FR2321193A1 - Procede pour la fixation d'un conducteur a un dispositif semi-conducteur et produit resultant - Google Patents

Procede pour la fixation d'un conducteur a un dispositif semi-conducteur et produit resultant

Info

Publication number
FR2321193A1
FR2321193A1 FR7525282A FR7525282A FR2321193A1 FR 2321193 A1 FR2321193 A1 FR 2321193A1 FR 7525282 A FR7525282 A FR 7525282A FR 7525282 A FR7525282 A FR 7525282A FR 2321193 A1 FR2321193 A1 FR 2321193A1
Authority
FR
France
Prior art keywords
semiconductor device
conductor
attaching
resulting product
contact member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7525282A
Other languages
English (en)
French (fr)
Other versions
FR2321193B1 (https=
Inventor
Monroe B Goldberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arris Technology Inc
Original Assignee
Arris Technology Inc
General Instrument Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23840939&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FR2321193(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Arris Technology Inc, General Instrument Corp filed Critical Arris Technology Inc
Publication of FR2321193A1 publication Critical patent/FR2321193A1/fr
Application granted granted Critical
Publication of FR2321193B1 publication Critical patent/FR2321193B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/302—Cu as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Ceramic Products (AREA)
  • Joining Of Glass To Other Materials (AREA)
FR7525282A 1974-04-24 1975-08-13 Procede pour la fixation d'un conducteur a un dispositif semi-conducteur et produit resultant Granted FR2321193A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/463,678 US3930306A (en) 1974-04-24 1974-04-24 Process for attaching a lead member to a semiconductor device

Publications (2)

Publication Number Publication Date
FR2321193A1 true FR2321193A1 (fr) 1977-03-11
FR2321193B1 FR2321193B1 (https=) 1980-05-09

Family

ID=23840939

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7525282A Granted FR2321193A1 (fr) 1974-04-24 1975-08-13 Procede pour la fixation d'un conducteur a un dispositif semi-conducteur et produit resultant

Country Status (8)

Country Link
US (1) US3930306A (https=)
JP (1) JPS50147285A (https=)
CA (1) CA1008566A (https=)
DE (1) DE2518305C2 (https=)
FR (1) FR2321193A1 (https=)
GB (1) GB1465010A (https=)
HK (1) HK87679A (https=)
IT (1) IT1029419B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2514922C2 (de) * 1975-04-05 1983-01-27 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Gegen thermische Wechselbelastung beständiges Halbleiterbauelement
GB1506125A (en) * 1975-04-07 1978-04-05 Hitachi Ltd Glassmoulded type semiconductor device
JPS54107455A (en) * 1978-02-10 1979-08-23 Hitachi Ltd Self-melting brazing material
FR2549292B1 (fr) * 1983-07-12 1986-10-10 Silicium Semiconducteur Ssc Procede de montage de diode
US4757610A (en) * 1986-02-21 1988-07-19 American Precision Industries, Inc. Surface mount network and method of making
US5008735A (en) * 1989-12-07 1991-04-16 General Instrument Corporation Packaged diode for high temperature operation
US6642078B2 (en) * 2000-08-28 2003-11-04 Transpo Electronics, Inc. Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
US7216796B2 (en) * 2004-05-10 2007-05-15 General Electric, Company Crevice corrosion-resistant liquid-cooled armature bar clip-to-strand connection and related method
US7219827B2 (en) * 2004-11-19 2007-05-22 General Electric Company Braze end isolation layer for generator armature winding bar and method for applying the isolation layer
US7414226B2 (en) * 2004-11-19 2008-08-19 General Electric Company Movable heating method and system having fixed heating source for brazing stator bars
CN105149813A (zh) * 2015-09-30 2015-12-16 杭州华光焊接新材料股份有限公司 一种含微量铟的低银铜磷钎料
CN107170727A (zh) * 2017-06-02 2017-09-15 朝阳无线电元件有限责任公司 一种i类冶金键合二极管设计与制造技术
CN108581269A (zh) * 2018-05-02 2018-09-28 重庆金荣金属有限公司 一种铜基中温复合焊料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3321828A (en) * 1962-01-02 1967-05-30 Gen Electric Aluminum brazing
DE1207769B (de) * 1962-02-13 1965-12-23 Telefunken Patent Ternaeres Hartlot auf Silber-Kupfer-Basis
DE1439160A1 (de) * 1962-07-26 1969-10-23 Siemens Ag Elektrisch steuerbare Halbleiteranordnung bzw. Halbleiterstromtor
DE1614653C3 (de) * 1967-11-15 1979-06-21 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Halbleiteranordnung hoher Strombelastbarkeit
US3844029A (en) * 1972-02-02 1974-10-29 Trw Inc High power double-slug diode package

Also Published As

Publication number Publication date
DE2518305A1 (de) 1975-11-06
JPS50147285A (https=) 1975-11-26
HK87679A (en) 1980-01-04
CA1008566A (en) 1977-04-12
DE2518305C2 (de) 1984-10-18
AU7968175A (en) 1976-10-07
FR2321193B1 (https=) 1980-05-09
IT1029419B (it) 1979-03-10
GB1465010A (en) 1977-02-16
US3930306A (en) 1976-01-06

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