un transistor à effet de champ MIS possédant une courte longueur de canal. Ce transistor à effet de champ MIS comporte une région de source 6, une région de drain 7 et une région de canal 12 disposées dans un substrat semi-conducteur 1 et recouverte partiellement par un couche isolante 2, ainsi qu'une autre région dopée 13 située dans le substrat semi-conducteur au-dessus de la région de source 6 et contenant des particules de substance dopante implantées. Application notamment aux transistors à effet de champ MIS à performances accrues de commutation et en haute fréquence
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2703877A DE2703877C2 (de) | 1977-01-31 | 1977-01-31 | MIS-Transistor von kurzer Kanallänge und Verfahren zu seiner Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2379168A1 true FR2379168A1 (fr) | 1978-08-25 |
FR2379168B1 FR2379168B1 (fr) | 1984-01-27 |
Family
ID=5999963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7802331A Granted FR2379168A1 (fr) | 1977-01-31 | 1978-01-27 | Transistor a effet de champ mis possedant une courte longueur de canal |
Country Status (5)
Country | Link |
---|---|
US (1) | US4190850A (fr) |
JP (1) | JPS5396774A (fr) |
DE (1) | DE2703877C2 (fr) |
FR (1) | FR2379168A1 (fr) |
GB (1) | GB1587773A (fr) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2445618A1 (fr) * | 1978-12-15 | 1980-07-25 | Raytheon Co | Composant semi-conducteur et son procede de fabrication |
FR2452785A1 (fr) * | 1979-03-29 | 1980-10-24 | Siemens Ag | Procede pour fabriquer un transistor a effet de champ mis possedant un canal d'une longueur reglable extremement courte |
EP0021218A1 (fr) * | 1979-06-29 | 1981-01-07 | Siemens Aktiengesellschaft | Cellule à mémoire semiconductrice dynamique et procédé pour sa fabrication |
EP0029554A1 (fr) * | 1979-11-23 | 1981-06-03 | Siemens Aktiengesellschaft | Procédé de fabrication de transistors de mémoire de type MNOS à canal très court par la technique de l'électrode de porte en silicium |
FR2484707A1 (fr) * | 1980-06-16 | 1981-12-18 | Philips Corp | Transistor lateral a effet de cham |
EP0083447A2 (fr) * | 1981-12-30 | 1983-07-13 | Thomson Components-Mostek Corporation | Dispositif à canal court formé par triple diffusion |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2754066A1 (de) * | 1977-12-05 | 1979-06-13 | Siemens Ag | Herstellung einer integrierten schaltung mit abgestuften schichten aus isolations- und elektrodenmaterial |
DE2754549A1 (de) * | 1977-12-07 | 1979-06-13 | Siemens Ag | Optoelektronischer sensor nach dem prinzip der ladungsinjektion |
DE2802838A1 (de) * | 1978-01-23 | 1979-08-16 | Siemens Ag | Mis-feldeffekttransistor mit kurzer kanallaenge |
US4705759B1 (en) * | 1978-10-13 | 1995-02-14 | Int Rectifier Corp | High power mosfet with low on-resistance and high breakdown voltage |
US5191396B1 (en) * | 1978-10-13 | 1995-12-26 | Int Rectifier Corp | High power mosfet with low on-resistance and high breakdown voltage |
JPS5553462A (en) * | 1978-10-13 | 1980-04-18 | Int Rectifier Corp | Mosfet element |
US5298787A (en) * | 1979-08-10 | 1994-03-29 | Massachusetts Institute Of Technology | Semiconductor embedded layer technology including permeable base transistor |
US4378629A (en) * | 1979-08-10 | 1983-04-05 | Massachusetts Institute Of Technology | Semiconductor embedded layer technology including permeable base transistor, fabrication method |
