JPS574124A - Manufacture of germanium semiconductor device - Google Patents
Manufacture of germanium semiconductor deviceInfo
- Publication number
- JPS574124A JPS574124A JP7819280A JP7819280A JPS574124A JP S574124 A JPS574124 A JP S574124A JP 7819280 A JP7819280 A JP 7819280A JP 7819280 A JP7819280 A JP 7819280A JP S574124 A JPS574124 A JP S574124A
- Authority
- JP
- Japan
- Prior art keywords
- film
- stepped section
- aperture
- groove
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Abstract
PURPOSE:To easily perform the accurate positioning of mask for the subject semiconductor device by a method wherein a stepped section or a groove is formed on the surface of a Ge substrate by performing a selective etching and the subsequent mask positioning is performed based on said stepped section or the groove. CONSTITUTION:A photoresist film 2 is coated on the surface of a P type Ge wafer 1 and is used as a mask, an aperture is provided using photolithography and a guard ring region 3 is formed inside the wafer 1 exposed on the aperture by diffusing an Sb. Then, the surface of the region 3 is removed by 1,000Angstrom or thereabouts by performing an etching, the stepped section or the groove is created and the film 2 is removed using a resist exfoliating solution. Subsequently, an SiO2 film 5 is generated on the whole surface and a stepped section is formed on a film 5 corresponding to the stepped section 4. Then, based on this stepped section, an aperture is provided on the film 5 using photolithography, an As is diffused, a light-receiving section 6 is provided, an aperture is formed on the SiO2 film 5 and an Al electrode 7 is installed at the light-receiving section 6.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7819280A JPS574124A (en) | 1980-06-10 | 1980-06-10 | Manufacture of germanium semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7819280A JPS574124A (en) | 1980-06-10 | 1980-06-10 | Manufacture of germanium semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS574124A true JPS574124A (en) | 1982-01-09 |
Family
ID=13655123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7819280A Pending JPS574124A (en) | 1980-06-10 | 1980-06-10 | Manufacture of germanium semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS574124A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59208723A (en) * | 1983-05-12 | 1984-11-27 | Mitsubishi Electric Corp | Mask alignment mark |
US7834704B2 (en) | 2005-08-30 | 2010-11-16 | Panasonic Corporation | Low-noise amplifier circuit and receiving system |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4929986A (en) * | 1972-07-19 | 1974-03-16 | ||
JPS50161169A (en) * | 1974-06-17 | 1975-12-26 | ||
JPS52125276A (en) * | 1976-04-14 | 1977-10-20 | Nec Corp | Preparation of semiconductor integrated circuit device |
JPS5459873A (en) * | 1978-10-02 | 1979-05-14 | Hitachi Ltd | Production of semiconductor device |
-
1980
- 1980-06-10 JP JP7819280A patent/JPS574124A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4929986A (en) * | 1972-07-19 | 1974-03-16 | ||
JPS50161169A (en) * | 1974-06-17 | 1975-12-26 | ||
JPS52125276A (en) * | 1976-04-14 | 1977-10-20 | Nec Corp | Preparation of semiconductor integrated circuit device |
JPS5459873A (en) * | 1978-10-02 | 1979-05-14 | Hitachi Ltd | Production of semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59208723A (en) * | 1983-05-12 | 1984-11-27 | Mitsubishi Electric Corp | Mask alignment mark |
US7834704B2 (en) | 2005-08-30 | 2010-11-16 | Panasonic Corporation | Low-noise amplifier circuit and receiving system |
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