ES2538791T3 - Procedimiento no electrolítico de metalización en línea de sustratos por proyección con tratamiento previo de la superficie y dispositivo para la implementación del procedimiento - Google Patents
Procedimiento no electrolítico de metalización en línea de sustratos por proyección con tratamiento previo de la superficie y dispositivo para la implementación del procedimiento Download PDFInfo
- Publication number
- ES2538791T3 ES2538791T3 ES09781302.6T ES09781302T ES2538791T3 ES 2538791 T3 ES2538791 T3 ES 2538791T3 ES 09781302 T ES09781302 T ES 09781302T ES 2538791 T3 ES2538791 T3 ES 2538791T3
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- Prior art keywords
- projection
- implementation
- procedure
- surface treatment
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/003—General methods for coating; Devices therefor for hollow ware, e.g. containers
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
- C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/131—Glass, ceramic, or sintered, fused, fired, or calcined metal oxide or metal carbide containing [e.g., porcelain, brick, cement, etc.]
- Y10T428/1317—Multilayer [continuous layer]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Surface Treatment Of Glass (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Procedimiento de metalización de la superficie de un sustrato caracterizado por que se implementan las siguientes etapas: a. tratamiento físico del sustrato antes de la metalización, de modo que la energía superficial del sustrato sea superior o igual a 50 dinas, estando el tratamiento físico seleccionado de entre los siguientes tratamientos: un flameado, un tratamiento por corona, un tratamiento por plasma y sus combinaciones, b. metalización no electrolítica de la superficie del sustrato tratada en la etapa a, por proyección de una o más soluciones oxidorreductoras en forma de aerosol o aerosoles, c. realización de una capa de acabado sobre la superficie metalizada que es la aplicación de una composición líquida reticulable o un engrosamiento electrolítico de la superficie metalizada.
Description
Claims (1)
-
imagen1
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0855262 | 2008-07-30 | ||
FR0855262A FR2934609B1 (fr) | 2008-07-30 | 2008-07-30 | Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede. |
PCT/EP2009/059889 WO2010012810A2 (fr) | 2008-07-30 | 2009-07-30 | Procede non electrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2538791T3 true ES2538791T3 (es) | 2015-06-24 |
Family
ID=40545791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES09781302.6T Active ES2538791T3 (es) | 2008-07-30 | 2009-07-30 | Procedimiento no electrolítico de metalización en línea de sustratos por proyección con tratamiento previo de la superficie y dispositivo para la implementación del procedimiento |
Country Status (20)
Country | Link |
---|---|
US (1) | US9284645B2 (es) |
EP (1) | EP2326747B1 (es) |
JP (1) | JP5703214B2 (es) |
KR (1) | KR101642528B1 (es) |
CN (1) | CN102144045B (es) |
AU (1) | AU2009275851B2 (es) |
BR (1) | BRPI0916730B1 (es) |
CA (1) | CA2731407C (es) |
EG (1) | EG27060A (es) |
ES (1) | ES2538791T3 (es) |
FR (1) | FR2934609B1 (es) |
MA (1) | MA32549B1 (es) |
MX (1) | MX2011001123A (es) |
MY (1) | MY158289A (es) |
PL (1) | PL2326747T3 (es) |
PT (1) | PT2326747E (es) |
RU (1) | RU2532796C2 (es) |
SI (1) | SI2326747T1 (es) |
TN (1) | TN2011000023A1 (es) |
WO (1) | WO2010012810A2 (es) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102189881A (zh) * | 2010-03-15 | 2011-09-21 | 王基全 | 仿古工艺装饰摆件的制作方法 |
DE102010052032A1 (de) * | 2010-11-23 | 2012-05-24 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Verfahren zur Herstellung von metallischen Strukturen |
DE102010052033A1 (de) | 2010-11-23 | 2012-05-24 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Verfahren zur Herstellung von metallischen Strukturen |
