FI81690C - Foerfarande av en jaemn foerdelningstaethet. - Google Patents
Foerfarande av en jaemn foerdelningstaethet. Download PDFInfo
- Publication number
- FI81690C FI81690C FI853637A FI853637A FI81690C FI 81690 C FI81690 C FI 81690C FI 853637 A FI853637 A FI 853637A FI 853637 A FI853637 A FI 853637A FI 81690 C FI81690 C FI 81690C
- Authority
- FI
- Finland
- Prior art keywords
- pattern
- film
- master pattern
- master
- mask pattern
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 33
- 238000009826 distribution Methods 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 18
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 3
- 238000009827 uniform distribution Methods 0.000 claims description 3
- 238000005065 mining Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000013461 design Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 11
- 238000011960 computer-aided design Methods 0.000 description 10
- AWZOLILCOUMRDG-UHFFFAOYSA-N edifenphos Chemical compound C=1C=CC=CC=1SP(=O)(OCC)SC1=CC=CC=C1 AWZOLILCOUMRDG-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000007689 inspection Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
- G03C5/02—Sensitometric processes, e.g. determining sensitivity, colour sensitivity, gradation, graininess, density; Making sensitometric wedges
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65433584 | 1984-09-24 | ||
| US06/654,335 US4627005A (en) | 1984-09-24 | 1984-09-24 | Equal density distribution process |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| FI853637A0 FI853637A0 (fi) | 1985-09-23 |
| FI853637L FI853637L (fi) | 1986-03-25 |
| FI81690B FI81690B (fi) | 1990-07-31 |
| FI81690C true FI81690C (fi) | 1990-11-12 |
Family
ID=24624440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI853637A FI81690C (fi) | 1984-09-24 | 1985-09-23 | Foerfarande av en jaemn foerdelningstaethet. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4627005A (enExample) |
| EP (1) | EP0176088B1 (enExample) |
| JP (1) | JPS61105889A (enExample) |
| KR (1) | KR900005307B1 (enExample) |
| AU (1) | AU586640B2 (enExample) |
| CA (1) | CA1232972A (enExample) |
| DE (1) | DE3583475D1 (enExample) |
| FI (1) | FI81690C (enExample) |
| YU (1) | YU172985A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4584337A (en) * | 1984-12-18 | 1986-04-22 | Dow Corning Corporation | Aqueous emulsions containing hydrophilic silicone-organic copolymers |
| US7146593B2 (en) * | 2003-11-04 | 2006-12-05 | Freescale Semiconductor, Inc. | Method of implementing polishing uniformity and modifying layout data |
| EP3885961A1 (en) * | 2020-03-26 | 2021-09-29 | Elsyca N.V. | Pcb metal balancing |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2414509C3 (de) * | 1974-03-26 | 1979-02-01 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung von Druckoriginalen für Leiterbahnanordnungen |
| AU2747784A (en) * | 1979-05-24 | 1984-08-16 | Eocom Corp. | Laser image producing system |
| US4336320A (en) * | 1981-03-12 | 1982-06-22 | Honeywell Inc. | Process for dielectric stenciled microcircuits |
| US4571072A (en) * | 1983-09-30 | 1986-02-18 | Honeywell Information Systems Inc. | System and method for making changes to printed wiring boards |
-
1984
- 1984-09-24 US US06/654,335 patent/US4627005A/en not_active Expired - Fee Related
-
1985
- 1985-09-23 AU AU47695/85A patent/AU586640B2/en not_active Ceased
- 1985-09-23 CA CA000491376A patent/CA1232972A/en not_active Expired
- 1985-09-23 FI FI853637A patent/FI81690C/fi not_active IP Right Cessation
- 1985-09-24 EP EP85112136A patent/EP0176088B1/en not_active Expired - Lifetime
- 1985-09-24 JP JP60210908A patent/JPS61105889A/ja active Granted
- 1985-09-24 KR KR1019850007002A patent/KR900005307B1/ko not_active Expired
- 1985-09-24 DE DE8585112136T patent/DE3583475D1/de not_active Expired - Lifetime
- 1985-11-01 YU YU01729/85A patent/YU172985A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US4627005A (en) | 1986-12-02 |
| CA1232972A (en) | 1988-02-16 |
| KR860002940A (ko) | 1986-04-30 |
| EP0176088A3 (en) | 1987-03-18 |
| FI853637L (fi) | 1986-03-25 |
| YU172985A (en) | 1989-02-28 |
| AU586640B2 (en) | 1989-07-20 |
| KR900005307B1 (ko) | 1990-07-27 |
| AU4769585A (en) | 1986-04-10 |
| FI853637A0 (fi) | 1985-09-23 |
| FI81690B (fi) | 1990-07-31 |
| JPH0431572B2 (enExample) | 1992-05-26 |
| DE3583475D1 (de) | 1991-08-22 |
| JPS61105889A (ja) | 1986-05-23 |
| EP0176088B1 (en) | 1991-07-17 |
| EP0176088A2 (en) | 1986-04-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM | Patent lapsed | ||
| MM | Patent lapsed |
Owner name: HONEYWELL INFORMATION SYSTEMS INC. |