JPS61105889A - マスタ−・ア−トワ−クの分布密度の均等化方法 - Google Patents

マスタ−・ア−トワ−クの分布密度の均等化方法

Info

Publication number
JPS61105889A
JPS61105889A JP60210908A JP21090885A JPS61105889A JP S61105889 A JPS61105889 A JP S61105889A JP 60210908 A JP60210908 A JP 60210908A JP 21090885 A JP21090885 A JP 21090885A JP S61105889 A JPS61105889 A JP S61105889A
Authority
JP
Japan
Prior art keywords
artwork
forming
master
pattern
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60210908A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0431572B2 (enExample
Inventor
ジヨン・ピー・ドハーテイ
デービツド・エル・ダフオー
ラツセル・イー・ゲボ
マイケル・ジエイ・サリバン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull HN Information Systems Italia SpA
Bull HN Information Systems Inc
Original Assignee
Honeywell Information Systems Italia SpA
Honeywell Information Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Information Systems Italia SpA, Honeywell Information Systems Inc filed Critical Honeywell Information Systems Italia SpA
Publication of JPS61105889A publication Critical patent/JPS61105889A/ja
Publication of JPH0431572B2 publication Critical patent/JPH0431572B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/02—Sensitometric processes, e.g. determining sensitivity, colour sensitivity, gradation, graininess, density; Making sensitometric wedges
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
JP60210908A 1984-09-24 1985-09-24 マスタ−・ア−トワ−クの分布密度の均等化方法 Granted JPS61105889A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US654335 1984-09-24
US06/654,335 US4627005A (en) 1984-09-24 1984-09-24 Equal density distribution process

Publications (2)

Publication Number Publication Date
JPS61105889A true JPS61105889A (ja) 1986-05-23
JPH0431572B2 JPH0431572B2 (enExample) 1992-05-26

Family

ID=24624440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60210908A Granted JPS61105889A (ja) 1984-09-24 1985-09-24 マスタ−・ア−トワ−クの分布密度の均等化方法

Country Status (9)

Country Link
US (1) US4627005A (enExample)
EP (1) EP0176088B1 (enExample)
JP (1) JPS61105889A (enExample)
KR (1) KR900005307B1 (enExample)
AU (1) AU586640B2 (enExample)
CA (1) CA1232972A (enExample)
DE (1) DE3583475D1 (enExample)
FI (1) FI81690C (enExample)
YU (1) YU172985A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584337A (en) * 1984-12-18 1986-04-22 Dow Corning Corporation Aqueous emulsions containing hydrophilic silicone-organic copolymers
US7146593B2 (en) * 2003-11-04 2006-12-05 Freescale Semiconductor, Inc. Method of implementing polishing uniformity and modifying layout data
EP3885961A1 (en) * 2020-03-26 2021-09-29 Elsyca N.V. Pcb metal balancing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2414509A1 (de) * 1974-03-26 1975-10-16 Siemens Ag Verfahren zur herstellung von druckoriginalen fuer leiterbahnanordnungen

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2747784A (en) * 1979-05-24 1984-08-16 Eocom Corp. Laser image producing system
US4336320A (en) * 1981-03-12 1982-06-22 Honeywell Inc. Process for dielectric stenciled microcircuits
US4571072A (en) * 1983-09-30 1986-02-18 Honeywell Information Systems Inc. System and method for making changes to printed wiring boards

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2414509A1 (de) * 1974-03-26 1975-10-16 Siemens Ag Verfahren zur herstellung von druckoriginalen fuer leiterbahnanordnungen

Also Published As

Publication number Publication date
US4627005A (en) 1986-12-02
CA1232972A (en) 1988-02-16
KR860002940A (ko) 1986-04-30
EP0176088A3 (en) 1987-03-18
FI81690C (fi) 1990-11-12
FI853637L (fi) 1986-03-25
YU172985A (en) 1989-02-28
AU586640B2 (en) 1989-07-20
KR900005307B1 (ko) 1990-07-27
AU4769585A (en) 1986-04-10
FI853637A0 (fi) 1985-09-23
FI81690B (fi) 1990-07-31
JPH0431572B2 (enExample) 1992-05-26
DE3583475D1 (de) 1991-08-22
EP0176088B1 (en) 1991-07-17
EP0176088A2 (en) 1986-04-02

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