DE3017313A1 (de) * | 1980-05-06 | 1981-11-12 | Siemens AG, 1000 Berlin und 8000 München | Thyristor mit hoher blockierspannung und verfahren zu seiner herstellung |
US4404576A (en) * | 1980-06-09 | 1983-09-13 | Xerox Corporation | All implanted MOS transistor |
DE3040775C2 (de) * | 1980-10-29 | 1987-01-15 | Siemens AG, 1000 Berlin und 8000 München | Steuerbares MIS-Halbleiterbauelement |
US4574208A (en) * | 1982-06-21 | 1986-03-04 | Eaton Corporation | Raised split gate EFET and circuitry |
US4672423A (en) * | 1982-09-30 | 1987-06-09 | International Business Machines Corporation | Voltage controlled resonant transmission semiconductor device |
DE3301648A1 (de) * | 1983-01-19 | 1984-07-19 | Siemens AG, 1000 Berlin und 8000 München | Misfet mit eingangsverstaerker |
US4602965A (en) * | 1984-03-13 | 1986-07-29 | Communications Satellite Corporation | Method of making FETs in GaAs by dual species implantation of silicon and boron |
US4713681A (en) * | 1985-05-31 | 1987-12-15 | Harris Corporation | Structure for high breakdown PN diode with relatively high surface doping |
US4818715A (en) * | 1987-07-09 | 1989-04-04 | Industrial Technology Research Institute | Method of fabricating a LDDFET with self-aligned silicide |
US5550069A (en) * | 1990-06-23 | 1996-08-27 | El Mos Electronik In Mos Technologie Gmbh | Method for producing a PMOS transistor |
IT1250233B (it) * | 1991-11-29 | 1995-04-03 | St Microelectronics Srl | Procedimento per la fabbricazione di circuiti integrati in tecnologia mos. |
JP3435173B2 (ja) * | 1992-07-10 | 2003-08-11 | 株式会社日立製作所 | 半導体装置 |
GB9313843D0 (en) * | 1993-07-05 | 1993-08-18 | Philips Electronics Uk Ltd | A semiconductor device comprising an insulated gate field effect transistor |
US5374575A (en) * | 1993-11-23 | 1994-12-20 | Goldstar Electron Co., Ltd. | Method for fabricating MOS transistor |
DE69329999T2 (de) * | 1993-12-29 | 2001-09-13 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania | Verfahren zur Herstellung integrierter Schaltungen, insbesondere intelligenter Leistungsanordnungen |
DE69434937D1 (de) * | 1994-06-23 | 2007-04-19 | St Microelectronics Srl | Verfahren zur Herstellung von Leistungsbauteilen in MOS-Technologie |
EP0689238B1 (fr) * | 1994-06-23 | 2002-02-20 | STMicroelectronics S.r.l. | Procédé de manufacture d'un dispositif de puissance en technologie MOS |
US5817546A (en) * | 1994-06-23 | 1998-10-06 | Stmicroelectronics S.R.L. | Process of making a MOS-technology power device |
DE69429915D1 (de) * | 1994-07-04 | 2002-03-28 | St Microelectronics Srl | Verfahren zur Herstellung von Leistungsbauteilen hoher Dichte in MOS-Technologie |
JP2661561B2 (ja) * | 1994-10-27 | 1997-10-08 | 日本電気株式会社 | 薄膜トランジスタおよびその製造方法 |
JPH08316426A (ja) * | 1995-05-16 | 1996-11-29 | Nittetsu Semiconductor Kk | Mos型半導体装置およびその製造方法 |
US5869371A (en) * | 1995-06-07 | 1999-02-09 | Stmicroelectronics, Inc. | Structure and process for reducing the on-resistance of mos-gated power devices |
EP1035566A3 (fr) * | 1999-03-03 | 2000-10-04 | Infineon Technologies North America Corp. | Méthode de formation d'une couche dopée profonde avec des éléments de connection dans un composant semiconducteur |
JP4198006B2 (ja) * | 2003-07-25 | 2008-12-17 | 株式会社リコー | 半導体装置の製造方法 |
KR100552809B1 (ko) * | 2003-12-24 | 2006-02-22 | 동부아남반도체 주식회사 | 드레인-소스 브레이크다운 전압을 개선한 반도체 소자 및그 제조 방법 |
US20060255412A1 (en) * | 2005-05-13 | 2006-11-16 | Nirmal Ramaswamy | Enhanced access devices using selective epitaxial silicon over the channel region during the formation of a semiconductor device and systems including same |
