FR2011063A1 - - Google Patents

Info

Publication number
FR2011063A1
FR2011063A1 FR6919922A FR6919922A FR2011063A1 FR 2011063 A1 FR2011063 A1 FR 2011063A1 FR 6919922 A FR6919922 A FR 6919922A FR 6919922 A FR6919922 A FR 6919922A FR 2011063 A1 FR2011063 A1 FR 2011063A1
Authority
FR
France
Prior art keywords
layer
circuit
aluminium
connections
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6919922A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2011063A1 publication Critical patent/FR2011063A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/901—Masterslice integrated circuits comprising bipolar technology
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
    • H03K19/082—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using bipolar transistors
    • H03K19/086—Emitter coupled logic
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
    • H03K19/1733—Controllable logic circuits
    • H03K19/1735—Controllable logic circuits by wiring, e.g. uncommitted logic arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
FR6919922A 1968-06-17 1969-06-16 Withdrawn FR2011063A1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73776068A 1968-06-17 1968-06-17

Publications (1)

Publication Number Publication Date
FR2011063A1 true FR2011063A1 (enExample) 1970-02-27

Family

ID=24965207

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6919922A Withdrawn FR2011063A1 (enExample) 1968-06-17 1969-06-16

Country Status (4)

Country Link
US (1) US3558992A (enExample)
DE (1) DE1764567B2 (enExample)
FR (1) FR2011063A1 (enExample)
GB (1) GB1251454A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702427A (en) * 1971-02-22 1972-11-07 Fairchild Camera Instr Co Electromigration resistant metallization for integrated circuits, structure and process
US3795975A (en) * 1971-12-17 1974-03-12 Hughes Aircraft Co Multi-level large scale complex integrated circuit having functional interconnected circuit routed to master patterns
US3877051A (en) * 1972-10-18 1975-04-08 Ibm Multilayer insulation integrated circuit structure
CA997481A (en) * 1972-12-29 1976-09-21 International Business Machines Corporation Dc testing of integrated circuits and a novel integrated circuit structure to facilitate such testing
GB1440512A (en) * 1973-04-30 1976-06-23 Rca Corp Universal array using complementary transistors
CA1024661A (en) * 1974-06-26 1978-01-17 International Business Machines Corporation Wireable planar integrated circuit chip structure
JPS5851425B2 (ja) * 1975-08-22 1983-11-16 株式会社日立製作所 ハンドウタイソウチ
JPS5444881A (en) * 1977-09-16 1979-04-09 Nec Corp Electrode wiring structure of integrated circuit
JPS5662352A (en) 1979-10-26 1981-05-28 Hitachi Ltd Semiconductor integrated circuit device for acoustic amplification circuit
US4467400A (en) * 1981-01-16 1984-08-21 Burroughs Corporation Wafer scale integrated circuit
US4458297A (en) * 1981-01-16 1984-07-03 Mosaic Systems, Inc. Universal interconnection substrate
EP0098173B1 (en) * 1982-06-30 1990-04-11 Fujitsu Limited Semiconductor integrated-circuit apparatus
US4746966A (en) * 1985-10-21 1988-05-24 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits
JPH0817227B2 (ja) * 1987-04-30 1996-02-21 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 個性化可能な半導体チップ
US4880754A (en) * 1987-07-06 1989-11-14 International Business Machines Corp. Method for providing engineering changes to LSI PLAs
JPH03218668A (ja) * 1989-11-24 1991-09-26 Nec Ic Microcomput Syst Ltd 半導体集積回路装置
US5322812A (en) * 1991-03-20 1994-06-21 Crosspoint Solutions, Inc. Improved method of fabricating antifuses in an integrated circuit device and resulting structure

Also Published As

Publication number Publication date
US3558992A (en) 1971-01-26
DE1764567A1 (de) 1972-01-27
GB1251454A (enExample) 1971-10-27
DE1764567B2 (de) 1972-09-28

Similar Documents

Publication Publication Date Title
GB1251454A (enExample)
US4410905A (en) Power, ground and decoupling structure for chip carriers
GB1362136A (en) Transistor package
GB1316697A (en) Semiconductor devices
DE3482719D1 (de) Halbleiterelement und herstellungsverfahren.
JPS6427235A (en) Device for interconnection of multiplex integrated circuits
GB1147469A (en) Semiconductor devices, integrated circuits and methods for making same
GB1135555A (en) Improvements in or relating to semiconductor devices
US4591895A (en) CMOS circuit with separate power lines to suppress latchup
JPH0576783B2 (enExample)
JPS60137050A (ja) 半導体装置
JPS63304645A (ja) 半導体集積回路
JPH03106043A (ja) 半導体装置
JPS6081852A (ja) 半導体装置
GB1099930A (en) Improvements in or relating to semiconductor devices
GB1365261A (en) Interconnections for integrated arrangements
JPS58109254U (ja) フエ−スダウン接続形チツプ用チツプキヤリヤ−
JPH01109739A (ja) 半導体集積回路
JPS6088549U (ja) アナログ・デイジタル混在集積回路
JPS59185833U (ja) 半導体装置
JPS6313371A (ja) 半導体装置
JPS59165440A (ja) 集積回路パツケ−ジ
JPS5929051U (ja) 半導体装置
JPS60149136U (ja) 集積回路素子
JPS62274654A (ja) 入力保護装置

Legal Events

Date Code Title Description
ST Notification of lapse