EP2736858A1 (fr) | 2011-07-29 | 2014-06-04 | Saverglass - Societe Autonome de Verreries | Procédé de traitement d'un article en verre creux comportant un revêtement et installation pour mettre en oeuvre le procédé |
KR101333605B1 (ko) | 2012-04-16 | 2013-11-27 | 전자부품연구원 | 주족원소 기반의 환원제를 이용한 전도막 제조 방법 |
FR2994196B1 (fr) * | 2012-08-06 | 2014-08-22 | Plastic Omnium Cie | Procede de metallisation d'une piece pour vehicule automobile |
FR2994197B1 (fr) * | 2012-08-06 | 2014-08-22 | Plastic Omnium Cie | Procede de metallisation d'une surface d'une piece pour vehicule automobile |
WO2015039771A1 (en) * | 2013-09-17 | 2015-03-26 | Abb Technology Ag | Method for ultrasonic welding with particles trapping |
FR3011558A1 (fr) * | 2013-10-09 | 2015-04-10 | Vetver | Procede de decor par metallisation de bouteilles en verre prealablement remplies d'un vin de champagne |
FR3032724B1 (fr) | 2015-02-12 | 2019-12-13 | Jet Metal Technologies | Procede et dispositif de realisation de motifs metalliques sur un substrat a des fins decoratives et/ou fonctionnelles fabrication d'objets integrant cette realisation et ensemble de consommables utilises |
RU2597419C1 (ru) * | 2015-03-26 | 2016-09-10 | Общество С Ограниченной Ответственностью Управляющая Компания "Ломоносов Капитал" | Способ производства продукции из стекла |
FR3037081B1 (fr) * | 2015-06-05 | 2017-08-04 | Olivier Carton | Procede de metallisation et outil permettant la realisation de degrades complexes |
FR3060025B1 (fr) | 2016-12-09 | 2022-06-24 | Commissariat Atomique Et Aux Energies Alternatives | Procede de metallisation d'une surface d'un support solide |
CN107460454A (zh) * | 2017-09-20 | 2017-12-12 | 吴国明 | 一种相转化技术沉积纳米合金膜层的方法 |
CN107641801A (zh) * | 2017-09-20 | 2018-01-30 | 吴国明 | 一种相转化金属工艺 |
RU2707612C1 (ru) * | 2018-07-27 | 2019-11-28 | МСД Текнолоджис С.а.р.л. | Упрочненный стеклянный сосуд (варианты) и способ упрочнения стеклянного сосуда (варианты) |
CZ308348B6 (cs) | 2018-11-06 | 2020-06-10 | Bochemie A.S. | Způsob kontinuálního pokovení textilního materiálu, zařízení k provádění tohoto způsobu, pokovený textilní materiál a jeho použití |
CN109482560A (zh) * | 2018-11-30 | 2019-03-19 | 江阴精力机械有限公司 | 自动喷涂油漆生产线高效清洁预处理装置及其预处理工艺 |
DE102021005245A1 (de) | 2021-10-21 | 2023-04-27 | VDEh-Betriebsforschungsinstitut Gesellschaft mit beschränkter Haftung | Beschichungsvorrichtung zum galvanischen und/oder chemischen Beschichten eines Bauteils, Verfahren zur Beschichtung eines Bauteils und Verwendung einer Beschichtungsvorrichtung |
FR3133199A1 (fr) | 2022-03-04 | 2023-09-08 | Jet Metal Technologies | Procede de fabrication d’un article tridimensionnel a motif(s) metallique(s) |
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US3954570A (en) * | 1974-11-11 | 1976-05-04 | Amp Incorporated | Sensitized polyimides and circuit elements thereof |
SU624888A1 (ru) * | 1977-05-03 | 1978-09-25 | Особое конструкторское бюро Института высоких температур АН СССР | Способ металлизации изделий из стекла |
US4217182A (en) * | 1978-06-07 | 1980-08-12 | Litton Systems, Inc. | Semi-additive process of manufacturing a printed circuit |
NL8304084A (nl) | 1983-11-29 | 1985-06-17 | Philips Nv | Methode voor het aanbrengen van een metaalspiegel. |
US4576685A (en) * | 1985-04-23 | 1986-03-18 | Schering Ag | Process and apparatus for plating onto articles |
IT1219384B (it) | 1988-06-17 | 1990-05-11 | Pier Carlo Biginelli | Procedimento per la verniciatura metallizzante di manufatti ed apparecchiatura per la sua attuazione |
DE4242443C1 (en) * | 1992-12-16 | 1993-06-03 | Deutsche Automobilgesellschaft Mbh, 3300 Braunschweig, De | Wet chemical metallising process for pre-activated plastic substrates - involves collecting used metallising soln., activating soln. and aq. washings for processing and recycling in the process |
US5348574A (en) * | 1993-07-02 | 1994-09-20 | Monsanto Company | Metal-coated polyimide |
US6268016B1 (en) * | 1996-06-28 | 2001-07-31 | International Business Machines Corporation | Manufacturing computer systems with fine line circuitized substrates |
