FI20126015A - Nanotimantteja sisältävät termoplastiset lämpökomposiitit - Google Patents
Nanotimantteja sisältävät termoplastiset lämpökomposiitit Download PDFInfo
- Publication number
- FI20126015A FI20126015A FI20126015A FI20126015A FI20126015A FI 20126015 A FI20126015 A FI 20126015A FI 20126015 A FI20126015 A FI 20126015A FI 20126015 A FI20126015 A FI 20126015A FI 20126015 A FI20126015 A FI 20126015A
- Authority
- FI
- Finland
- Prior art keywords
- containing thermoplastic
- thermoplastic heat
- heat composite
- nanodiamonds containing
- nanodiamonds
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/14—Carbides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Nanotechnology (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Carbon And Carbon Compounds (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20126015A FI124314B (fi) | 2012-09-28 | 2012-09-28 | Nanotimantteja sisältävät termoplastiset lämpökomposiitit |
JP2015533653A JP6453754B2 (ja) | 2012-09-28 | 2013-09-30 | ナノダイヤモンド含有熱可塑性熱複合材料 |
EP13783078.2A EP2900747B1 (en) | 2012-09-28 | 2013-09-30 | Nanodiamonds containing thermoplastic thermal composites |
KR1020157011191A KR102159729B1 (ko) | 2012-09-28 | 2013-09-30 | 나노다이아몬드 함유 열가소성 열 복합체 |
US14/041,621 US9085723B2 (en) | 2012-09-28 | 2013-09-30 | Nanodiamonds containing thermoplastic thermal composites |
PCT/FI2013/050947 WO2014049212A1 (en) | 2012-09-28 | 2013-09-30 | Nanodiamonds containing thermoplastic thermal composites |
CN201380050518.XA CN104781325B (zh) | 2012-09-28 | 2013-09-30 | 含有纳米金刚石的热塑性热复合材料 |
US14/723,583 US9598623B2 (en) | 2012-09-28 | 2015-05-28 | Nanodiamonds containing thermoplastic thermal composites |
JP2017247361A JP2018100412A (ja) | 2012-09-28 | 2017-12-25 | ナノダイヤモンド含有熱可塑性熱複合材料 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20126015 | 2012-09-28 | ||
FI20126015A FI124314B (fi) | 2012-09-28 | 2012-09-28 | Nanotimantteja sisältävät termoplastiset lämpökomposiitit |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20126015A true FI20126015A (fi) | 2014-03-29 |
FI124314B FI124314B (fi) | 2014-06-30 |
Family
ID=50384301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20126015A FI124314B (fi) | 2012-09-28 | 2012-09-28 | Nanotimantteja sisältävät termoplastiset lämpökomposiitit |
Country Status (7)
Country | Link |
---|---|
US (2) | US9085723B2 (fi) |
EP (1) | EP2900747B1 (fi) |
JP (2) | JP6453754B2 (fi) |
KR (1) | KR102159729B1 (fi) |
CN (1) | CN104781325B (fi) |
FI (1) | FI124314B (fi) |
WO (1) | WO2014049212A1 (fi) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107922746A (zh) * | 2015-09-01 | 2018-04-17 | 株式会社大赛璐 | 树脂组合物 |
Families Citing this family (29)
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WO2014186460A1 (en) * | 2013-05-14 | 2014-11-20 | Eaton Corporation | Multi additive multifunctional composite for use in a non-metallic fuel conveyance system |
JP2015048414A (ja) * | 2013-09-02 | 2015-03-16 | 日東電工株式会社 | 絶縁性熱伝導シート |
WO2016014024A1 (en) * | 2014-07-22 | 2016-01-28 | Nano Mpi Holdings, Inc. | High strength resin system formulated with nanodiamonds and method of making same |
US20160319176A1 (en) * | 2014-09-17 | 2016-11-03 | National University Corporation Nagoya University | Thermally conducting composition and method for producing the same |
