ES2269256T3 - Compuesto de encapsulamiento de alta tg. - Google Patents

Compuesto de encapsulamiento de alta tg. Download PDF

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Publication number
ES2269256T3
ES2269256T3 ES01115671T ES01115671T ES2269256T3 ES 2269256 T3 ES2269256 T3 ES 2269256T3 ES 01115671 T ES01115671 T ES 01115671T ES 01115671 T ES01115671 T ES 01115671T ES 2269256 T3 ES2269256 T3 ES 2269256T3
Authority
ES
Spain
Prior art keywords
epoxy
weight
parts
amount
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES01115671T
Other languages
English (en)
Spanish (es)
Inventor
Michel Ruyters
Neil Carpenter
Roseann Schultz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Starch and Chemical Investment Holding Corp
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Application granted granted Critical
Publication of ES2269256T3 publication Critical patent/ES2269256T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
ES01115671T 2000-07-20 2001-07-04 Compuesto de encapsulamiento de alta tg. Expired - Lifetime ES2269256T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/620,170 US6462108B1 (en) 2000-07-20 2000-07-20 High Tg potting compound
US620170 2000-07-20

Publications (1)

Publication Number Publication Date
ES2269256T3 true ES2269256T3 (es) 2007-04-01

Family

ID=24484872

Family Applications (1)

Application Number Title Priority Date Filing Date
ES01115671T Expired - Lifetime ES2269256T3 (es) 2000-07-20 2001-07-04 Compuesto de encapsulamiento de alta tg.

Country Status (7)

Country Link
US (1) US6462108B1 (https=)
EP (1) EP1174456B1 (https=)
JP (1) JP2002088226A (https=)
AT (1) ATE340207T1 (https=)
DE (1) DE60123176T2 (https=)
ES (1) ES2269256T3 (https=)
PT (1) PT1174456E (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040014969A (ko) 2001-06-28 2004-02-18 도레이 가부시끼가이샤 내후성이 우수한 에폭시 수지 조성물 및 섬유 강화 복합재료
US20060147719A1 (en) * 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
US20050181214A1 (en) * 2002-11-22 2005-08-18 John Robert Campbell Curable epoxy compositions, methods and articles made therefrom
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
US20050048291A1 (en) * 2003-08-14 2005-03-03 General Electric Company Nano-filled composite materials with exceptionally high glass transition temperature
CN100448909C (zh) * 2003-02-28 2009-01-07 长兴化学工业股份有限公司 感光元件封装材料组合物及其使用方法
US20050008865A1 (en) * 2003-07-07 2005-01-13 General Electric Company Curable epoxy compositions and articles made therefrom
ATE397647T1 (de) * 2006-03-06 2008-06-15 Umicore Ag & Co Kg Zusammensetzung zur befestigung von hochleistungshalbleiter
US7439752B2 (en) * 2006-05-03 2008-10-21 Micron Technology, Inc. Methods of providing semiconductor components within sockets
EP2229416B1 (en) * 2008-01-08 2018-04-04 Dow Global Technologies LLC High tg epoxy systems for composite application
CN101909748B (zh) * 2008-01-10 2014-03-12 日本化药株式会社 环氧化催化剂、环氧化催化剂的制造方法、环氧化合物的制造方法、固化性树脂组合物及其固化物
RU2474599C2 (ru) * 2011-03-09 2013-02-10 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Компаунд и способ его получения
US8815725B2 (en) 2013-01-18 2014-08-26 International Business Machines Corporation Low alpha particle emission electrically-conductive coating
JP6222428B2 (ja) * 2013-07-05 2017-11-01 ナガセケムテックス株式会社 エポキシ樹脂組成物
WO2016204183A1 (ja) * 2015-06-16 2016-12-22 日立化成株式会社 フィルム形成用樹脂組成物及びこれを用いた封止フィルム、支持体付き封止フィルム、半導体装置
RU2628786C1 (ru) * 2016-11-10 2017-08-22 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Многослойный самоклеящийся материал
CN109021503A (zh) * 2018-07-26 2018-12-18 安徽同佳电子科技有限公司 一种绝缘、耐冲击电磁线圈封装材料的制备方法
FI3889222T3 (fi) 2020-03-30 2025-08-21 Henkel Ag & Co Kgaa Erityistä huolta aiheuttavista aineista vapaa kovettuva valukoostumus
JP2025041571A (ja) * 2023-09-13 2025-03-26 達興材料股▲ふん▼有限公司 硬化用組成物、硬化物及びその応用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657992A (en) * 1986-02-18 1987-04-14 Coors Porcelain Company Paste anhydride curing system for cast epoxy resin bodies and method for making the same
DE3913488C2 (de) * 1989-04-25 1994-02-03 Bosch Gmbh Robert Vergußmasse für elektrische und elektronische Bauteile
US5189080A (en) * 1989-04-25 1993-02-23 Robert Bosch Gmbh Epoxy resin composition for encapsulating electric circuit components
US5045609A (en) 1989-07-07 1991-09-03 Hexcel Corporation Toughened, high temperature resin matrix system
US5276073A (en) * 1989-08-26 1994-01-04 Somar Corporation Thermosetting resin composition comprising maleimide, anhydride, epoxy resin and wollastonite
US4999699A (en) 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
US5155066A (en) 1990-10-24 1992-10-13 Johnson Matthey Inc. Rapid-curing adhesive formulation for semiconductor devices
US5195299B1 (en) 1992-02-28 1996-02-13 Johnson Matthey Inc Method of reducing moisture content of hermetic packages containing semiconductor devices
JPH09286840A (ja) * 1996-04-19 1997-11-04 Toshiba Chem Corp エポキシ樹脂組成物
JP2000086869A (ja) * 1998-09-16 2000-03-28 Toshiba Chem Corp エポキシ樹脂組成物およびコイル

Also Published As

Publication number Publication date
US6462108B1 (en) 2002-10-08
DE60123176D1 (de) 2006-11-02
DE60123176T2 (de) 2007-01-04
EP1174456B1 (en) 2006-09-20
ATE340207T1 (de) 2006-10-15
EP1174456A2 (en) 2002-01-23
EP1174456A3 (en) 2003-01-02
PT1174456E (pt) 2006-12-29
JP2002088226A (ja) 2002-03-27

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