FR1564283A - - Google Patents

Info

Publication number
FR1564283A
FR1564283A FR1564283DA FR1564283A FR 1564283 A FR1564283 A FR 1564283A FR 1564283D A FR1564283D A FR 1564283DA FR 1564283 A FR1564283 A FR 1564283A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1564283A publication Critical patent/FR1564283A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
FR1564283D 1967-05-01 1968-04-30 Expired FR1564283A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB09989/67A GB1235101A (en) 1967-05-01 1967-05-01 Improvements relating to electrodeposition of copper

Publications (1)

Publication Number Publication Date
FR1564283A true FR1564283A (fr) 1969-04-18

Family

ID=10138480

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1564283D Expired FR1564283A (fr) 1967-05-01 1968-04-30

Country Status (8)

Country Link
US (3) US3674660A (fr)
BE (1) BE714454A (fr)
DE (1) DE1771228C3 (fr)
ES (1) ES353094A1 (fr)
FR (1) FR1564283A (fr)
GB (1) GB1235101A (fr)
NL (1) NL6805947A (fr)
SE (1) SE332744B (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167234A (ja) * 1974-12-09 1976-06-10 Hitachi Ltd Pirorinsandometsukizeikahimakuboshiho
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4877518A (en) * 1988-05-02 1989-10-31 Phillips Petroleum Company Ore flotation employing dimercaptothiadiazoles
US4966688A (en) * 1988-06-23 1990-10-30 Phillips Petroleum Company Ore flotation employing amino mercaptothiadiazoles
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
US4976826A (en) * 1990-02-16 1990-12-11 Furukawa Circuit Foil Co., Ltd. Method of making electrodeposited copper foil
US5314756A (en) * 1991-11-27 1994-05-24 Hitachi Metals, Ltd. Permanent magnet of rare-earth-element/transition-metal system having improved corrosion resistance and manufacturing method thereof
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
WO1997049549A1 (fr) * 1996-06-26 1997-12-31 Park Electrochemical Corporation Procede de production de cartes dielectriques de polytetrafluoroethylene (ptfe) sur des plaques metalliques
US6444110B2 (en) 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
US6709564B1 (en) * 1999-09-30 2004-03-23 Rockwell Scientific Licensing, Llc Integrated circuit plating using highly-complexed copper plating baths
TWI255871B (en) * 2000-12-20 2006-06-01 Learonal Japan Inc Electrolytic copper plating solution and process for electrolytic plating using the same
WO2005006476A1 (fr) 2003-07-11 2005-01-20 Shishiai-Kabushikigaisha Composition de fluide de refroidissement pour batterie de piles a combustible
WO2005063918A1 (fr) * 2003-12-25 2005-07-14 Shishiai-Kabushikigaisha Composition de vecteur thermique
WO2010055825A1 (fr) * 2008-11-11 2010-05-20 ユケン工業株式会社 Bain de zingage à base de zincate
US20120028073A1 (en) * 2009-02-12 2012-02-02 Technion Research & Development Foundation Ltd. Process for electroplating of copper
CN103173812B (zh) * 2013-03-21 2015-12-09 山东金宝电子股份有限公司 一种消除电解铜箔内应力的混合添加剂及用于生产低应力铜箔的方法
SE545031C2 (en) * 2021-07-15 2023-03-07 Seolfor Ab Compositions, methods and preparations of cyanide-free copper solutions, suitable for electroplating of copper deposits and alloys thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2195409A (en) * 1936-07-31 1940-04-02 Nat Aniline & Chem Co Inc Electrodeposition
US2437865A (en) * 1943-09-25 1948-03-16 United Chromium Inc Method of electrodepositing copper and baths and compositions therefor
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
NL123240C (fr) * 1960-07-23
US3341433A (en) * 1964-05-01 1967-09-12 M & T Chemicals Inc Electrodeposition of nickel

Also Published As

Publication number Publication date
BE714454A (fr) 1968-09-16
ES353094A1 (es) 1969-10-01
SE332744B (fr) 1971-02-15
US3784454A (en) 1974-01-08
DE1771228B2 (de) 1974-01-24
US3674660A (en) 1972-07-04
US3729393A (en) 1973-04-24
DE1771228A1 (de) 1973-04-26
NL6805947A (fr) 1968-11-04
DE1796337B2 (de) 1976-09-02
DE1771228C3 (de) 1974-08-22
GB1235101A (en) 1971-06-09
DE1796337A1 (de) 1974-02-28

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