CN106133904B - 嵌入在封装基板中的电感器 - Google Patents

嵌入在封装基板中的电感器 Download PDF

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Publication number
CN106133904B
CN106133904B CN201580016458.9A CN201580016458A CN106133904B CN 106133904 B CN106133904 B CN 106133904B CN 201580016458 A CN201580016458 A CN 201580016458A CN 106133904 B CN106133904 B CN 106133904B
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CN
China
Prior art keywords
inductor
coupled
package substrate
dielectric layer
magnetic field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580016458.9A
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English (en)
Chinese (zh)
Other versions
CN106133904A (zh
Inventor
S·法泽尔波
C·D·裴恩特
R·D·莱恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
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Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN106133904A publication Critical patent/CN106133904A/zh
Application granted granted Critical
Publication of CN106133904B publication Critical patent/CN106133904B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN201580016458.9A 2014-03-28 2015-03-27 嵌入在封装基板中的电感器 Expired - Fee Related CN106133904B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/229,367 US10008316B2 (en) 2014-03-28 2014-03-28 Inductor embedded in a package substrate
US14/229,367 2014-03-28
PCT/US2015/023129 WO2015148996A1 (en) 2014-03-28 2015-03-27 Inductor embedded in a package subtrate

Publications (2)

Publication Number Publication Date
CN106133904A CN106133904A (zh) 2016-11-16
CN106133904B true CN106133904B (zh) 2020-01-10

Family

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Family Applications (1)

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CN201580016458.9A Expired - Fee Related CN106133904B (zh) 2014-03-28 2015-03-27 嵌入在封装基板中的电感器

Country Status (7)

Country Link
US (1) US10008316B2 (enExample)
EP (1) EP3123508B1 (enExample)
JP (1) JP6502378B2 (enExample)
KR (1) KR101971195B1 (enExample)
CN (1) CN106133904B (enExample)
ES (1) ES2895077T3 (enExample)
WO (1) WO2015148996A1 (enExample)

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US9496213B2 (en) * 2015-02-05 2016-11-15 Qualcomm Incorporated Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate
CN107408534B (zh) 2015-02-11 2019-11-29 朝阳半导体技术江阴有限公司 具有集成无源组件的开关式功率级
KR101933408B1 (ko) * 2015-11-10 2018-12-28 삼성전기 주식회사 전자부품 패키지 및 이를 포함하는 전자기기
CN108293294A (zh) * 2015-12-31 2018-07-17 英特尔公司 用于封装和pcb中针对具有盲孔和埋孔的组装件的电感补偿的微线圈装置
US9859357B1 (en) * 2016-07-14 2018-01-02 International Business Machines Corporation Magnetic inductor stacks with multilayer isolation layers
US10283249B2 (en) 2016-09-30 2019-05-07 International Business Machines Corporation Method for fabricating a magnetic material stack
US10923417B2 (en) * 2017-04-26 2021-02-16 Taiwan Semiconductor Manufacturing Company Limited Integrated fan-out package with 3D magnetic core inductor
US11158448B2 (en) 2018-06-14 2021-10-26 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging layer inductor
KR102678311B1 (ko) * 2018-08-30 2024-06-25 삼성전자주식회사 패키지 볼을 갖는 반도체 패키지를 포함하는 전자 소자
US11640968B2 (en) * 2018-11-06 2023-05-02 Texas Instruments Incorporated Inductor on microelectronic die
CN113284880A (zh) * 2021-04-01 2021-08-20 日月光半导体制造股份有限公司 基板内连线结构
CN117059600A (zh) * 2022-05-06 2023-11-14 华为技术有限公司 基板、封装结构及电子设备
US20250246357A1 (en) * 2024-01-31 2025-07-31 Avago Technologies International Sales Pte. Limited Systems and methods for integrating inductors within printed circuit boards

Citations (3)

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US6177732B1 (en) * 1999-05-27 2001-01-23 Intel Corporation Multi-layer organic land grid array to minimize via inductance
CN1938794A (zh) * 2004-03-26 2007-03-28 哈里公司 陶瓷衬底中的嵌入式环芯变压器
CN102918608A (zh) * 2010-06-01 2013-02-06 高通股份有限公司 高电阻衬底中的具有可编程性的穿通孔电感器或变压器

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JPH06151185A (ja) * 1992-11-09 1994-05-31 Matsushita Electric Works Ltd 平面型インダクタンス素子
JP2002100733A (ja) * 2000-09-21 2002-04-05 Nec Corp 高周波集積回路装置
US7253497B2 (en) 2003-07-02 2007-08-07 Lsi Corporation Integrated circuit with inductor having horizontal magnetic flux lines
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US7474539B2 (en) * 2005-04-11 2009-01-06 Intel Corporation Inductor
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WO2008097911A1 (en) 2007-02-05 2008-08-14 Rambus Inc. Semiconductor package with embedded spiral inductor
TWI347616B (en) * 2007-03-22 2011-08-21 Ind Tech Res Inst Inductor devices
JP2008277485A (ja) * 2007-04-27 2008-11-13 Fuji Electric Device Technology Co Ltd トランスユニットおよび電力変換装置
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JP2009055019A (ja) * 2007-07-30 2009-03-12 Renesas Technology Corp 多層基板、半導体集積回路用パッケージ基板及び半導体集積回路実装用プリント配線板
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US6177732B1 (en) * 1999-05-27 2001-01-23 Intel Corporation Multi-layer organic land grid array to minimize via inductance
CN1938794A (zh) * 2004-03-26 2007-03-28 哈里公司 陶瓷衬底中的嵌入式环芯变压器
CN102918608A (zh) * 2010-06-01 2013-02-06 高通股份有限公司 高电阻衬底中的具有可编程性的穿通孔电感器或变压器

Also Published As

Publication number Publication date
ES2895077T3 (es) 2022-02-17
KR101971195B1 (ko) 2019-08-13
EP3123508B1 (en) 2021-09-29
EP3123508A1 (en) 2017-02-01
JP2017511602A (ja) 2017-04-20
JP6502378B2 (ja) 2019-04-17
US10008316B2 (en) 2018-06-26
WO2015148996A1 (en) 2015-10-01
CN106133904A (zh) 2016-11-16
KR20160138411A (ko) 2016-12-05
US20150279545A1 (en) 2015-10-01

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