CN105273401A (zh) * | 2015-05-05 | 2016-01-27 | 孔作万 | 一种掺杂金刚石氮化物共混pa散热材料及其制备方法 |
CN105462220A (zh) * | 2015-12-09 | 2016-04-06 | 无锡普瑞明思机械制造有限公司 | 一种用于联轴器的复合机械材料 |
CN105504786A (zh) * | 2015-12-09 | 2016-04-20 | 无锡普瑞明思机械制造有限公司 | 一种用于齿轮的复合机械材料 |
CN105419237A (zh) * | 2015-12-17 | 2016-03-23 | 广东生益科技股份有限公司 | 一种热固性树脂组合物以及含有它的预浸料、层压板和印制电路板 |
CA3013027C (en) | 2016-02-01 | 2020-03-24 | Cabot Corporation | Thermally conductive polymer compositions containing carbon black |
WO2017196259A1 (en) * | 2016-05-10 | 2017-11-16 | Republic Polytechnic | A heat sink, a filler for a heat sink and methods thereof |
CN106280049B (zh) * | 2016-08-15 | 2019-01-29 | 江苏泰特尔新材料科技有限公司 | 一种高导热聚苯乙烯树脂基复合材料及其制备方法 |
WO2018079597A1 (ja) * | 2016-10-28 | 2018-05-03 | 株式会社ダイセル | 樹脂用添加剤、及び樹脂組成物 |
US20180148860A1 (en) * | 2016-11-29 | 2018-05-31 | The H.D. Lee Company, Inc. | Method for preparing nanodiamond-containing thermoplastic fibers and the use of such fibers in yarns and fabrics |
CN106800765B (zh) * | 2017-01-21 | 2018-06-08 | 郑州人造金刚石及制品工程技术研究中心有限公司 | 一种用于智能手机外壳的聚碳酸酯材料及其制备方法和应用 |
CN107383657A (zh) * | 2017-08-01 | 2017-11-24 | 惠安县科联农业科技有限公司 | 一种耐高温抗冲击塑料及其制备方法 |
JP6636069B2 (ja) | 2017-09-08 | 2020-01-29 | 株式会社ダイセル | 反射防止フィルム |
CN107698966A (zh) * | 2017-11-07 | 2018-02-16 | 广西小草信息产业有限责任公司 | 一种导热新材料及其制备方法 |
KR102137550B1 (ko) * | 2017-12-12 | 2020-07-24 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치 |
EP3502324B1 (en) * | 2017-12-22 | 2020-10-28 | Carbodeon Ltd Oy | A filament and a 3d printed item |
KR20210016363A (ko) * | 2018-05-31 | 2021-02-15 | 세키스이가가쿠 고교가부시키가이샤 | 방열 조성물, 방열 부재, 및 방열 부재용 필러 집합체 |
CA3047635C (en) * | 2018-06-27 | 2023-11-28 | Mj Research & Development, Lp | Organic lubricant |
CN109135263A (zh) * | 2018-07-17 | 2019-01-04 | 全椒祥瑞塑胶有限公司 | 一种汽车内饰用抗弯曲聚酰胺树脂的制备方法 |
EP3831891A4 (en) * | 2018-07-30 | 2022-04-27 | Daicel Corporation | SURFACE MODIFIED NANODIAMOND AND DISPERSION AND COMPOSITE WITH SURFACE MODIFIED NANODIAMOND |
KR102255134B1 (ko) * | 2019-11-22 | 2021-05-24 | 피아이첨단소재 주식회사 | 열전도 폴리이미드 복합 분말 및 그 제조방법 |
CN111808410A (zh) * | 2020-06-29 | 2020-10-23 | 山东国瓷功能材料股份有限公司 | Pc/pmma复合材料、其制备方法及电子终端外壳 |
US20220025239A1 (en) * | 2020-07-27 | 2022-01-27 | Google Llc | Thermal interface material and method for making the same |
US20220025241A1 (en) * | 2020-07-27 | 2022-01-27 | Google Llc | Thermal interface material and method for making the same |
FR3121685A1 (fr) | 2021-04-07 | 2022-10-14 | Eaton Intelligent Power Limited | matériau composite électriquement conducteur à haute ténacité pour circuit de carburant d'aéronef |
KR102642300B1 (ko) * | 2021-06-30 | 2024-02-29 | 주식회사 에스더블유케미컬즈 | 고방열 나노다이아몬드 및 그 제조 방법 |
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JPH05117596A (ja) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | 熱圧着可能な高熱伝導性フイルム状接着剤 |
JPH05326743A (ja) * | 1992-05-19 | 1993-12-10 | Sumitomo Electric Ind Ltd | 半導体素子搭載用絶縁放熱基板 |
JP4030399B2 (ja) * | 2002-09-25 | 2008-01-09 | 電気化学工業株式会社 | 自己粘着性相変化型放熱部材 |
DE10334856B4 (de) * | 2003-07-29 | 2007-06-06 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Verbundformteil und Verfahren zu seiner Herstellung |
DE102004058305B3 (de) | 2004-12-02 | 2006-05-18 | Infineon Technologies Ag | Halbleiterbauteil mit einem eine Passivierungsschicht aufweisenden Halbleiterchip sowie Verfahren zur Herstellung desselben |