EP4053916B1 (fr) * | 2021-03-01 | 2024-07-03 | Hitachi Energy Ltd | Dispositif de semi-conducteur d'alimentation |
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US3846822A (en) * | 1973-10-05 | 1974-11-05 | Bell Telephone Labor Inc | Methods for making field effect transistors |
US4001048A (en) * | 1974-06-26 | 1977-01-04 | Signetics Corporation | Method of making metal oxide semiconductor structures using ion implantation |
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NL6501946A (fr) * | 1965-02-17 | 1966-08-18 | ||
GB1261723A (en) * | 1968-03-11 | 1972-01-26 | Associated Semiconductor Mft | Improvements in and relating to semiconductor devices |
GB1316555A (fr) * | 1969-08-12 | 1973-05-09 | ||
JPS4831514B1 (fr) * | 1969-09-18 | 1973-09-29 | ||
US3604990A (en) * | 1970-04-01 | 1971-09-14 | Gen Electric | Smoothly changing voltage-variable capacitor having an extendible pn junction region |
JPS53673B2 (fr) * | 1971-11-04 | 1978-01-11 | ||
DE2460967A1 (de) * | 1974-12-21 | 1976-07-01 | Philips Patentverwaltung | Halbleiterbauelement mit einer mos-transistorstruktur |
FR2325194A1 (fr) * | 1975-09-16 | 1977-04-15 | Ibm | Dispositif de pompage de charge pour semi-conducteur et son procede de fabrication |
JPS6042626B2 (ja) * | 1976-05-18 | 1985-09-24 | 松下電器産業株式会社 | 半導体装置の製造方法 |
-
1977
- 1977-01-31 DE DE2703877A patent/DE2703877C2/de not_active Expired
-
1978
- 1978-01-17 US US05/870,216 patent/US4190850A/en not_active Expired - Lifetime
- 1978-01-27 FR FR7802331A patent/FR2379168A1/fr active Granted
- 1978-01-30 JP JP920178A patent/JPS5396774A/ja active Granted
- 1978-01-30 GB GB3619/78A patent/GB1587773A/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US3846822A (en) * | 1973-10-05 | 1974-11-05 | Bell Telephone Labor Inc | Methods for making field effect transistors |
US4001048A (en) * | 1974-06-26 | 1977-01-04 | Signetics Corporation | Method of making metal oxide semiconductor structures using ion implantation |
Non-Patent Citations (1)
Title |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2445618A1 (fr) * | 1978-12-15 | 1980-07-25 | Raytheon Co | Composant semi-conducteur et son procede de fabrication |
FR2452785A1 (fr) * | 1979-03-29 | 1980-10-24 | Siemens Ag | Procede pour fabriquer un transistor a effet de champ mis possedant un canal d'une longueur reglable extremement courte |
EP0021218A1 (fr) * | 1979-06-29 | 1981-01-07 | Siemens Aktiengesellschaft | Cellule à mémoire semiconductrice dynamique et procédé pour sa fabrication |
EP0029554A1 (fr) * | 1979-11-23 | 1981-06-03 | Siemens Aktiengesellschaft | Procédé de fabrication de transistors de mémoire de type MNOS à canal très court par la technique de l'électrode de porte en silicium |
FR2484707A1 (fr) * | 1980-06-16 | 1981-12-18 | Philips Corp | Transistor lateral a effet de cham |
EP0083447A2 (fr) * | 1981-12-30 | 1983-07-13 | Thomson Components-Mostek Corporation | Dispositif à canal court formé par triple diffusion |
EP0083447A3 (en) * | 1981-12-30 | 1985-03-13 | Mostek Corporation | Triple diffused short channel device structure |
Also Published As
Publication number | Publication date |
---|---|
US4190850A (en) | 1980-02-26 |
GB1587773A (en) | 1981-04-08 |
JPH0130312B2 (fr) | 1989-06-19 |
DE2703877C2 (de) | 1982-06-03 |
JPS5396774A (en) | 1978-08-24 |
DE2703877A1 (de) | 1978-08-03 |
FR2379168B1 (fr) | 1984-01-27 |
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