FR2375665A1 - Procede de lithographie par faisceau electronique - Google Patents

Procede de lithographie par faisceau electronique

Info

Publication number
FR2375665A1
FR2375665A1 FR7735962A FR7735962A FR2375665A1 FR 2375665 A1 FR2375665 A1 FR 2375665A1 FR 7735962 A FR7735962 A FR 7735962A FR 7735962 A FR7735962 A FR 7735962A FR 2375665 A1 FR2375665 A1 FR 2375665A1
Authority
FR
France
Prior art keywords
lithography process
dose
beam lithography
expose
electron beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7735962A
Other languages
English (en)
French (fr)
Other versions
FR2375665B1 (show.php
Inventor
James R Kitcher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2375665A1 publication Critical patent/FR2375665A1/fr
Application granted granted Critical
Publication of FR2375665B1 publication Critical patent/FR2375665B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31793—Problems associated with lithography
    • H01J2237/31796—Problems associated with lithography affecting resists

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
FR7735962A 1976-12-27 1977-11-21 Procede de lithographie par faisceau electronique Granted FR2375665A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/754,310 US4099062A (en) 1976-12-27 1976-12-27 Electron beam lithography process

Publications (2)

Publication Number Publication Date
FR2375665A1 true FR2375665A1 (fr) 1978-07-21
FR2375665B1 FR2375665B1 (show.php) 1980-08-22

Family

ID=25034242

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7735962A Granted FR2375665A1 (fr) 1976-12-27 1977-11-21 Procede de lithographie par faisceau electronique

Country Status (5)

Country Link
US (1) US4099062A (show.php)
JP (1) JPS5382176A (show.php)
DE (1) DE2752448C2 (show.php)
FR (1) FR2375665A1 (show.php)
GB (1) GB1590071A (show.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0097903A3 (en) * 1982-06-30 1985-10-23 Kabushiki Kaisha Toshiba Method of electron beam exposure
EP0098177A3 (en) * 1982-06-30 1986-06-04 Fujitsu Limited Scanning electron-beam exposure system

