ES353094A1 - Un metodo de recubrir superficies metalicas. - Google Patents
Un metodo de recubrir superficies metalicas.Info
- Publication number
- ES353094A1 ES353094A1 ES353094A ES353094A ES353094A1 ES 353094 A1 ES353094 A1 ES 353094A1 ES 353094 A ES353094 A ES 353094A ES 353094 A ES353094 A ES 353094A ES 353094 A1 ES353094 A1 ES 353094A1
- Authority
- ES
- Spain
- Prior art keywords
- brightener
- acid
- copper
- heterocyclic
- electrodeposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 238000004070 electrodeposition Methods 0.000 title 1
- 239000002253 acid Substances 0.000 abstract 3
- 125000000623 heterocyclic group Chemical group 0.000 abstract 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 abstract 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 abstract 1
- 150000007513 acids Chemical class 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 150000001735 carboxylic acids Chemical class 0.000 abstract 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 abstract 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB09989/67A GB1235101A (en) | 1967-05-01 | 1967-05-01 | Improvements relating to electrodeposition of copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES353094A1 true ES353094A1 (es) | 1969-10-01 |
Family
ID=10138480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES353094A Expired ES353094A1 (es) | 1967-05-01 | 1968-04-24 | Un metodo de recubrir superficies metalicas. |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US3674660A (cs) |
| BE (1) | BE714454A (cs) |
| DE (1) | DE1771228C3 (cs) |
| ES (1) | ES353094A1 (cs) |
| FR (1) | FR1564283A (cs) |
| GB (1) | GB1235101A (cs) |
| NL (1) | NL6805947A (cs) |
| SE (1) | SE332744B (cs) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5167234A (ja) * | 1974-12-09 | 1976-06-10 | Hitachi Ltd | Pirorinsandometsukizeikahimakuboshiho |
| US4134803A (en) * | 1977-12-21 | 1979-01-16 | R. O. Hull & Company, Inc. | Nitrogen and sulfur compositions and acid copper plating baths |
| US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
| US4877518A (en) * | 1988-05-02 | 1989-10-31 | Phillips Petroleum Company | Ore flotation employing dimercaptothiadiazoles |
| US4966688A (en) * | 1988-06-23 | 1990-10-30 | Phillips Petroleum Company | Ore flotation employing amino mercaptothiadiazoles |
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| EP0442187B1 (en) * | 1990-02-16 | 1994-02-02 | Furukawa Circuit Foil Co., Ltd. | Method of making electrodeposited copper foil |
| US5314756A (en) * | 1991-11-27 | 1994-05-24 | Hitachi Metals, Ltd. | Permanent magnet of rare-earth-element/transition-metal system having improved corrosion resistance and manufacturing method thereof |
| US5252196A (en) * | 1991-12-05 | 1993-10-12 | Shipley Company Inc. | Copper electroplating solutions and processes |
| US5730854A (en) * | 1996-05-30 | 1998-03-24 | Enthone-Omi, Inc. | Alkoxylated dimercaptans as copper additives and de-polarizing additives |
| WO1997049549A1 (en) * | 1996-06-26 | 1997-12-31 | Park Electrochemical Corporation | A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates |
| US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| US6709564B1 (en) * | 1999-09-30 | 2004-03-23 | Rockwell Scientific Licensing, Llc | Integrated circuit plating using highly-complexed copper plating baths |
| KR100845189B1 (ko) * | 2000-12-20 | 2008-07-10 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | 전해적 구리 도금액 및 이의 제어법 |
| WO2005006476A1 (ja) | 2003-07-11 | 2005-01-20 | Shishiai-Kabushikigaisha | 燃料電池用冷却液組成物 |
| EP1698678A1 (en) * | 2003-12-25 | 2006-09-06 | Shishiai-Kabushikigaisha | Heat carrier composition |
| EP2357268A4 (en) * | 2008-11-11 | 2012-12-05 | Yuken Kogyo Co Ltd | ZINCING BATH BASED WITH ZINCATE |
| CN102395712A (zh) * | 2009-02-12 | 2012-03-28 | 技术研究及发展基金有限公司 | 电镀铜的方法 |
| CN103173812B (zh) * | 2013-03-21 | 2015-12-09 | 山东金宝电子股份有限公司 | 一种消除电解铜箔内应力的混合添加剂及用于生产低应力铜箔的方法 |
| SE545031C2 (en) * | 2021-07-15 | 2023-03-07 | Seolfor Ab | Compositions, methods and preparations of cyanide-free copper solutions, suitable for electroplating of copper deposits and alloys thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2195409A (en) * | 1936-07-31 | 1940-04-02 | Nat Aniline & Chem Co Inc | Electrodeposition |
| US2437865A (en) * | 1943-09-25 | 1948-03-16 | United Chromium Inc | Method of electrodepositing copper and baths and compositions therefor |
| US2700019A (en) * | 1951-07-05 | 1955-01-18 | Westinghouse Electric Corp | Acid copper plating |
| NL267368A (cs) * | 1960-07-23 | |||
| US3341433A (en) * | 1964-05-01 | 1967-09-12 | M & T Chemicals Inc | Electrodeposition of nickel |
-
1967
- 1967-05-01 GB GB09989/67A patent/GB1235101A/en not_active Expired
-
1968
- 1968-04-24 ES ES353094A patent/ES353094A1/es not_active Expired
- 1968-04-24 DE DE1771228A patent/DE1771228C3/de not_active Expired
- 1968-04-26 NL NL6805947A patent/NL6805947A/xx unknown
- 1968-04-30 SE SE05888/68A patent/SE332744B/xx unknown
- 1968-04-30 FR FR1564283D patent/FR1564283A/fr not_active Expired
- 1968-04-30 BE BE714454D patent/BE714454A/xx not_active IP Right Cessation
-
1970
- 1970-08-14 US US63954A patent/US3674660A/en not_active Expired - Lifetime
-
1971
- 1971-04-07 US US00132236A patent/US3729393A/en not_active Expired - Lifetime
- 1971-12-16 US US00209004A patent/US3784454A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE1796337B2 (de) | 1976-09-02 |
| FR1564283A (cs) | 1969-04-18 |
| DE1771228C3 (de) | 1974-08-22 |
| DE1771228A1 (de) | 1973-04-26 |
| GB1235101A (en) | 1971-06-09 |
| US3674660A (en) | 1972-07-04 |
| US3729393A (en) | 1973-04-24 |
| US3784454A (en) | 1974-01-08 |
| BE714454A (cs) | 1968-09-16 |
| NL6805947A (cs) | 1968-11-04 |
| SE332744B (cs) | 1971-02-15 |
| DE1796337A1 (de) | 1974-02-28 |
| DE1771228B2 (de) | 1974-01-24 |
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