NL6805947A - - Google Patents

Info

Publication number
NL6805947A
NL6805947A NL6805947A NL6805947A NL6805947A NL 6805947 A NL6805947 A NL 6805947A NL 6805947 A NL6805947 A NL 6805947A NL 6805947 A NL6805947 A NL 6805947A NL 6805947 A NL6805947 A NL 6805947A
Authority
NL
Netherlands
Application number
NL6805947A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6805947A publication Critical patent/NL6805947A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
NL6805947A 1967-05-01 1968-04-26 NL6805947A (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB09989/67A GB1235101A (en) 1967-05-01 1967-05-01 Improvements relating to electrodeposition of copper

Publications (1)

Publication Number Publication Date
NL6805947A true NL6805947A (cs) 1968-11-04

Family

ID=10138480

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6805947A NL6805947A (cs) 1967-05-01 1968-04-26

Country Status (8)

Country Link
US (3) US3674660A (cs)
BE (1) BE714454A (cs)
DE (1) DE1771228C3 (cs)
ES (1) ES353094A1 (cs)
FR (1) FR1564283A (cs)
GB (1) GB1235101A (cs)
NL (1) NL6805947A (cs)
SE (1) SE332744B (cs)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167234A (ja) * 1974-12-09 1976-06-10 Hitachi Ltd Pirorinsandometsukizeikahimakuboshiho
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4877518A (en) * 1988-05-02 1989-10-31 Phillips Petroleum Company Ore flotation employing dimercaptothiadiazoles
US4966688A (en) * 1988-06-23 1990-10-30 Phillips Petroleum Company Ore flotation employing amino mercaptothiadiazoles
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
EP0442187B1 (en) * 1990-02-16 1994-02-02 Furukawa Circuit Foil Co., Ltd. Method of making electrodeposited copper foil
US5314756A (en) * 1991-11-27 1994-05-24 Hitachi Metals, Ltd. Permanent magnet of rare-earth-element/transition-metal system having improved corrosion resistance and manufacturing method thereof
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
WO1997049549A1 (en) * 1996-06-26 1997-12-31 Park Electrochemical Corporation A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
US6709564B1 (en) * 1999-09-30 2004-03-23 Rockwell Scientific Licensing, Llc Integrated circuit plating using highly-complexed copper plating baths
KR100845189B1 (ko) * 2000-12-20 2008-07-10 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 전해적 구리 도금액 및 이의 제어법
WO2005006476A1 (ja) 2003-07-11 2005-01-20 Shishiai-Kabushikigaisha 燃料電池用冷却液組成物
EP1698678A1 (en) * 2003-12-25 2006-09-06 Shishiai-Kabushikigaisha Heat carrier composition
EP2357268A4 (en) * 2008-11-11 2012-12-05 Yuken Kogyo Co Ltd ZINCING BATH BASED WITH ZINCATE
CN102395712A (zh) * 2009-02-12 2012-03-28 技术研究及发展基金有限公司 电镀铜的方法
CN103173812B (zh) * 2013-03-21 2015-12-09 山东金宝电子股份有限公司 一种消除电解铜箔内应力的混合添加剂及用于生产低应力铜箔的方法
SE545031C2 (en) * 2021-07-15 2023-03-07 Seolfor Ab Compositions, methods and preparations of cyanide-free copper solutions, suitable for electroplating of copper deposits and alloys thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2195409A (en) * 1936-07-31 1940-04-02 Nat Aniline & Chem Co Inc Electrodeposition
US2437865A (en) * 1943-09-25 1948-03-16 United Chromium Inc Method of electrodepositing copper and baths and compositions therefor
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
NL267368A (cs) * 1960-07-23
US3341433A (en) * 1964-05-01 1967-09-12 M & T Chemicals Inc Electrodeposition of nickel

Also Published As

Publication number Publication date
DE1796337B2 (de) 1976-09-02
FR1564283A (cs) 1969-04-18
DE1771228C3 (de) 1974-08-22
ES353094A1 (es) 1969-10-01
DE1771228A1 (de) 1973-04-26
GB1235101A (en) 1971-06-09
US3674660A (en) 1972-07-04
US3729393A (en) 1973-04-24
US3784454A (en) 1974-01-08
BE714454A (cs) 1968-09-16
SE332744B (cs) 1971-02-15
DE1796337A1 (de) 1974-02-28
DE1771228B2 (de) 1974-01-24

Similar Documents

Publication Publication Date Title
BE711469A (cs)
BE703614A (cs)
BE696025A (cs)
BE703133A (cs)
BE704344A (cs)
BE704647A (cs)
BE707020A (cs)
BE707363A (cs)
BE708256A (cs)
BE708667A (cs)
BE708960A (cs)
BE708996A (cs)
BE709137A (cs)
BE709170A (cs)
BE709229A (cs)
BE709250A (cs)
BE709262A (cs)
BE709352A (cs)
BE709529A (cs)
BE709622A (cs)
BE709639A (cs)
BE709765A (cs)
BE711501A (cs)
BE709939A (cs)
BE710078A (cs)

Legal Events

Date Code Title Description
BN A decision not to publish the application has become irrevocable