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463681A (en) * 1977-10-29 1979-05-22 Nippon Aviotronics Kk Electron beam exposure device
DE3175019D1 (en) * 1980-04-02 1986-09-04 Hitachi Ltd Method of forming patterns
US4494004A (en) * 1980-11-28 1985-01-15 International Business Machines Corporation Electron beam system
JPS5834918A (ja) * 1981-08-26 1983-03-01 Fujitsu Ltd 電子ビ−ム露光方法
JPS58210617A (ja) * 1982-05-31 1983-12-07 Toshiba Corp 電子ビ−ム描画方法
JPS58210616A (ja) * 1982-05-31 1983-12-07 Toshiba Corp 電子ビ−ム描画方法
US4712013A (en) * 1984-09-29 1987-12-08 Kabushiki Kaisha Toshiba Method of forming a fine pattern with a charged particle beam
US4816692A (en) * 1987-07-08 1989-03-28 International Business Machines Corporation Pattern splicing system and method for scanning of electron beam system
DE3744308A1 (de) * 1987-12-28 1989-07-06 Bbc Brown Boveri & Cie Leistungshalbleiter-bauelement sowie verfahren zu dessen herstellung
KR920004910B1 (ko) * 1988-09-16 1992-06-22 삼성전자 주식회사 반도체 장치의 최소 접속창 형성방법
US5051598A (en) * 1990-09-12 1991-09-24 International Business Machines Corporation Method for correcting proximity effects in electron beam lithography
US5309354A (en) * 1991-10-30 1994-05-03 International Business Machines Corporation Electron beam exposure method
EP0608657A1 (en) * 1993-01-29 1994-08-03 International Business Machines Corporation Apparatus and method for preparing shape data for proximity correction
JP3085454B2 (ja) * 1997-03-13 2000-09-11 日本電気株式会社 荷電粒子線露光方法
CN101421667B (zh) * 2006-01-30 2013-06-05 3Dcd有限责任公司 光学可变器件母版制作系统、利用该系统鉴别物品的方法以及得到的物品
US8530148B2 (en) * 2006-12-25 2013-09-10 Fujifilm Corporation Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method
JP4554665B2 (ja) * 2006-12-25 2010-09-29 富士フイルム株式会社 パターン形成方法、該パターン形成方法に用いられる多重現像用ポジ型レジスト組成物、該パターン形成方法に用いられるネガ現像用現像液及び該パターン形成方法に用いられるネガ現像用リンス液
US8637229B2 (en) * 2006-12-25 2014-01-28 Fujifilm Corporation Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method
EP2138898B1 (en) 2007-04-13 2014-05-21 FUJIFILM Corporation Method for pattern formation, and use of resist composition in said method
US8034547B2 (en) * 2007-04-13 2011-10-11 Fujifilm Corporation Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method
US8603733B2 (en) 2007-04-13 2013-12-10 Fujifilm Corporation Pattern forming method, and resist composition, developer and rinsing solution used in the pattern forming method
US8476001B2 (en) 2007-05-15 2013-07-02 Fujifilm Corporation Pattern forming method
JP4558064B2 (ja) * 2007-05-15 2010-10-06 富士フイルム株式会社 パターン形成方法
US8632942B2 (en) 2007-06-12 2014-01-21 Fujifilm Corporation Method of forming patterns
JP4590431B2 (ja) * 2007-06-12 2010-12-01 富士フイルム株式会社 パターン形成方法
JP4617337B2 (ja) * 2007-06-12 2011-01-26 富士フイルム株式会社 パターン形成方法
JP4783853B2 (ja) * 2007-06-12 2011-09-28 富士フイルム株式会社 ネガ型現像用レジスト組成物を用いたパターン形成方法
US8617794B2 (en) 2007-06-12 2013-12-31 Fujifilm Corporation Method of forming patterns
JP5767919B2 (ja) * 2010-09-17 2015-08-26 富士フイルム株式会社 パターン形成方法
US8539392B2 (en) 2011-02-24 2013-09-17 National Taiwan University Method for compensating proximity effects of particle beam lithography processes
JP6025600B2 (ja) * 2013-02-19 2016-11-16 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜及びパターン形成方法
JP2015050439A (ja) * 2013-09-04 2015-03-16 株式会社東芝 描画データの補正方法、描画方法、及びリソグラフィ用のマスク又はテンプレートの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2073447A1 (show.php) * 1969-12-02 1971-10-01 Licentia Gmbh
FR2151130A1 (en) * 1971-09-01 1973-04-13 Ibm Photo mask mfr - eliminating defects by successive partial exposures
DE2421079A1 (de) * 1974-05-02 1975-11-13 Licentia Gmbh Verfahren zur bearbeitung mit einem elektronen- oder ionenstrahl

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3535137A (en) * 1967-01-13 1970-10-20 Ibm Method of fabricating etch resistant masks
US3644700A (en) * 1969-12-15 1972-02-22 Ibm Method and apparatus for controlling an electron beam
US3949228A (en) * 1973-09-19 1976-04-06 Ibm Corporation Method for controlling an electron beam
US3866013A (en) * 1973-09-19 1975-02-11 Ibm Method and apparatus for controlling movable means such as an electron beam
US3987215A (en) * 1974-04-22 1976-10-19 International Business Machines Corporation Resist mask formation process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2073447A1 (show.php) * 1969-12-02 1971-10-01 Licentia Gmbh
FR2151130A1 (en) * 1971-09-01 1973-04-13 Ibm Photo mask mfr - eliminating defects by successive partial exposures
DE2421079A1 (de) * 1974-05-02 1975-11-13 Licentia Gmbh Verfahren zur bearbeitung mit einem elektronen- oder ionenstrahl

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
EXBK/72 *
EXBK/73 *
NV700/76 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0097903A3 (en) * 1982-06-30 1985-10-23 Kabushiki Kaisha Toshiba Method of electron beam exposure
EP0098177A3 (en) * 1982-06-30 1986-06-04 Fujitsu Limited Scanning electron-beam exposure system
US4644170A (en) * 1982-06-30 1987-02-17 Tokyo Shibaura Denki Kabushiki Kaisha Method of electron beam exposure

Also Published As

Publication number Publication date
US4099062A (en) 1978-07-04
FR2375665B1 (show.php) 1980-08-22
DE2752448A1 (de) 1978-06-29
JPS5343017B2 (show.php) 1978-11-16
DE2752448C2 (de) 1984-08-30
GB1590071A (en) 1981-05-28
JPS5382176A (en) 1978-07-20

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Legal Events

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