FR2303382A1 - Monolithic integrated semiconductor circuit - uses electron flux reduction from substrate to epitaxial tank resulting in current flow reduction - Google Patents
Monolithic integrated semiconductor circuit - uses electron flux reduction from substrate to epitaxial tank resulting in current flow reductionInfo
- Publication number
- FR2303382A1 FR2303382A1 FR7606262A FR7606262A FR2303382A1 FR 2303382 A1 FR2303382 A1 FR 2303382A1 FR 7606262 A FR7606262 A FR 7606262A FR 7606262 A FR7606262 A FR 7606262A FR 2303382 A1 FR2303382 A1 FR 2303382A1
- Authority
- FR
- France
- Prior art keywords
- substrate
- reduction
- current flow
- electron flux
- semiconductor circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 230000004907 flux Effects 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Bipolar Integrated Circuits (AREA)
- Element Separation (AREA)
- Semiconductor Integrated Circuits (AREA)
- Dc-Dc Converters (AREA)
Abstract
The integrated circuit has a substrate of semiconductor material with an epitaxial layer of opposite conductivity and insulating strips of the substrate conductivity which are provided in the epitaxial layer to form several tanks, in the first of which is provided a first circuit. Between the material of the tank and its surrounding insulating strip is formed a locking diode. The second tank contains an output circuit coupled to the first one. Arrangement for reducing the electron flux from the substrate (23) into the second tank (27), and thus of the resulting current flow in the output circuit (A), contains a third epitaxial tank (36, 42) between the first two tanks (26, 27).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55627675A | 1975-03-07 | 1975-03-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2303382A1 true FR2303382A1 (en) | 1976-10-01 |
Family
ID=24220654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7606262A Withdrawn FR2303382A1 (en) | 1975-03-07 | 1976-03-05 | Monolithic integrated semiconductor circuit - uses electron flux reduction from substrate to epitaxial tank resulting in current flow reduction |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS51115783A (en) |
DE (1) | DE2609700A1 (en) |
FR (1) | FR2303382A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0008106A1 (en) * | 1978-08-08 | 1980-02-20 | Siemens Aktiengesellschaft | Semiconductor device with a plurality of semiconductor elements comprising pn junctions combined in a semiconductor crystal and forming an integrated circuit |
EP0040125A1 (en) * | 1980-05-14 | 1981-11-18 | Thomson-Csf | Protection device against parasitic currents in integrated circuits |
EP0478793A1 (en) * | 1990-04-13 | 1992-04-08 | Kabushiki Kaisha Toshiba | Substrate structure of a semiconductor device |
-
1976
- 1976-03-05 FR FR7606262A patent/FR2303382A1/en not_active Withdrawn
- 1976-03-06 DE DE19762609700 patent/DE2609700A1/en active Pending
- 1976-03-08 JP JP2496476A patent/JPS51115783A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0008106A1 (en) * | 1978-08-08 | 1980-02-20 | Siemens Aktiengesellschaft | Semiconductor device with a plurality of semiconductor elements comprising pn junctions combined in a semiconductor crystal and forming an integrated circuit |
EP0040125A1 (en) * | 1980-05-14 | 1981-11-18 | Thomson-Csf | Protection device against parasitic currents in integrated circuits |
FR2492165A1 (en) * | 1980-05-14 | 1982-04-16 | Thomson Csf | DEVICE FOR PROTECTION AGAINST LEAKAGE CURRENTS IN INTEGRATED CIRCUITS |
EP0040125B1 (en) | 1980-05-14 | 1983-11-30 | Thomson-Csf | Protection device against parasitic currents in integrated circuits |
US4466011A (en) * | 1980-05-14 | 1984-08-14 | Thomson-Csf | Device for protection against leakage currents in integrated circuits |
EP0478793A1 (en) * | 1990-04-13 | 1992-04-08 | Kabushiki Kaisha Toshiba | Substrate structure of a semiconductor device |
EP0478793A4 (en) * | 1990-04-13 | 1995-06-28 | Tokyo Shibaura Electric Co | |
US6104233A (en) * | 1990-04-13 | 2000-08-15 | Kabushiki Kaisha Toshiba | Substrate structure of semi-conductor device |
Also Published As
Publication number | Publication date |
---|---|
DE2609700A1 (en) | 1976-09-16 |
JPS51115783A (en) | 1976-10-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |