ES2895077T3 - Inductor incorporado en un sustrato de encapsulado - Google Patents

Inductor incorporado en un sustrato de encapsulado Download PDF

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Publication number
ES2895077T3
ES2895077T3 ES15715112T ES15715112T ES2895077T3 ES 2895077 T3 ES2895077 T3 ES 2895077T3 ES 15715112 T ES15715112 T ES 15715112T ES 15715112 T ES15715112 T ES 15715112T ES 2895077 T3 ES2895077 T3 ES 2895077T3
Authority
ES
Spain
Prior art keywords
inductor
dielectric layer
pad
substrate
core layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES15715112T
Other languages
English (en)
Spanish (es)
Inventor
Siamak Fazelpour
Charles David Paynter
Ryan David Lane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Application granted granted Critical
Publication of ES2895077T3 publication Critical patent/ES2895077T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H10W70/611—
    • H10W70/685—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer
    • H10W44/501—
    • H10W70/635—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
ES15715112T 2014-03-28 2015-03-27 Inductor incorporado en un sustrato de encapsulado Active ES2895077T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/229,367 US10008316B2 (en) 2014-03-28 2014-03-28 Inductor embedded in a package substrate
PCT/US2015/023129 WO2015148996A1 (en) 2014-03-28 2015-03-27 Inductor embedded in a package subtrate

Publications (1)

Publication Number Publication Date
ES2895077T3 true ES2895077T3 (es) 2022-02-17

Family

ID=52815380

Family Applications (1)

Application Number Title Priority Date Filing Date
ES15715112T Active ES2895077T3 (es) 2014-03-28 2015-03-27 Inductor incorporado en un sustrato de encapsulado

Country Status (7)

Country Link
US (1) US10008316B2 (enExample)
EP (1) EP3123508B1 (enExample)
JP (1) JP6502378B2 (enExample)
KR (1) KR101971195B1 (enExample)
CN (1) CN106133904B (enExample)
ES (1) ES2895077T3 (enExample)
WO (1) WO2015148996A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9496213B2 (en) * 2015-02-05 2016-11-15 Qualcomm Incorporated Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate
WO2016130859A1 (en) 2015-02-11 2016-08-18 Endura Technologies LLC Switched power stage with integrated passive components
KR101933408B1 (ko) * 2015-11-10 2018-12-28 삼성전기 주식회사 전자부품 패키지 및 이를 포함하는 전자기기
CN108293294A (zh) * 2015-12-31 2018-07-17 英特尔公司 用于封装和pcb中针对具有盲孔和埋孔的组装件的电感补偿的微线圈装置
US9859357B1 (en) * 2016-07-14 2018-01-02 International Business Machines Corporation Magnetic inductor stacks with multilayer isolation layers
US10283249B2 (en) 2016-09-30 2019-05-07 International Business Machines Corporation Method for fabricating a magnetic material stack
US10923417B2 (en) 2017-04-26 2021-02-16 Taiwan Semiconductor Manufacturing Company Limited Integrated fan-out package with 3D magnetic core inductor
US11158448B2 (en) 2018-06-14 2021-10-26 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging layer inductor
KR102678311B1 (ko) * 2018-08-30 2024-06-25 삼성전자주식회사 패키지 볼을 갖는 반도체 패키지를 포함하는 전자 소자
US11640968B2 (en) 2018-11-06 2023-05-02 Texas Instruments Incorporated Inductor on microelectronic die
CN113284880A (zh) * 2021-04-01 2021-08-20 日月光半导体制造股份有限公司 基板内连线结构
CN117059600A (zh) * 2022-05-06 2023-11-14 华为技术有限公司 基板、封装结构及电子设备
US12518908B2 (en) * 2024-01-31 2026-01-06 Avago Technologies International Sales Pte. Limited Systems and methods for integrating inductors within printed circuit boards

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US4757295A (en) * 1987-09-16 1988-07-12 Avco Research Laboratory, Inc. Transmission line pulsed transformer
JPH06151185A (ja) * 1992-11-09 1994-05-31 Matsushita Electric Works Ltd 平面型インダクタンス素子
US6177732B1 (en) 1999-05-27 2001-01-23 Intel Corporation Multi-layer organic land grid array to minimize via inductance
JP2002100733A (ja) * 2000-09-21 2002-04-05 Nec Corp 高周波集積回路装置
US7253497B2 (en) 2003-07-02 2007-08-07 Lsi Corporation Integrated circuit with inductor having horizontal magnetic flux lines
TWI245592B (en) 2004-01-12 2005-12-11 Advanced Semiconductor Eng Circuit substrate
US7196607B2 (en) 2004-03-26 2007-03-27 Harris Corporation Embedded toroidal transformers in ceramic substrates
US7227247B2 (en) * 2005-02-16 2007-06-05 Intel Corporation IC package with signal land pads
US20060220773A1 (en) * 2005-03-31 2006-10-05 Jun Su Spiral transformers and associated methods of operation
US7474539B2 (en) * 2005-04-11 2009-01-06 Intel Corporation Inductor
US7907043B2 (en) * 2005-11-30 2011-03-15 Ryutaro Mori Planar inductor
US7843302B2 (en) * 2006-05-08 2010-11-30 Ibiden Co., Ltd. Inductor and electric power supply using it
US7649265B2 (en) 2006-09-29 2010-01-19 Intel Corporation Micro-via structure design for high performance integrated circuits
WO2008097911A1 (en) 2007-02-05 2008-08-14 Rambus Inc. Semiconductor package with embedded spiral inductor
TWI347616B (en) * 2007-03-22 2011-08-21 Ind Tech Res Inst Inductor devices
JP2008277485A (ja) * 2007-04-27 2008-11-13 Fuji Electric Device Technology Co Ltd トランスユニットおよび電力変換装置
US7733207B2 (en) * 2007-05-31 2010-06-08 Electronics And Telecommunications Research Institute Vertically formed inductor and electronic device having the same
JP2009055019A (ja) * 2007-07-30 2009-03-12 Renesas Technology Corp 多層基板、半導体集積回路用パッケージ基板及び半導体集積回路実装用プリント配線板
US20090085155A1 (en) 2007-09-28 2009-04-02 Bailey Mark J Method and apparatus for package-to-board impedance matching for high speed integrated circuits
WO2010035401A1 (ja) 2008-09-26 2010-04-01 パナソニック株式会社 電子デバイス及びその製造方法
US8067816B2 (en) 2009-02-03 2011-11-29 Qualcomm Incorporated Techniques for placement of active and passive devices within a chip
US8384507B2 (en) * 2010-06-01 2013-02-26 Qualcomm Incorporated Through via inductor or transformer in a high-resistance substrate with programmability
US9048112B2 (en) * 2010-06-29 2015-06-02 Qualcomm Incorporated Integrated voltage regulator with embedded passive device(s) for a stacked IC
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Also Published As

Publication number Publication date
CN106133904A (zh) 2016-11-16
US20150279545A1 (en) 2015-10-01
CN106133904B (zh) 2020-01-10
KR101971195B1 (ko) 2019-08-13
US10008316B2 (en) 2018-06-26
WO2015148996A1 (en) 2015-10-01
JP2017511602A (ja) 2017-04-20
EP3123508A1 (en) 2017-02-01
JP6502378B2 (ja) 2019-04-17
EP3123508B1 (en) 2021-09-29
KR20160138411A (ko) 2016-12-05

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