DE1764567B2 - Integrierte schaltung mit auflagen auf unbenuetzten, aktiven flaechenschaltelementen - Google Patents

Integrierte schaltung mit auflagen auf unbenuetzten, aktiven flaechenschaltelementen

Info

Publication number
DE1764567B2
DE1764567B2 DE19681764567 DE1764567A DE1764567B2 DE 1764567 B2 DE1764567 B2 DE 1764567B2 DE 19681764567 DE19681764567 DE 19681764567 DE 1764567 A DE1764567 A DE 1764567A DE 1764567 B2 DE1764567 B2 DE 1764567B2
Authority
DE
Germany
Prior art keywords
components
layer
semiconductor
metal layer
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681764567
Other languages
German (de)
English (en)
Other versions
DE1764567A1 (de
Inventor
Robert Charles Bound Brook; Litus jun. Julius Trenton; N.J. Heuner (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of DE1764567A1 publication Critical patent/DE1764567A1/de
Publication of DE1764567B2 publication Critical patent/DE1764567B2/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/901—Masterslice integrated circuits comprising bipolar technology
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
    • H03K19/082—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using bipolar transistors
    • H03K19/086—Emitter coupled logic
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
    • H03K19/1733—Controllable logic circuits
    • H03K19/1735—Controllable logic circuits by wiring, e.g. uncommitted logic arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE19681764567 1968-06-17 1968-06-27 Integrierte schaltung mit auflagen auf unbenuetzten, aktiven flaechenschaltelementen Pending DE1764567B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73776068A 1968-06-17 1968-06-17

Publications (2)

Publication Number Publication Date
DE1764567A1 DE1764567A1 (de) 1972-01-27
DE1764567B2 true DE1764567B2 (de) 1972-09-28

Family

ID=24965207

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681764567 Pending DE1764567B2 (de) 1968-06-17 1968-06-27 Integrierte schaltung mit auflagen auf unbenuetzten, aktiven flaechenschaltelementen

Country Status (4)

Country Link
US (1) US3558992A (enExample)
DE (1) DE1764567B2 (enExample)
FR (1) FR2011063A1 (enExample)
GB (1) GB1251454A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702427A (en) * 1971-02-22 1972-11-07 Fairchild Camera Instr Co Electromigration resistant metallization for integrated circuits, structure and process
US3795975A (en) * 1971-12-17 1974-03-12 Hughes Aircraft Co Multi-level large scale complex integrated circuit having functional interconnected circuit routed to master patterns
US3877051A (en) * 1972-10-18 1975-04-08 Ibm Multilayer insulation integrated circuit structure
CA997481A (en) * 1972-12-29 1976-09-21 International Business Machines Corporation Dc testing of integrated circuits and a novel integrated circuit structure to facilitate such testing
GB1440512A (en) * 1973-04-30 1976-06-23 Rca Corp Universal array using complementary transistors
CA1024661A (en) * 1974-06-26 1978-01-17 International Business Machines Corporation Wireable planar integrated circuit chip structure
JPS5851425B2 (ja) * 1975-08-22 1983-11-16 株式会社日立製作所 ハンドウタイソウチ
JPS5444881A (en) * 1977-09-16 1979-04-09 Nec Corp Electrode wiring structure of integrated circuit
JPS5662352A (en) 1979-10-26 1981-05-28 Hitachi Ltd Semiconductor integrated circuit device for acoustic amplification circuit
US4467400A (en) * 1981-01-16 1984-08-21 Burroughs Corporation Wafer scale integrated circuit
US4458297A (en) * 1981-01-16 1984-07-03 Mosaic Systems, Inc. Universal interconnection substrate
EP0098173B1 (en) * 1982-06-30 1990-04-11 Fujitsu Limited Semiconductor integrated-circuit apparatus
US4746966A (en) * 1985-10-21 1988-05-24 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits
JPH0817227B2 (ja) * 1987-04-30 1996-02-21 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 個性化可能な半導体チップ
US4880754A (en) * 1987-07-06 1989-11-14 International Business Machines Corp. Method for providing engineering changes to LSI PLAs
JPH03218668A (ja) * 1989-11-24 1991-09-26 Nec Ic Microcomput Syst Ltd 半導体集積回路装置
US5322812A (en) * 1991-03-20 1994-06-21 Crosspoint Solutions, Inc. Improved method of fabricating antifuses in an integrated circuit device and resulting structure

Also Published As

Publication number Publication date
US3558992A (en) 1971-01-26
DE1764567A1 (de) 1972-01-27
FR2011063A1 (enExample) 1970-02-27
GB1251454A (enExample) 1971-10-27

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