DE3583475D1 - Verfahren zum aufbringen leitender schichten in gleichmaessig dichter verteilung. - Google Patents

Verfahren zum aufbringen leitender schichten in gleichmaessig dichter verteilung.

Info

Publication number
DE3583475D1
DE3583475D1 DE8585112136T DE3583475T DE3583475D1 DE 3583475 D1 DE3583475 D1 DE 3583475D1 DE 8585112136 T DE8585112136 T DE 8585112136T DE 3583475 T DE3583475 T DE 3583475T DE 3583475 D1 DE3583475 D1 DE 3583475D1
Authority
DE
Germany
Prior art keywords
conductive layers
dense distribution
applying conductive
evenly dense
evenly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8585112136T
Other languages
German (de)
English (en)
Inventor
John P Doherty
David L Dufour
Russell E Gebo
Michael J Sullivan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull HN Information Systems Inc
Original Assignee
Bull HN Information Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull HN Information Systems Inc filed Critical Bull HN Information Systems Inc
Application granted granted Critical
Publication of DE3583475D1 publication Critical patent/DE3583475D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/02—Sensitometric processes, e.g. determining sensitivity, colour sensitivity, gradation, graininess, density; Making sensitometric wedges
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
DE8585112136T 1984-09-24 1985-09-24 Verfahren zum aufbringen leitender schichten in gleichmaessig dichter verteilung. Expired - Lifetime DE3583475D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/654,335 US4627005A (en) 1984-09-24 1984-09-24 Equal density distribution process

Publications (1)

Publication Number Publication Date
DE3583475D1 true DE3583475D1 (de) 1991-08-22

Family

ID=24624440

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585112136T Expired - Lifetime DE3583475D1 (de) 1984-09-24 1985-09-24 Verfahren zum aufbringen leitender schichten in gleichmaessig dichter verteilung.

Country Status (9)

Country Link
US (1) US4627005A (enExample)
EP (1) EP0176088B1 (enExample)
JP (1) JPS61105889A (enExample)
KR (1) KR900005307B1 (enExample)
AU (1) AU586640B2 (enExample)
CA (1) CA1232972A (enExample)
DE (1) DE3583475D1 (enExample)
FI (1) FI81690C (enExample)
YU (1) YU172985A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584337A (en) * 1984-12-18 1986-04-22 Dow Corning Corporation Aqueous emulsions containing hydrophilic silicone-organic copolymers
US7146593B2 (en) * 2003-11-04 2006-12-05 Freescale Semiconductor, Inc. Method of implementing polishing uniformity and modifying layout data
EP3885961A1 (en) * 2020-03-26 2021-09-29 Elsyca N.V. Pcb metal balancing

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2414509C3 (de) * 1974-03-26 1979-02-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung von Druckoriginalen für Leiterbahnanordnungen
AU2747784A (en) * 1979-05-24 1984-08-16 Eocom Corp. Laser image producing system
US4336320A (en) * 1981-03-12 1982-06-22 Honeywell Inc. Process for dielectric stenciled microcircuits
US4571072A (en) * 1983-09-30 1986-02-18 Honeywell Information Systems Inc. System and method for making changes to printed wiring boards

Also Published As

Publication number Publication date
US4627005A (en) 1986-12-02
CA1232972A (en) 1988-02-16
KR860002940A (ko) 1986-04-30
EP0176088A3 (en) 1987-03-18
FI81690C (fi) 1990-11-12
FI853637L (fi) 1986-03-25
YU172985A (en) 1989-02-28
AU586640B2 (en) 1989-07-20
KR900005307B1 (ko) 1990-07-27
AU4769585A (en) 1986-04-10
FI853637A0 (fi) 1985-09-23
FI81690B (fi) 1990-07-31
JPH0431572B2 (enExample) 1992-05-26
JPS61105889A (ja) 1986-05-23
EP0176088B1 (en) 1991-07-17
EP0176088A2 (en) 1986-04-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee