PL3207104T3 - Zgrzewalne i tłumiące drgania kleje silikonowe - Google Patents

Zgrzewalne i tłumiące drgania kleje silikonowe

Info

Publication number
PL3207104T3
PL3207104T3 PL15791816T PL15791816T PL3207104T3 PL 3207104 T3 PL3207104 T3 PL 3207104T3 PL 15791816 T PL15791816 T PL 15791816T PL 15791816 T PL15791816 T PL 15791816T PL 3207104 T3 PL3207104 T3 PL 3207104T3
Authority
PL
Poland
Prior art keywords
weldable
vibration damping
silicone adhesives
damping silicone
adhesives
Prior art date
Application number
PL15791816T
Other languages
English (en)
Inventor
Susan Rhodes
Michel RAVERS
Ingrid Geuens
Qianchun LI
Original Assignee
Avery Dennison Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Corporation filed Critical Avery Dennison Corporation
Publication of PL3207104T3 publication Critical patent/PL3207104T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/10—Joining materials by welding overlapping edges with an insertion of plastic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
PL15791816T 2014-10-13 2015-10-13 Zgrzewalne i tłumiące drgania kleje silikonowe PL3207104T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462063172P 2014-10-13 2014-10-13
US201562142590P 2015-04-03 2015-04-03
EP15791816.0A EP3207104B1 (en) 2014-10-13 2015-10-13 Weldable and vibration damping silicone adhesives
PCT/US2015/055360 WO2016061121A1 (en) 2014-10-13 2015-10-13 Weldable and vibration damping silicone adhesives

Publications (1)

Publication Number Publication Date
PL3207104T3 true PL3207104T3 (pl) 2022-01-03

Family

ID=54478956

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15791816T PL3207104T3 (pl) 2014-10-13 2015-10-13 Zgrzewalne i tłumiące drgania kleje silikonowe

Country Status (8)

Country Link
US (1) US10954422B2 (pl)
EP (2) EP3207104B1 (pl)
JP (1) JP2017534721A (pl)
KR (1) KR102424027B1 (pl)
CN (1) CN107001877B (pl)
ES (1) ES2890655T3 (pl)
PL (1) PL3207104T3 (pl)
WO (1) WO2016061121A1 (pl)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015203128A1 (de) * 2015-02-20 2016-08-25 Thyssenkrupp Ag Fahrwerkkomponente, Verfahren zu seiner Herstellung und Verwendung
US20180134925A1 (en) * 2016-11-11 2018-05-17 Polyonics, Inc. High temperature resistant pressure sensitive adhesive with low thermal impedance
DE102017202623A1 (de) * 2017-02-17 2018-08-23 Tesa Se Vibrationsdämpfende Silikon-Haftklebmasse
DE102017202624A1 (de) * 2017-02-17 2018-08-23 Tesa Se Vibrationsdämpfende Silikon-Haftklebmasse
WO2019071379A1 (en) * 2017-10-09 2019-04-18 3M Innovative Properties Company ADHESIVE DAMPING LAYERS FOR MICRO-SPEAKER DIAPHRAGMS
WO2022141224A1 (en) * 2020-12-30 2022-07-07 3M Innovative Properties Company Cured silicone adhesive composition
JP2022149619A (ja) * 2021-03-25 2022-10-07 株式会社Subaru 樹脂複合鋼板