FR2763962B1 (fr) * | 1997-05-29 | 1999-10-15 | Guy Stremsdoerfer | Procede non electrolytique de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s) |
DE19822075C2 (de) * | 1998-05-16 | 2002-03-21 | Enthone Gmbh | Verfahren zur metallischen Beschichtung von Substraten |
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JP2000129452A (ja) * | 1998-10-23 | 2000-05-09 | Inoac Corp | 無電解めっき用プライマ剤、並びに無電解めっき層を備える積層品及びその製造方法 |
JP2000129448A (ja) * | 1998-10-23 | 2000-05-09 | Inoac Corp | 内面にめっき層を有する容器及びその製造方法 |
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KR20020071437A (ko) * | 2001-03-06 | 2002-09-12 | 유승균 | 고분자 소재 표면의 금속피막 도금방법 및 이를 이용한전자파 차폐방법 |
CN1310707C (zh) | 2002-01-29 | 2007-04-18 | 西巴特殊化学品控股有限公司 | 制备强附着涂层的方法 |
US6773818B2 (en) * | 2002-09-06 | 2004-08-10 | Exxonmobil Oil Corporation | Metallized, metallocene-catalyzed, polypropylene films |
JP2004190102A (ja) * | 2002-12-12 | 2004-07-08 | Shinko Electric Ind Co Ltd | 金属膜形成方法、半導体装置及び配線基板 |
JP2005264245A (ja) * | 2004-03-18 | 2005-09-29 | Ebara Corp | 基板の湿式処理方法及び処理装置 |
US20050208774A1 (en) | 2004-01-08 | 2005-09-22 | Akira Fukunaga | Wet processing method and processing apparatus of substrate |
FR2909101B1 (fr) * | 2006-11-24 | 2009-02-27 | Samuel Stremsdoerfer | Procede non electrolytique prefectionne de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s) |
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2008
- 2008-07-30 FR FR0855262A patent/FR2934609B1/fr active Active
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2009
- 2009-07-30 JP JP2011520519A patent/JP5703214B2/ja active Active
- 2009-07-30 RU RU2011107716/02A patent/RU2532796C2/ru active
- 2009-07-30 WO PCT/EP2009/059889 patent/WO2010012810A2/fr active Application Filing
- 2009-07-30 ES ES09781302.6T patent/ES2538791T3/es active Active
- 2009-07-30 EP EP09781302.6A patent/EP2326747B1/fr active Active
- 2009-07-30 AU AU2009275851A patent/AU2009275851B2/en active Active
- 2009-07-30 PT PT97813026T patent/PT2326747E/pt unknown
- 2009-07-30 KR KR1020117004913A patent/KR101642528B1/ko active IP Right Grant
- 2009-07-30 BR BRPI0916730-7A patent/BRPI0916730B1/pt active IP Right Grant
- 2009-07-30 MX MX2011001123A patent/MX2011001123A/es active IP Right Grant
- 2009-07-30 PL PL09781302T patent/PL2326747T3/pl unknown
- 2009-07-30 MY MYPI2011000441A patent/MY158289A/en unknown
- 2009-07-30 CA CA2731407A patent/CA2731407C/fr active Active
- 2009-07-30 US US13/056,090 patent/US9284645B2/en active Active
- 2009-07-30 SI SI200931204T patent/SI2326747T1/sl unknown
- 2009-07-30 CN CN200980134676.7A patent/CN102144045B/zh active Active
-
2011
- 2011-01-24 TN TN2011000023A patent/TN2011000023A1/fr unknown
- 2011-01-27 EG EG2011010167A patent/EG27060A/xx active
- 2011-02-10 MA MA33598A patent/MA32549B1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
BRPI0916730B1 (pt) | 2019-05-07 |
WO2010012810A3 (fr) | 2010-05-27 |
PT2326747E (pt) | 2015-07-16 |
KR20110044885A (ko) | 2011-05-02 |
CA2731407A1 (fr) | 2010-02-04 |
SI2326747T1 (sl) | 2015-10-30 |
EG27060A (en) | 2015-05-05 |
TN2011000023A1 (fr) | 2012-09-05 |
JP2011529528A (ja) | 2011-12-08 |
EP2326747A2 (fr) | 2011-06-01 |
MY158289A (en) | 2016-09-30 |
FR2934609A1 (fr) | 2010-02-05 |
CN102144045B (zh) | 2017-04-26 |
AU2009275851A1 (en) | 2010-02-04 |
AU2009275851B2 (en) | 2015-12-17 |
JP5703214B2 (ja) | 2015-04-15 |
FR2934609B1 (fr) | 2011-07-22 |
BRPI0916730A2 (pt) | 2015-11-10 |
KR101642528B1 (ko) | 2016-07-25 |
MX2011001123A (es) | 2011-03-29 |
US20110155444A1 (en) | 2011-06-30 |
RU2532796C2 (ru) | 2014-11-10 |
RU2011107716A (ru) | 2012-09-10 |
CA2731407C (fr) | 2017-03-07 |
WO2010012810A2 (fr) | 2010-02-04 |
MA32549B1 (fr) | 2011-08-01 |
US9284645B2 (en) | 2016-03-15 |
EP2326747B1 (fr) | 2015-03-11 |
CN102144045A (zh) | 2011-08-03 |
PL2326747T3 (pl) | 2015-08-31 |
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