EP2357268A4 - Zincate zinc plating bath - Google Patents

Zincate zinc plating bath

Info

Publication number
EP2357268A4
EP2357268A4 EP09826073A EP09826073A EP2357268A4 EP 2357268 A4 EP2357268 A4 EP 2357268A4 EP 09826073 A EP09826073 A EP 09826073A EP 09826073 A EP09826073 A EP 09826073A EP 2357268 A4 EP2357268 A4 EP 2357268A4
Authority
EP
European Patent Office
Prior art keywords
plating bath
zinc plating
zincate zinc
zincate
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09826073A
Other languages
German (de)
French (fr)
Other versions
EP2357268A1 (en
Inventor
Kazuo Ito
Tomoko Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yuken Industry Co Ltd
Yuken Kogyo Co Ltd
Original Assignee
Yuken Industry Co Ltd
Yuken Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuken Industry Co Ltd, Yuken Kogyo Co Ltd filed Critical Yuken Industry Co Ltd
Publication of EP2357268A1 publication Critical patent/EP2357268A1/en
Publication of EP2357268A4 publication Critical patent/EP2357268A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/22Electroplating: Baths therefor from solutions of zinc

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP09826073A 2008-11-11 2009-11-10 Zincate zinc plating bath Withdrawn EP2357268A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008289115 2008-11-11
PCT/JP2009/069108 WO2010055825A1 (en) 2008-11-11 2009-11-10 Zincate zinc plating bath

Publications (2)

Publication Number Publication Date
EP2357268A1 EP2357268A1 (en) 2011-08-17
EP2357268A4 true EP2357268A4 (en) 2012-12-05

Family

ID=42169960

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09826073A Withdrawn EP2357268A4 (en) 2008-11-11 2009-11-10 Zincate zinc plating bath

Country Status (4)

Country Link
US (1) US20110210007A1 (en)
EP (1) EP2357268A4 (en)
JP (1) JP5419021B2 (en)
WO (1) WO2010055825A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2489762B1 (en) * 2010-09-09 2014-12-17 Yuken Industry Co., Ltd. Additive for zinc plating baths and non-cyanide alkaline zinc plating baths
JP5327815B2 (en) * 2010-10-20 2013-10-30 ユケン工業株式会社 Electroplating bath, method for forming electroplated film, and electroplated product
JP2013144852A (en) * 2013-03-18 2013-07-25 Yuken Industry Co Ltd Electroplating bath, method for forming electroplated coating, and electroplated product
CA2957587C (en) * 2014-08-08 2019-03-05 Okuno Chemical Industries Co., Ltd. Copper-tin alloy plating bath
US20160108254A1 (en) * 2014-10-17 2016-04-21 Meltex Inc. Zinc immersion coating solutions, double-zincate method, method of forming a metal plating film, and semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999050479A1 (en) * 1998-03-27 1999-10-07 Wm. Canning Limited Electroplating solution

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1235101A (en) * 1967-05-01 1971-06-09 Albright & Wilson Mfg Ltd Improvements relating to electrodeposition of copper
JPS6353285A (en) * 1986-08-22 1988-03-07 Nippon Hyomen Kagaku Kk Zinc-nickel alloy plating solution
US5435898A (en) * 1994-10-25 1995-07-25 Enthone-Omi Inc. Alkaline zinc and zinc alloy electroplating baths and processes
JP4849749B2 (en) * 2001-08-31 2012-01-11 日本表面化学株式会社 Alkaline electrogalvanizing bath and plating method
JP4406235B2 (en) * 2002-07-23 2010-01-27 木田精工株式会社 Zincate bath galvanizing method
EP2489762B1 (en) * 2010-09-09 2014-12-17 Yuken Industry Co., Ltd. Additive for zinc plating baths and non-cyanide alkaline zinc plating baths

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999050479A1 (en) * 1998-03-27 1999-10-07 Wm. Canning Limited Electroplating solution

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010055825A1 *

Also Published As

Publication number Publication date
WO2010055825A1 (en) 2010-05-20
JP5419021B2 (en) 2014-02-19
US20110210007A1 (en) 2011-09-01
JPWO2010055825A1 (en) 2012-04-12
EP2357268A1 (en) 2011-08-17

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20110608

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A4 Supplementary search report drawn up and despatched

Effective date: 20121105

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 3/22 20060101AFI20121029BHEP

STAA Information on the status of an ep patent application or granted ep patent

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Effective date: 20130604