JPS57180127A - Formation of resist pattern - Google Patents
Formation of resist patternInfo
- Publication number
- JPS57180127A JPS57180127A JP6591081A JP6591081A JPS57180127A JP S57180127 A JPS57180127 A JP S57180127A JP 6591081 A JP6591081 A JP 6591081A JP 6591081 A JP6591081 A JP 6591081A JP S57180127 A JPS57180127 A JP S57180127A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- exposed part
- developed
- oxygen plasma
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To make the difference of oxidization speed between exposed part and non-exposed part of resist sufficiently large when the resist is developed in oxygen plasma by treating the resist by fluorinated radical before it is exposed and developed. CONSTITUTION:A theremal oxide film 2 is accumulated on an Si wafer 1 and the film 2 is coated by positive type photoresist 3. Then after the required pattern is projected on the resist 3, the surface of the resist 3 is treatd by fluorinated radical. After that resist pattern 4 is formed by developing the resist 3 in oxygen plasma. With this constitution, the difference of oxidization speed between exposed part and non-exposed part of the resist 3 can be made sufficiently large when the resist 3 is developed in the oxygen plasma, so that the pattern 4 can be formed with high accuracy and high reproducibility.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6591081A JPS57180127A (en) | 1981-04-30 | 1981-04-30 | Formation of resist pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6591081A JPS57180127A (en) | 1981-04-30 | 1981-04-30 | Formation of resist pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57180127A true JPS57180127A (en) | 1982-11-06 |
Family
ID=13300584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6591081A Pending JPS57180127A (en) | 1981-04-30 | 1981-04-30 | Formation of resist pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57180127A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007266594A (en) * | 2006-03-07 | 2007-10-11 | Asml Netherlands Bv | Enhanced lithography patterning process and system |
-
1981
- 1981-04-30 JP JP6591081A patent/JPS57180127A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007266594A (en) * | 2006-03-07 | 2007-10-11 | Asml Netherlands Bv | Enhanced lithography patterning process and system |
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