ES535239A0 - Un circuito integrado fotodetector - Google Patents

Un circuito integrado fotodetector

Info

Publication number
ES535239A0
ES535239A0 ES535239A ES535239A ES535239A0 ES 535239 A0 ES535239 A0 ES 535239A0 ES 535239 A ES535239 A ES 535239A ES 535239 A ES535239 A ES 535239A ES 535239 A0 ES535239 A0 ES 535239A0
Authority
ES
Spain
Prior art keywords
photodetector circuit
integrated photodetector
integrated
circuit
photodetector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES535239A
Other languages
English (en)
Other versions
ES8603113A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Spain SA
Original Assignee
Alcatel Espana SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Espana SA filed Critical Alcatel Espana SA
Publication of ES535239A0 publication Critical patent/ES535239A0/es
Publication of ES8603113A1 publication Critical patent/ES8603113A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/1443Devices controlled by radiation with at least one potential jump or surface barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604Chemical etching
    • H01L21/30612Etching of AIIIBV compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/8252Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/102Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
    • H01L31/105Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PIN type

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Junction Field-Effect Transistors (AREA)
ES535239A 1983-08-18 1984-08-17 Un circuito integrado fotodetector Expired ES8603113A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08322236A GB2145279B (en) 1983-08-18 1983-08-18 Photodetector integrated circuit

Publications (2)

Publication Number Publication Date
ES535239A0 true ES535239A0 (es) 1985-11-16
ES8603113A1 ES8603113A1 (es) 1985-11-16

Family

ID=10547489

Family Applications (1)

Application Number Title Priority Date Filing Date
ES535239A Expired ES8603113A1 (es) 1983-08-18 1984-08-17 Un circuito integrado fotodetector

Country Status (6)

Country Link
US (1) US4636829A (es)
EP (1) EP0133709A3 (es)
JP (1) JPS60106183A (es)
KR (1) KR850002178A (es)
ES (1) ES8603113A1 (es)
GB (1) GB2145279B (es)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2145558A (en) * 1983-08-23 1985-03-27 Standard Telephones Cables Ltd Field effect transistor
US5268309A (en) * 1984-09-01 1993-12-07 Canon Kabushiki Kaisha Method for manufacturing a photosensor
JPS6161457A (ja) * 1984-09-01 1986-03-29 Canon Inc 光センサおよびその製造方法
US4771325A (en) * 1985-02-11 1988-09-13 American Telephone & Telegraph Co., At&T Bell Laboratories Integrated photodetector-amplifier device
US4745446A (en) * 1985-02-11 1988-05-17 American Telephone And Telegraph Company, At&T Bell Laboratories Photodetector and amplifier integration
GB2172742B (en) * 1985-03-21 1988-08-24 Stc Plc Photoconductor
JPS62159477A (ja) * 1986-01-08 1987-07-15 Fujitsu Ltd 光半導体装置
JPS62190779A (ja) * 1986-02-18 1987-08-20 Nippon Telegr & Teleph Corp <Ntt> 集積形受光器
DE3751243T2 (de) * 1986-02-18 1995-08-31 Toshiba Kawasaki Kk Opto-elektronisches Bauelement und Verfahren zu seiner Herstellung.
DE3706252A1 (de) * 1986-02-28 1987-09-03 Canon Kk Halbleiterfotosensor
DE3606471A1 (de) * 1986-02-28 1987-09-03 Standard Elektrik Lorenz Ag Monolithisch integriert aufgebaute eingangsstufe eines optischen empfaengers
US4833512A (en) * 1986-04-11 1989-05-23 Itt Gallium Arsenide Technology Center, A Division Of Itt Corporation Heterojunction photo-detector with transparent gate
JPS6351681A (ja) * 1986-08-20 1988-03-04 Agency Of Ind Science & Technol 半導体装置
DE3629684A1 (de) * 1986-09-01 1988-03-10 Licentia Gmbh Photoempfaenger
DE3629685C2 (de) * 1986-09-01 2000-08-10 Daimler Chrysler Ag Photoempfänger
DE3629681A1 (de) * 1986-09-01 1988-03-10 Licentia Gmbh Photoempfaenger
DE3712864C2 (de) * 1986-09-01 2001-05-17 Daimler Chrysler Ag Monolithisch integrierter Photoempfänger
DE3644410A1 (de) * 1986-12-24 1988-07-07 Licentia Gmbh Photoempfaenger
DE3644408A1 (de) * 1986-12-24 1988-07-07 Licentia Gmbh Photoempfaenger
DE3709301C2 (de) * 1987-03-20 2001-12-06 Daimler Chrysler Ag Monolithisch integrierte Senderanordnung
DE3711617A1 (de) * 1987-04-07 1988-10-27 Siemens Ag Monolithisch integrierte wellenleiter-fotodioden-fet-kombination
DE3903699A1 (de) * 1988-02-08 1989-08-17 Ricoh Kk Bildsensor
US5170228A (en) * 1988-02-29 1992-12-08 Sumitomo Electric Industries, Ltd. Opto-electronic integrated circuit
US4996163A (en) * 1988-02-29 1991-02-26 Sumitomo Electric Industries, Ltd. Method for producing an opto-electronic integrated circuit
FR2634066A1 (fr) * 1988-07-05 1990-01-12 Thomson Csf Dispositif optoelectronique realise en optique integree et procede de realisation
EP0400399A3 (de) * 1989-05-31 1991-05-29 Siemens Aktiengesellschaft Monolithisch integrierte Photodiode-FET-Kombination
EP0405214A3 (en) * 1989-06-27 1991-06-05 Siemens Aktiengesellschaft Pin-fet combination with buried p-type layer
ES2078863B1 (es) * 1993-09-10 1996-08-01 Telefonica Nacional Espana Co Cabeza optica fotodetectora.
US6407440B1 (en) 2000-02-25 2002-06-18 Micron Technology Inc. Pixel cell with high storage capacitance for a CMOS imager
US6583469B1 (en) 2002-01-28 2003-06-24 International Business Machines Corporation Self-aligned dog-bone structure for FinFET applications and methods to fabricate the same
JP4453561B2 (ja) * 2005-01-26 2010-04-21 パナソニック電工株式会社 タイマスイッチ
KR101371401B1 (ko) * 2010-11-03 2014-03-10 한국전자통신연구원 애벌런치 광다이오드 및 그 형성방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2048181A1 (de) * 1970-09-30 1972-04-06 Siemens Ag Fototransistor
EP0067566A3 (en) * 1981-06-13 1985-08-07 Plessey Overseas Limited Integrated light detection or generation means and amplifying means
DE3135462A1 (de) * 1981-09-08 1983-09-01 AEG-Telefunken Nachrichtentechnik GmbH, 7150 Backnang Monolithische eingangsstufe eines optischen empfaengers
GB2109991B (en) * 1981-11-17 1985-05-15 Standard Telephones Cables Ltd Photodetector
US4442445A (en) * 1981-11-23 1984-04-10 The United States Of America As Represented By The Secretary Of The Army Planar doped barrier gate field effect transistor
US4517581A (en) * 1982-11-16 1985-05-14 Itt Industries, Inc. Photodetector

Also Published As

Publication number Publication date
GB8322236D0 (en) 1983-09-21
JPS60106183A (ja) 1985-06-11
US4636829A (en) 1987-01-13
GB2145279A (en) 1985-03-20
EP0133709A2 (en) 1985-03-06
GB2145279B (en) 1987-10-21
KR850002178A (ko) 1985-05-06
EP0133709A3 (en) 1985-07-10
ES8603113A1 (es) 1985-11-16

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