JPS5334467A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5334467A JPS5334467A JP10896076A JP10896076A JPS5334467A JP S5334467 A JPS5334467 A JP S5334467A JP 10896076 A JP10896076 A JP 10896076A JP 10896076 A JP10896076 A JP 10896076A JP S5334467 A JPS5334467 A JP S5334467A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- shortest
- chip
- uniform
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To make the wiring length unified to the shortest and to uniform the HF performance of device, by pressing soldering material between the conductive stage and metal piece placed in a small distance and by sliding the chip in.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10896076A JPS6056304B2 (en) | 1976-09-10 | 1976-09-10 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10896076A JPS6056304B2 (en) | 1976-09-10 | 1976-09-10 | semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5334467A true JPS5334467A (en) | 1978-03-31 |
JPS6056304B2 JPS6056304B2 (en) | 1985-12-09 |
Family
ID=14498008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10896076A Expired JPS6056304B2 (en) | 1976-09-10 | 1976-09-10 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6056304B2 (en) |
-
1976
- 1976-09-10 JP JP10896076A patent/JPS6056304B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6056304B2 (en) | 1985-12-09 |
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