JPS53142930A - Low temperature heat treating method for electronic parts having noble metal coatings - Google Patents
Low temperature heat treating method for electronic parts having noble metal coatingsInfo
- Publication number
- JPS53142930A JPS53142930A JP5811177A JP5811177A JPS53142930A JP S53142930 A JPS53142930 A JP S53142930A JP 5811177 A JP5811177 A JP 5811177A JP 5811177 A JP5811177 A JP 5811177A JP S53142930 A JPS53142930 A JP S53142930A
- Authority
- JP
- Japan
- Prior art keywords
- noble metal
- heat treating
- electronic parts
- low temperature
- temperature heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Abstract
PURPOSE: To maintain the good soldering and thermo press. bonding properties of electronic parts having pointscoated with a noble metal such as gold or platinum by plating, vacuum deposition or the like, by heat treating the parts at a low temp. in a vacuum or an inert gas atmosphere.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5811177A JPS53142930A (en) | 1977-05-19 | 1977-05-19 | Low temperature heat treating method for electronic parts having noble metal coatings |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5811177A JPS53142930A (en) | 1977-05-19 | 1977-05-19 | Low temperature heat treating method for electronic parts having noble metal coatings |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53142930A true JPS53142930A (en) | 1978-12-13 |
Family
ID=13074854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5811177A Pending JPS53142930A (en) | 1977-05-19 | 1977-05-19 | Low temperature heat treating method for electronic parts having noble metal coatings |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53142930A (en) |
-
1977
- 1977-05-19 JP JP5811177A patent/JPS53142930A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5428716A (en) | Process for producing electroconductive highly heat-resisting aluminum alloy | |
JPS5518505A (en) | Soldering alloy for attaching silver electrode leading wire | |
JPS53142930A (en) | Low temperature heat treating method for electronic parts having noble metal coatings | |
JPS53109477A (en) | Mounting method of semiconductor element | |
JPS5360310A (en) | Continuous annealing method for titanium and titanium alloy | |
JPS5219105A (en) | Nonoxidative sintering and forging method | |
JPS52128825A (en) | Copper alloy for lead material | |
JPS5419663A (en) | Forming method of insulating films | |
JPS5422163A (en) | Semiconductor device | |
JPS5399071A (en) | Removing apparatus of exhaust gas | |
JPS5432972A (en) | Fusion-welding method for semiconductor chip | |
JPS5416979A (en) | Production of semiconuctor device | |
JPS552709A (en) | Evaporation source for metallizing | |
JPS53140967A (en) | Production of electrodes of semiconductor device | |
JPS5285905A (en) | Co base sintered alloy of excellent cuttability used for parts of deco rations | |
JPS5212621A (en) | High strength copper-base alloy for electroconductor | |
JPS5394885A (en) | Mount structure for semiconductor laser element | |
JPS5367480A (en) | Thermocouple mounting method in metal body | |
JPS52104282A (en) | Detection method of scaratches on surface of intermmediate metal mater ials | |
JPS53124072A (en) | Semiconductor device | |
JPS53114671A (en) | Manufacture for semiconductor device | |
JPS5411864A (en) | Soldering method | |
JPS5451382A (en) | Die bonding method of semiconductor device | |
JPS552744A (en) | Production of silver plating electronic material | |
JPS5277668A (en) | Production of semiconductive device |