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1957597A (en) 1927-04-09 1934-05-08 Buckeye Steel Castings Co Draft mechanism
US3110691A (en) 1958-12-11 1963-11-12 Ind Metal Protectives Inc Metallically pigmented liquid coating
US3118048A (en) 1961-07-18 1964-01-14 Ind Metal Proiectives Inc Liquid coating composition
US3193049A (en) 1963-05-27 1965-07-06 Daubert Chemical Co Sound damping tape
US3687739A (en) 1970-12-10 1972-08-29 Diamond Shamrock Corp Coated metal and method
JPS60912B2 (ja) 1980-06-04 1985-01-10 住友金属工業株式会社 スポツト溶接可能な接着クラツド金属板
US4584355A (en) 1984-10-29 1986-04-22 Dow Corning Corporation Silicone pressure-sensitive adhesive process and product with improved lap-shear stability-I
US5820940A (en) 1991-09-05 1998-10-13 Technalum Research, Inc. Preparation of adhesive coatings from thermally reactive binary and multicomponent powders
US5275856A (en) 1991-11-12 1994-01-04 Minnesota Mining And Manufacturing Company Electrically conductive adhesive web
US5170930A (en) 1991-11-14 1992-12-15 Microelectronics And Computer Technology Corporation Liquid metal paste for thermal and electrical connections
US5869556A (en) 1996-07-05 1999-02-09 Dow Corning Corporation Silicone pressure sensitive adhesives
US5726256A (en) 1996-10-22 1998-03-10 Dow Corning Corporation Method of making silicone pressure sensitive adhesives
DE19710115A1 (de) 1997-03-12 1998-09-17 Henkel Kgaa Schmelzklebstoff zur Verklebung von DVDs
DE19744957C1 (de) 1997-10-10 1999-07-29 Pritt Produktionsgesellschaft Mehrschichtiges, flexibles Korrekturband
EP1034090B1 (en) 1997-11-12 2003-12-17 Collins & Aikman Products Co. Vibration dampening laminate
JP3226889B2 (ja) 1998-05-06 2001-11-05 シンワ プロダクト カンパニー・リミテッド 導電性粘着テープ
US6117284A (en) 1998-09-28 2000-09-12 Wea Manufacturing, Inc. Dual-layer DVD disc, and method and apparatus for making same
US6201055B1 (en) * 1999-03-11 2001-03-13 Dow Corning Corporation Silicone composition and silicone pressure sensitive adhesive
US6703120B1 (en) * 1999-05-05 2004-03-09 3M Innovative Properties Company Silicone adhesives, articles, and methods
US6347586B1 (en) 2000-04-19 2002-02-19 Heidelberger Druckmaschinen Ag Method and device for reducing printing sleeve noise
US6361716B1 (en) 2000-07-20 2002-03-26 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
EP1304354B1 (en) * 2000-07-25 2007-01-24 Mitsui Chemicals, Inc. Curable composition and uses thereof
KR100713570B1 (ko) * 2001-04-20 2007-05-02 다우 코닝 코포레이션 실리콘 조성물 및 이로부터 제조된 전기 전도성 실리콘접착제
US6641923B2 (en) 2001-07-31 2003-11-04 Ppg Industries Ohio, Inc. Weldable coating compositions having improved intercoat adhesion
US6828020B2 (en) 2002-08-14 2004-12-07 Adco Products, Inc. Self-adhesive vibration damping tape and composition
JP3956121B2 (ja) * 2002-09-04 2007-08-08 信越化学工業株式会社 導電性シリコーン粘着剤組成物
JP2004117831A (ja) * 2002-09-26 2004-04-15 Shin Etsu Polymer Co Ltd 透明衝撃緩和部材および透明積層体
JP2004119254A (ja) 2002-09-27 2004-04-15 Three Bond Co Ltd 導電性接着剤組成物
US7147897B2 (en) 2002-11-06 2006-12-12 Ppg Industries Ohio, Inc. Weldable compositions comprising a conductive pigment and silicon and methods for using the same
WO2005108491A1 (ja) 2004-05-07 2005-11-17 Kaneka Corporation 硬化性組成物
DE102004054846A1 (de) 2004-11-12 2006-05-24 Henkel Kgaa Doppelseitiger Klebestrip mit hoher Tragkraft
KR101147434B1 (ko) 2005-01-25 2012-05-24 피피지 코팅스 네덜란드 비.브이. 바인더 조성물
US20070110942A1 (en) 2005-02-14 2007-05-17 Scapa North America Novel enhanced high temperature tapes for high velocity Oxy fuel processes
KR100625090B1 (ko) 2005-03-02 2006-09-20 모딘코리아 유한회사 고 마그네슘 알루미늄 합금용 접합시트 및 고 마그네슘 알루미늄 합금 접합방법
KR100700346B1 (ko) 2005-08-05 2007-03-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 기능성을 갖는 방열 점착테이프
US20080300358A1 (en) 2005-12-08 2008-12-04 Leon Neal Cook Continuous Process For Production Of Silicone Pressure Sensitive Adhesives
US20080102240A1 (en) 2006-10-27 2008-05-01 Covalence Specialty Materials Corp. Polymeric composite adhesive tape
JP5049584B2 (ja) * 2006-12-25 2012-10-17 東レ・ダウコーニング株式会社 過酸化物硬化型シリコーン系感圧接着剤組成物および粘着テープ
KR100774440B1 (ko) 2007-01-17 2007-11-08 조인셋 주식회사 전도성 점착테이프
WO2009081415A2 (en) 2007-12-24 2009-07-02 Prs Solutions Private Limited Process of manufacturing audio/visual detectable and tamper evident label stock for authentication
US9359529B2 (en) 2008-10-29 2016-06-07 3M Innovative Properties Company Electron beam cured silicone materials
WO2011031452A1 (en) 2009-08-25 2011-03-17 Dow Corning Corporation Process for the preparation of a silicone pressure-sensitive adhesive
CA2822748C (en) 2009-12-28 2021-06-01 Shimon Mizrahi Processes for welding composite materials and articles therefrom
KR100977064B1 (ko) 2010-02-19 2010-08-19 조인셋 주식회사 다목적 접착테이프
EP2688971A1 (en) * 2011-03-21 2014-01-29 Avery Dennison Corporation Non-flowing silicone adhesive
CN102984929B (zh) 2011-09-07 2015-07-08 港易有限公司 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法
WO2013148967A1 (en) 2012-03-30 2013-10-03 Adhesives Research, Inc. Charge collection tape
GB2504957A (en) * 2012-08-14 2014-02-19 Henkel Ag & Co Kgaa Curable compositions comprising composite particles
KR20140023820A (ko) 2012-08-17 2014-02-27 삼성전기주식회사 점착 테이프 및 이를 이용한 기판의 제조 방법

