DE1439160A1 - Elektrisch steuerbare Halbleiteranordnung bzw. Halbleiterstromtor - Google Patents

Elektrisch steuerbare Halbleiteranordnung bzw. Halbleiterstromtor

Info

Publication number
DE1439160A1
DE1439160A1 DE19621439160 DE1439160A DE1439160A1 DE 1439160 A1 DE1439160 A1 DE 1439160A1 DE 19621439160 DE19621439160 DE 19621439160 DE 1439160 A DE1439160 A DE 1439160A DE 1439160 A1 DE1439160 A1 DE 1439160A1
Authority
DE
Germany
Prior art keywords
semiconductor
electrically controllable
current gate
arrangement
semiconductor arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19621439160
Other languages
English (en)
Inventor
Nitsche Dipl-Ing Erich
Lob Dipl-Ing Udo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of DE1439160A1 publication Critical patent/DE1439160A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Junction Field-Effect Transistors (AREA)

Description

  • Elektrisch steuerbare Halbleiteranordnung bsw. Halbleiteretromtor

Claims (1)

  1.
DE19621439160 1962-07-26 1962-07-26 Elektrisch steuerbare Halbleiteranordnung bzw. Halbleiterstromtor Pending DE1439160A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0080595 1962-07-26

Publications (1)

Publication Number Publication Date
DE1439160A1 true DE1439160A1 (de) 1969-10-23

Family

ID=7508984

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19621439160 Pending DE1439160A1 (de) 1962-07-26 1962-07-26 Elektrisch steuerbare Halbleiteranordnung bzw. Halbleiterstromtor

Country Status (1)

Country Link
DE (1) DE1439160A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2518305A1 (de) * 1974-04-24 1975-11-06 Gen Instrument Corp Verfahren zum anbringen eines leiterteils an einer halbleitereinrichtung und eine nach diesem verfahren hergestellte halbleitereinrichtung
EP3018709A1 (de) * 2014-11-04 2016-05-11 SEMIKRON Elektronik GmbH & Co. KG Stromrichtereinrichtung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2518305A1 (de) * 1974-04-24 1975-11-06 Gen Instrument Corp Verfahren zum anbringen eines leiterteils an einer halbleitereinrichtung und eine nach diesem verfahren hergestellte halbleitereinrichtung
EP3018709A1 (de) * 2014-11-04 2016-05-11 SEMIKRON Elektronik GmbH & Co. KG Stromrichtereinrichtung

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971