JPS60149136U - 集積回路素子 - Google Patents

集積回路素子

Info

Publication number
JPS60149136U
JPS60149136U JP3616384U JP3616384U JPS60149136U JP S60149136 U JPS60149136 U JP S60149136U JP 3616384 U JP3616384 U JP 3616384U JP 3616384 U JP3616384 U JP 3616384U JP S60149136 U JPS60149136 U JP S60149136U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit elements
chip
main surface
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3616384U
Other languages
English (en)
Inventor
小屋　啓
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP3616384U priority Critical patent/JPS60149136U/ja
Publication of JPS60149136U publication Critical patent/JPS60149136U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
は本考案の一実施例の要部断面図、第２図すは試験電極
部の部分拡大平面図である。 １、　２．３・・・・・・機能ブロック、４・・・・・
・外部端子に接続される電−１５・・・・・・機能ブロ
ック電極、６．６′・・・・・・配線、７，８・・・・
・・試験電極、１０・・・・・・半導体基板、１１・・
・・・・拡散層、１２・・・・・・外部端子に接続され
る電極、１３・・・・・・第１配線層、１４　　　　　
゛・・・・・・層間絶縁膜、１５・・・・・・第２配線
層、１５′・・・・・・機能ブロック間の結合配線、１
６・・・・・・表面保護膜ミ　１７・・・・・・試験電
極、１８・・・・・・機能ブロック境目、１９・・・・
・・探針。

Claims (1)

    【実用新案登録請求の範囲】
  1. 主表面上の外端部に電極を有する多層配線構造のＩＣチ
    ップにおいて、任意の層の配線と接続された電極をＩＣ
    チップの主表面の最上層の任意の位置に形成し試験電極
    としたことを特徴とする集積回路素子。
JP3616384U 1984-03-14 1984-03-14 集積回路素子 Pending JPS60149136U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3616384U JPS60149136U (ja) 1984-03-14 1984-03-14 集積回路素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3616384U JPS60149136U (ja) 1984-03-14 1984-03-14 集積回路素子

Publications (1)

Publication Number Publication Date
JPS60149136U true JPS60149136U (ja) 1985-10-03

Family

ID=30541100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3616384U Pending JPS60149136U (ja) 1984-03-14 1984-03-14 集積回路素子

Country Status (1)

Country Link
JP (1) JPS60149136U (ja)

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