Also Published As

Publication number Publication date
KR20170067799A (ko) 2017-06-16
CN107001877A (zh) 2017-08-01
US10954422B2 (en) 2021-03-23
CN107001877B (zh) 2022-10-14
WO2016061121A1 (en) 2016-04-21
US20170218239A1 (en) 2017-08-03
EP3910039A1 (en) 2021-11-17
KR102424027B1 (ko) 2022-07-25
JP2017534721A (ja) 2017-11-24
ES2890655T3 (es) 2022-01-21
EP3207104A1 (en) 2017-08-23
EP3207104B1 (en) 2021-08-25

Similar Documents

Publication Publication Date Title
HK1255067A1 (zh) 抗c10orf54抗體及其用途
HK1243440A1 (zh) 抗白細胞介素-33抗體及其用途
IL247407A0 (en) Antibodies against egfrviii and their uses
PL3191561T3 (pl) Szybki i sprężysty klej
PL3207104T3 (pl) Zgrzewalne i tłumiące drgania kleje silikonowe
IL251001A0 (en) Anti-il-25 antibodies and their uses
EP3106709A4 (en) Vibration damping device
HUE044477T2 (hu) Torziós rezgéseket csillapító szerkezet
EP3346159A4 (en) Vibration damping device
PL2930270T3 (pl) Urządzenie tłumiące
GB2540517B (en) Damping device
HUE031353T2 (hu) Torziós rezgéseket csillapító szerkezet
EP3156689A4 (en) Vibration reduction device
EP3088765A4 (en) Vibration damping device
GB2553977B (en) Damper device
EP3135953A4 (en) Active vibration damping device and design method
GB201406158D0 (en) Vibration damper
GB201411252D0 (en) Damping device
PL3322912T3 (pl) Tłumik drgań
EP3208492A4 (en) Vibration damping device
EP3279501A4 (en) Vibration damping device
GB201519499D0 (en) Damping device
GB201403040D0 (en) Eye and facepack adhesive plaster
GB201419921D0 (en) Rigid vibration isolating member
EP3194688A4 (en) Vibration mitigation device