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CA2692017A1 (en) * | 2007-07-02 | 2009-03-26 | Drexel University | Nanodiamond compositions and methods of making and using thereof |
TWI349031B (en) * | 2008-07-23 | 2011-09-21 | Kunshan Nano New Marial Technology Co Ltd | Nanodiamond thermal grease |
US8728429B2 (en) * | 2009-03-02 | 2014-05-20 | International Technology Center | Production of conductive nanodiamond by dynamic synthesis approaches |
US8097319B2 (en) | 2009-03-10 | 2012-01-17 | Xerox Corporation | Diamond-containing nanocomposite interfacial layer in fusers |
JP5368176B2 (ja) * | 2009-06-09 | 2013-12-18 | 富士シリシア化学株式会社 | 吸着材、および吸着材の製造方法 |
JP5554947B2 (ja) * | 2009-07-22 | 2014-07-23 | 株式会社カネカ | 熱伝導性熱可塑性樹脂組成物、そのシート又はフィルム、ホットメルト接着剤 |
US8299159B2 (en) | 2009-08-17 | 2012-10-30 | Laird Technologies, Inc. | Highly thermally-conductive moldable thermoplastic composites and compositions |
KR101142552B1 (ko) * | 2009-12-23 | 2012-05-08 | 한국타이어 주식회사 | 타이어용 고무 조성물 및 이를 이용하여 제조한 타이어 |
JP5740097B2 (ja) * | 2010-04-15 | 2015-06-24 | 株式会社カネカ | ヒートシンク用高熱伝導性樹脂成形体 |
JP5676986B2 (ja) * | 2010-09-10 | 2015-02-25 | 日立化成株式会社 | 波長変換型太陽電池モジュール |
JP5608491B2 (ja) * | 2010-09-13 | 2014-10-15 | 東芝テック株式会社 | 導電パターンの形成方法および印刷物 |
KR101226246B1 (ko) * | 2010-10-01 | 2013-02-01 | 주식회사 휘닉스소재 | 복합재 조성물, 및 이를 포함하는 전자 장치용 도막 및 전자 장치 |
JP5284332B2 (ja) * | 2010-10-22 | 2013-09-11 | ビジョン開発株式会社 | 熱伝導性ゴム組成物及び空気入りタイヤ |
US8475879B1 (en) | 2010-10-27 | 2013-07-02 | International Technology Center | Polymer nanocomposites with improved resistance to ionizing radiation |
KR101206445B1 (ko) * | 2010-10-28 | 2012-11-29 | 단국대학교 산학협력단 | 저용융점도 축중합 고분자 및 이의 제조방법 |
JP2012186361A (ja) * | 2011-03-07 | 2012-09-27 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体素子 |
-
2012
- 2012-09-28 FI FI20126015A patent/FI124314B/fi active IP Right Grant
-
2013
- 2013-09-30 US US14/041,621 patent/US9085723B2/en active Active
- 2013-09-30 KR KR1020157011191A patent/KR102159729B1/ko active IP Right Grant
- 2013-09-30 JP JP2015533653A patent/JP6453754B2/ja active Active
- 2013-09-30 CN CN201380050518.XA patent/CN104781325B/zh active Active
- 2013-09-30 EP EP13783078.2A patent/EP2900747B1/en active Active
- 2013-09-30 WO PCT/FI2013/050947 patent/WO2014049212A1/en active Application Filing
-
2015
- 2015-05-28 US US14/723,583 patent/US9598623B2/en active Active
-
2017
- 2017-12-25 JP JP2017247361A patent/JP2018100412A/ja not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107922746A (zh) * | 2015-09-01 | 2018-04-17 | 株式会社大赛璐 | 树脂组合物 |
CN107922746B (zh) * | 2015-09-01 | 2022-05-03 | 株式会社大赛璐 | 树脂组合物 |
Also Published As
Publication number | Publication date |
---|---|
JP2015532319A (ja) | 2015-11-09 |
EP2900747A1 (en) | 2015-08-05 |
KR20150065789A (ko) | 2015-06-15 |
US9085723B2 (en) | 2015-07-21 |
CN104781325A (zh) | 2015-07-15 |
CN104781325B (zh) | 2017-09-26 |
JP6453754B2 (ja) | 2019-01-16 |
JP2018100412A (ja) | 2018-06-28 |
US9598623B2 (en) | 2017-03-21 |
FI124314B (fi) | 2014-06-30 |
EP2900747B1 (en) | 2016-09-07 |
WO2014049212A1 (en) | 2014-04-03 |
US20150259591A1 (en) | 2015-09-17 |
US20140091253A1 (en) | 2014-04-03 |
KR102159729B1 (ko) | 2020-09-25 |
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