ES2890655T3 - Adhesivos de silicona soldables y amortiguadores de vibraciones - Google Patents
Adhesivos de silicona soldables y amortiguadores de vibraciones Download PDFInfo
- Publication number
- ES2890655T3 ES2890655T3 ES15791816T ES15791816T ES2890655T3 ES 2890655 T3 ES2890655 T3 ES 2890655T3 ES 15791816 T ES15791816 T ES 15791816T ES 15791816 T ES15791816 T ES 15791816T ES 2890655 T3 ES2890655 T3 ES 2890655T3
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- Prior art keywords
- adhesive
- silicone
- adhesive composition
- substrate
- subject matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000001039 zinc pigment Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/10—Joining materials by welding overlapping edges with an insertion of plastic material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462063172P | 2014-10-13 | 2014-10-13 | |
| US201562142590P | 2015-04-03 | 2015-04-03 | |
| PCT/US2015/055360 WO2016061121A1 (en) | 2014-10-13 | 2015-10-13 | Weldable and vibration damping silicone adhesives |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2890655T3 true ES2890655T3 (es) | 2022-01-21 |
Family
ID=54478956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES15791816T Active ES2890655T3 (es) | 2014-10-13 | 2015-10-13 | Adhesivos de silicona soldables y amortiguadores de vibraciones |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10954422B2 (OSRAM) |
| EP (2) | EP3207104B1 (OSRAM) |
| JP (1) | JP2017534721A (OSRAM) |
| KR (1) | KR102424027B1 (OSRAM) |
| CN (1) | CN107001877B (OSRAM) |
| ES (1) | ES2890655T3 (OSRAM) |
| PL (1) | PL3207104T3 (OSRAM) |
| WO (1) | WO2016061121A1 (OSRAM) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015203128A1 (de) * | 2015-02-20 | 2016-08-25 | Thyssenkrupp Ag | Fahrwerkkomponente, Verfahren zu seiner Herstellung und Verwendung |
| US20180134925A1 (en) * | 2016-11-11 | 2018-05-17 | Polyonics, Inc. | High temperature resistant pressure sensitive adhesive with low thermal impedance |
| DE102017202624A1 (de) * | 2017-02-17 | 2018-08-23 | Tesa Se | Vibrationsdämpfende Silikon-Haftklebmasse |
| DE102017202623A1 (de) * | 2017-02-17 | 2018-08-23 | Tesa Se | Vibrationsdämpfende Silikon-Haftklebmasse |
| WO2019071379A1 (en) * | 2017-10-09 | 2019-04-18 | 3M Innovative Properties Company | ADHESIVE DAMPING LAYERS FOR MICRO-SPEAKER DIAPHRAGMS |
| WO2022141224A1 (en) * | 2020-12-30 | 2022-07-07 | 3M Innovative Properties Company | Cured silicone adhesive composition |
| JP2022149619A (ja) * | 2021-03-25 | 2022-10-07 | 株式会社Subaru | 樹脂複合鋼板 |
| US12116511B2 (en) * | 2021-04-09 | 2024-10-15 | Dow Silicones Corporation | Process for preparing a solventless polyorganosiloxane pellet and a waterborne dispersion of a silicone pressure sensitive adhesive base |
| WO2024177625A1 (en) | 2023-02-21 | 2024-08-29 | Micro Motion, Inc. | Electromagnetic transducer for symmetric oscillations of a symmetrically oscillatory device |
| KR102893170B1 (ko) * | 2024-12-10 | 2025-12-03 | 주식회사 이지에버텍 | 스마트급전제어장치에 적용되는 내진성 함체 |
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| US4584355A (en) | 1984-10-29 | 1986-04-22 | Dow Corning Corporation | Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-I |
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| US5275856A (en) | 1991-11-12 | 1994-01-04 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
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| US5869556A (en) | 1996-07-05 | 1999-02-09 | Dow Corning Corporation | Silicone pressure sensitive adhesives |
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| EP1957597B1 (en) | 2005-12-08 | 2014-04-30 | Dow Corning Corporation | Continuous process for production of silicone pressure sensitive adhesives |
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| KR100774440B1 (ko) | 2007-01-17 | 2007-11-08 | 조인셋 주식회사 | 전도성 점착테이프 |
| WO2009081415A2 (en) | 2007-12-24 | 2009-07-02 | Prs Solutions Private Limited | Process of manufacturing audio/visual detectable and tamper evident label stock for authentication |
| CN102232103B (zh) | 2008-10-29 | 2016-07-06 | 3M创新有限公司 | 电子束固化的有机硅材料 |
| EP2470588B1 (en) | 2009-08-25 | 2016-04-27 | Dow Corning Corporation | Process for the preparation of a silicone pressure-sensitive adhesive |
| US8796580B2 (en) | 2009-12-28 | 2014-08-05 | Productive Research | Processes for welding composite materials and articles therefrom |
| KR100977064B1 (ko) | 2010-02-19 | 2010-08-19 | 조인셋 주식회사 | 다목적 접착테이프 |
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-
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- 2015-10-13 EP EP15791816.0A patent/EP3207104B1/en active Active
- 2015-10-13 PL PL15791816T patent/PL3207104T3/pl unknown
- 2015-10-13 WO PCT/US2015/055360 patent/WO2016061121A1/en not_active Ceased
- 2015-10-13 CN CN201580065595.1A patent/CN107001877B/zh active Active
- 2015-10-13 ES ES15791816T patent/ES2890655T3/es active Active
- 2015-10-13 KR KR1020177011503A patent/KR102424027B1/ko active Active
- 2015-10-13 EP EP21183676.2A patent/EP3910039A1/en not_active Withdrawn
- 2015-10-13 US US15/518,581 patent/US10954422B2/en active Active
- 2015-10-13 JP JP2017519614A patent/JP2017534721A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP3207104B1 (en) | 2021-08-25 |
| EP3910039A1 (en) | 2021-11-17 |
| KR20170067799A (ko) | 2017-06-16 |
| CN107001877A (zh) | 2017-08-01 |
| US10954422B2 (en) | 2021-03-23 |
| PL3207104T3 (pl) | 2022-01-03 |
| JP2017534721A (ja) | 2017-11-24 |
| WO2016061121A1 (en) | 2016-04-21 |
| US20170218239A1 (en) | 2017-08-03 |
| EP3207104A1 (en) | 2017-08-23 |
| CN107001877B (zh) | 2022-10-14 |
| KR102424027B1 (ko) | 2022-07-25 |
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