FR2356975A1 - CONTACT TYPE PHOTOLITHOGRAPHIC PRINTING PROCESS FOR OBTAINING HIGH RESOLUTION PROFILES AND APPARATUS USING SUCH A PROCESS - Google Patents
CONTACT TYPE PHOTOLITHOGRAPHIC PRINTING PROCESS FOR OBTAINING HIGH RESOLUTION PROFILES AND APPARATUS USING SUCH A PROCESSInfo
- Publication number
- FR2356975A1 FR2356975A1 FR7716799A FR7716799A FR2356975A1 FR 2356975 A1 FR2356975 A1 FR 2356975A1 FR 7716799 A FR7716799 A FR 7716799A FR 7716799 A FR7716799 A FR 7716799A FR 2356975 A1 FR2356975 A1 FR 2356975A1
- Authority
- FR
- France
- Prior art keywords
- high resolution
- contact type
- obtaining high
- photolithographic printing
- printing process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Procédé d'exposition d'une couche photorésistante à un faisceau lumineux pour obtenir des ouvertures à résolution élevée dans cette couche photorésistante. Le faisceau lumineux 42 est envoyé sur un miroir rotatif 44 qui le réfléchit sur une structure constituée par un substrat 26, une couche photorésistante 28 et un masque 38 comportant des ouvertures 40. Les zones exposées 34 de la couche 28 sont définies et modifiées en faisant tourner le miroir rotatif 44. La couche 28 est ensuite développée pour être utilisée dans une étape ultérieure de fabrication des dispositifs semi-conducteurs.A method of exposing a photoresist layer to a light beam to obtain high resolution openings in this photoresist layer. The light beam 42 is sent to a rotating mirror 44 which reflects it on a structure constituted by a substrate 26, a photoresist layer 28 and a mask 38 comprising openings 40. The exposed zones 34 of the layer 28 are defined and modified by making rotating the rotating mirror 44. Layer 28 is then developed for use in a subsequent manufacturing step of semiconductor devices.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70143776A | 1976-06-30 | 1976-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2356975A1 true FR2356975A1 (en) | 1978-01-27 |
FR2356975B1 FR2356975B1 (en) | 1978-11-03 |
Family
ID=24817371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7716799A Granted FR2356975A1 (en) | 1976-06-30 | 1977-05-26 | CONTACT TYPE PHOTOLITHOGRAPHIC PRINTING PROCESS FOR OBTAINING HIGH RESOLUTION PROFILES AND APPARATUS USING SUCH A PROCESS |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS533170A (en) |
FR (1) | FR2356975A1 (en) |
GB (1) | GB1527179A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2412410A1 (en) * | 1977-12-23 | 1979-07-20 | Ibm | METHOD AND APPARATUS FOR MANUFACTURING A SET OF NOZZLES FOR INKJET PRINTERS |
EP0006459A2 (en) * | 1978-06-29 | 1980-01-09 | Siemens Aktiengesellschaft | Application of an electroforming process to the preparation of precise flat pack components |
EP0025380A1 (en) * | 1979-09-10 | 1981-03-18 | Roumiguières, Jean-Louis | Process for transferring onto a support the true shadow of a mask pierced with regularly distributed slits, and application of this process to photolithography in particular |
EP0050474A2 (en) * | 1980-10-14 | 1982-04-28 | EASTMAN KODAK COMPANY (a New Jersey corporation) | Process for preparing elements containing interlaid arrays of compositions in microareas and elements |
FR2519157A1 (en) * | 1981-12-30 | 1983-07-01 | Labo Electronique Physique | Sub-micron pattern formation for semiconductor device mfr. - uses irradiation of sub-micron pattern layer on X=ray sensitive coating having thickness of approximately two microns |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56153738A (en) * | 1980-04-30 | 1981-11-27 | Fujitsu Ltd | Method for contact exposure |
DE3315665A1 (en) * | 1983-04-29 | 1984-10-31 | Siemens AG, 1000 Berlin und 8000 München | MANUFACTURE OF GALVANOPLASTIC FLAT PARTS WITH TOTATIONALLY UNSYMMETRIC, CONE-SHAPED STRUCTURES |
JPS63299395A (en) * | 1987-05-29 | 1988-12-06 | Mitsubishi Electric Corp | Aligner |
JPH1022222A (en) * | 1995-12-29 | 1998-01-23 | Hyundai Electron Ind Co Ltd | Aligner |
WO2020108973A2 (en) * | 2018-11-27 | 2020-06-04 | Ams Ag | Formation of three-dimensional structures using grey-scale photolithography |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2104273A5 (en) * | 1970-08-12 | 1972-04-14 | Rank Organisation Ltd | |
FR2132043A1 (en) * | 1971-04-06 | 1972-11-17 | Ibm |
-
1977
- 1977-05-26 FR FR7716799A patent/FR2356975A1/en active Granted
- 1977-05-27 JP JP6131877A patent/JPS533170A/en active Pending
- 1977-06-01 GB GB2324477A patent/GB1527179A/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2104273A5 (en) * | 1970-08-12 | 1972-04-14 | Rank Organisation Ltd | |
FR2132043A1 (en) * | 1971-04-06 | 1972-11-17 | Ibm |
Non-Patent Citations (1)
Title |
---|
REVUE US: "IBM TECHNICAL DISCLOSURE BULLETIN", VOLUME 19, NO. 5, OCTOBRE1976) * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2412410A1 (en) * | 1977-12-23 | 1979-07-20 | Ibm | METHOD AND APPARATUS FOR MANUFACTURING A SET OF NOZZLES FOR INKJET PRINTERS |
EP0006459A2 (en) * | 1978-06-29 | 1980-01-09 | Siemens Aktiengesellschaft | Application of an electroforming process to the preparation of precise flat pack components |
EP0006459A3 (en) * | 1978-06-29 | 1980-01-23 | Siemens Aktiengesellschaft Berlin Und Munchen | Electroforming process |
EP0025380A1 (en) * | 1979-09-10 | 1981-03-18 | Roumiguières, Jean-Louis | Process for transferring onto a support the true shadow of a mask pierced with regularly distributed slits, and application of this process to photolithography in particular |
FR2465255A1 (en) * | 1979-09-10 | 1981-03-20 | Roumiguieres Jean Louis | PROCESS FOR REPORTING ON A SUPPORT THE FAIRLY SHADOW OF A MASK PERCE OF PERIODICALLY DISTRIBUTED SLOTS, AND APPLICATION OF THIS METHOD IN PARTICULAR IN PHOTOLITHOGRAVURE |
EP0050474A2 (en) * | 1980-10-14 | 1982-04-28 | EASTMAN KODAK COMPANY (a New Jersey corporation) | Process for preparing elements containing interlaid arrays of compositions in microareas and elements |
EP0050474A3 (en) * | 1980-10-14 | 1983-01-26 | Eastman Kodak Company | Process for preparing elements containing interlaid arrays of compositions in microareas and elements |
FR2519157A1 (en) * | 1981-12-30 | 1983-07-01 | Labo Electronique Physique | Sub-micron pattern formation for semiconductor device mfr. - uses irradiation of sub-micron pattern layer on X=ray sensitive coating having thickness of approximately two microns |
Also Published As
Publication number | Publication date |
---|---|
FR2356975B1 (en) | 1978-11-03 |
GB1527179A (en) | 1978-10-04 |
JPS533170A (en) | 1978-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |