FI20030338A0 - Kapacitiv accelerationsgivarkonstruktion - Google Patents
Kapacitiv accelerationsgivarkonstruktionInfo
- Publication number
- FI20030338A0 FI20030338A0 FI20030338A FI20030338A FI20030338A0 FI 20030338 A0 FI20030338 A0 FI 20030338A0 FI 20030338 A FI20030338 A FI 20030338A FI 20030338 A FI20030338 A FI 20030338A FI 20030338 A0 FI20030338 A0 FI 20030338A0
- Authority
- FI
- Finland
- Prior art keywords
- accelerator sensor
- sensor construction
- capacitive
- capacitive accelerator
- construction
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/12—Circuits for multi-testers, i.e. multimeters, e.g. for measuring voltage, current, or impedance at will
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
- B81B3/0013—Structures dimensioned for mechanical prevention of stiction, e.g. spring with increased stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/11—Treatments for avoiding stiction of elastic or moving parts of MEMS
- B81C2201/112—Depositing an anti-stiction or passivation coating, e.g. on the elastic or moving parts
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20030338A FI119527B (sv) | 2003-03-05 | 2003-03-05 | Kapacitiv accelerationssensor |
US10/774,688 US6938485B2 (en) | 2003-03-05 | 2004-02-10 | Capacitive acceleration sensor |
JP2006505612A JP2006519387A (ja) | 2003-03-05 | 2004-02-11 | 容量型加速度センサー |
EP04710048.2A EP1599736B1 (en) | 2003-03-05 | 2004-02-11 | Capacitive acceleration sensor |
CH01429/05A CH697268B1 (de) | 2003-03-05 | 2004-02-11 | Kapazitiver Beschleunigungssensor. |
PCT/FI2004/000062 WO2004079373A1 (en) | 2003-03-05 | 2004-02-11 | Capacitive acceleration sensor |
NO20054579A NO346493B1 (no) | 2003-03-05 | 2004-02-11 | Kapasitiv akselerasjonssensor |
KR1020057016200A KR101062631B1 (ko) | 2003-03-05 | 2004-02-11 | 정전용량 가속도 센서 |
DE112004000353T DE112004000353T5 (de) | 2003-03-05 | 2004-02-11 | Kapazitiver Beschleunigungssensor |
JP2010173006A JP2011022149A (ja) | 2003-03-05 | 2010-07-30 | 容量型加速度センサー |
JP2013039942A JP5748792B2 (ja) | 2003-03-05 | 2013-02-28 | 容量型加速度センサー |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20030338A FI119527B (sv) | 2003-03-05 | 2003-03-05 | Kapacitiv accelerationssensor |
FI20030338 | 2003-03-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20030338A0 true FI20030338A0 (sv) | 2003-03-05 |
FI119527B FI119527B (sv) | 2008-12-15 |
Family
ID=8565768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20030338A FI119527B (sv) | 2003-03-05 | 2003-03-05 | Kapacitiv accelerationssensor |
Country Status (9)
Country | Link |
---|---|
US (1) | US6938485B2 (sv) |
EP (1) | EP1599736B1 (sv) |
JP (3) | JP2006519387A (sv) |
KR (1) | KR101062631B1 (sv) |
CH (1) | CH697268B1 (sv) |
DE (1) | DE112004000353T5 (sv) |
FI (1) | FI119527B (sv) |
NO (1) | NO346493B1 (sv) |
WO (1) | WO2004079373A1 (sv) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011112389A (ja) * | 2009-11-24 | 2011-06-09 | Panasonic Electric Works Co Ltd | 加速度センサ |
US9261530B2 (en) | 2009-11-24 | 2016-02-16 | Panasonic Intellectual Property Management Co., Ltd. | Acceleration sensor |
JP5716149B2 (ja) * | 2009-11-24 | 2015-05-13 | パナソニックIpマネジメント株式会社 | 加速度センサ |
JP5789737B2 (ja) * | 2009-11-24 | 2015-10-07 | パナソニックIpマネジメント株式会社 | 加速度センサ |
JP2011112392A (ja) * | 2009-11-24 | 2011-06-09 | Panasonic Electric Works Co Ltd | 加速度センサ |
JP2011112390A (ja) * | 2009-11-24 | 2011-06-09 | Panasonic Electric Works Co Ltd | 加速度センサ |
JP2012008022A (ja) * | 2010-06-25 | 2012-01-12 | Panasonic Electric Works Co Ltd | 加速度センサ |
US9065358B2 (en) | 2011-07-11 | 2015-06-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS structure and method of forming same |
US9085456B2 (en) | 2012-01-16 | 2015-07-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Support structure for TSV in MEMS structure |
JP6155832B2 (ja) * | 2013-05-16 | 2017-07-05 | セイコーエプソン株式会社 | センサー素子、電子機器、および移動体 |
JP6661941B2 (ja) * | 2015-09-29 | 2020-03-11 | セイコーエプソン株式会社 | 物理量センサー、物理量センサーの製造方法、センサーデバイス、電子機器および移動体 |
US10384929B2 (en) | 2016-03-22 | 2019-08-20 | Murata Manufacturing Co., Ltd. | Impact element for a sensor device and a manufacturing method |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03296662A (ja) * | 1990-04-16 | 1991-12-27 | Ricoh Co Ltd | 微小機械素子 |
JP2816235B2 (ja) * | 1990-05-30 | 1998-10-27 | 株式会社日立製作所 | 半導体加速度センサとそれを用いたエアバックシステムおよびサスペンション制御システム |
JP2804196B2 (ja) * | 1991-10-18 | 1998-09-24 | 株式会社日立製作所 | マイクロセンサ及びそれを用いた制御システム |
JPH05273231A (ja) * | 1992-03-27 | 1993-10-22 | Toyoda Mach Works Ltd | 容量型加速度センサ |
JPH06213924A (ja) | 1993-01-13 | 1994-08-05 | Hitachi Ltd | トランスジューサ、これを利用したマイクロセンサ、車両制御システム |
JPH0744037A (ja) * | 1993-08-03 | 1995-02-14 | Canon Inc | 加熱定着装置の再生方法 |
US5644455A (en) | 1993-12-30 | 1997-07-01 | Seagate Technology, Inc. | Amorphous diamond-like carbon gaps in magnetoresistive heads |
EP0805985B1 (de) * | 1995-01-24 | 2001-07-18 | Infineon Technologies AG | Mikromechanisches bauelement |
US6096149A (en) | 1997-04-21 | 2000-08-01 | Ford Global Technologies, Inc. | Method for fabricating adhesion-resistant micromachined devices |
JPH11260014A (ja) * | 1998-03-10 | 1999-09-24 | Fujitsu Ltd | グライド・ハイト評価ヘッド |
JP4465051B2 (ja) * | 1998-05-01 | 2010-05-19 | テルモ株式会社 | 生体留置用ステント |
US6105428A (en) * | 1998-12-10 | 2000-08-22 | Motorola, Inc. | Sensor and method of use |
JP3593276B2 (ja) * | 1998-12-24 | 2004-11-24 | シャープ株式会社 | 情報記録装置 |
JP4676589B2 (ja) * | 2000-03-24 | 2011-04-27 | 東ソー・クォーツ株式会社 | 真空ピンセット |
JP3756373B2 (ja) * | 2000-03-27 | 2006-03-15 | 株式会社日本自動車部品総合研究所 | 絶縁性基体用保護膜、薄膜積層体および薄膜センサ |
JP3840058B2 (ja) * | 2000-04-07 | 2006-11-01 | キヤノン株式会社 | マイクロレンズ、固体撮像装置及びそれらの製造方法 |
DE10051315A1 (de) * | 2000-10-17 | 2002-04-18 | Bosch Gmbh Robert | Mikromechanisches Bauelement und entsprechendes Hersellungsverfahren |
-
2003
- 2003-03-05 FI FI20030338A patent/FI119527B/sv not_active IP Right Cessation
-
2004
- 2004-02-10 US US10/774,688 patent/US6938485B2/en not_active Expired - Lifetime
- 2004-02-11 DE DE112004000353T patent/DE112004000353T5/de not_active Ceased
- 2004-02-11 NO NO20054579A patent/NO346493B1/no unknown
- 2004-02-11 JP JP2006505612A patent/JP2006519387A/ja active Pending
- 2004-02-11 KR KR1020057016200A patent/KR101062631B1/ko active IP Right Grant
- 2004-02-11 CH CH01429/05A patent/CH697268B1/de unknown
- 2004-02-11 EP EP04710048.2A patent/EP1599736B1/en not_active Expired - Lifetime
- 2004-02-11 WO PCT/FI2004/000062 patent/WO2004079373A1/en active Application Filing
-
2010
- 2010-07-30 JP JP2010173006A patent/JP2011022149A/ja active Pending
-
2013
- 2013-02-28 JP JP2013039942A patent/JP5748792B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20040226374A1 (en) | 2004-11-18 |
NO346493B1 (no) | 2022-09-05 |
JP2013152230A (ja) | 2013-08-08 |
FI119527B (sv) | 2008-12-15 |
JP5748792B2 (ja) | 2015-07-15 |
KR101062631B1 (ko) | 2011-09-07 |
CH697268B1 (de) | 2008-07-31 |
DE112004000353T5 (de) | 2006-01-26 |
WO2004079373A1 (en) | 2004-09-16 |
JP2006519387A (ja) | 2006-08-24 |
NO20054579L (no) | 2005-10-05 |
KR20050107478A (ko) | 2005-11-11 |
EP1599736B1 (en) | 2018-04-04 |
US6938485B2 (en) | 2005-09-06 |
EP1599736A1 (en) | 2005-11-30 |
JP2011022149A (ja) | 2011-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Patent granted |
Ref document number: 119527 Country of ref document: FI |
|
PC | Transfer of assignment of patent |
Owner name: MURATA ELECTRONICS OY |
|
MM | Patent lapsed |