ATE340207T1 - Vergussmasse mit hohem tg - Google Patents

Vergussmasse mit hohem tg

Info

Publication number
ATE340207T1
ATE340207T1 AT01115671T AT01115671T ATE340207T1 AT E340207 T1 ATE340207 T1 AT E340207T1 AT 01115671 T AT01115671 T AT 01115671T AT 01115671 T AT01115671 T AT 01115671T AT E340207 T1 ATE340207 T1 AT E340207T1
Authority
AT
Austria
Prior art keywords
weight
parts
amount
present
epoxy
Prior art date
Application number
AT01115671T
Other languages
German (de)
English (en)
Inventor
Michel Ruyters
Neil Carpenter
Roseann Schultz
Original Assignee
Nat Starch Chem Invest
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Starch Chem Invest filed Critical Nat Starch Chem Invest
Application granted granted Critical
Publication of ATE340207T1 publication Critical patent/ATE340207T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
AT01115671T 2000-07-20 2001-07-04 Vergussmasse mit hohem tg ATE340207T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/620,170 US6462108B1 (en) 2000-07-20 2000-07-20 High Tg potting compound

Publications (1)

Publication Number Publication Date
ATE340207T1 true ATE340207T1 (de) 2006-10-15

Family

ID=24484872

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01115671T ATE340207T1 (de) 2000-07-20 2001-07-04 Vergussmasse mit hohem tg

Country Status (7)

Country Link
US (1) US6462108B1 (https=)
EP (1) EP1174456B1 (https=)
JP (1) JP2002088226A (https=)
AT (1) ATE340207T1 (https=)
DE (1) DE60123176T2 (https=)
ES (1) ES2269256T3 (https=)
PT (1) PT1174456E (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040014969A (ko) 2001-06-28 2004-02-18 도레이 가부시끼가이샤 내후성이 우수한 에폭시 수지 조성물 및 섬유 강화 복합재료
US20060147719A1 (en) * 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
US20050181214A1 (en) * 2002-11-22 2005-08-18 John Robert Campbell Curable epoxy compositions, methods and articles made therefrom
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
US20050048291A1 (en) * 2003-08-14 2005-03-03 General Electric Company Nano-filled composite materials with exceptionally high glass transition temperature
CN100448909C (zh) * 2003-02-28 2009-01-07 长兴化学工业股份有限公司 感光元件封装材料组合物及其使用方法
US20050008865A1 (en) * 2003-07-07 2005-01-13 General Electric Company Curable epoxy compositions and articles made therefrom
ATE397647T1 (de) * 2006-03-06 2008-06-15 Umicore Ag & Co Kg Zusammensetzung zur befestigung von hochleistungshalbleiter
US7439752B2 (en) * 2006-05-03 2008-10-21 Micron Technology, Inc. Methods of providing semiconductor components within sockets
EP2229416B1 (en) * 2008-01-08 2018-04-04 Dow Global Technologies LLC High tg epoxy systems for composite application
CN101909748B (zh) * 2008-01-10 2014-03-12 日本化药株式会社 环氧化催化剂、环氧化催化剂的制造方法、环氧化合物的制造方法、固化性树脂组合物及其固化物
RU2474599C2 (ru) * 2011-03-09 2013-02-10 Открытое акционерное общество "Научно-исследовательский институт приборостроения имени В.В. Тихомирова" Компаунд и способ его получения
US8815725B2 (en) 2013-01-18 2014-08-26 International Business Machines Corporation Low alpha particle emission electrically-conductive coating
JP6222428B2 (ja) * 2013-07-05 2017-11-01 ナガセケムテックス株式会社 エポキシ樹脂組成物
WO2016204183A1 (ja) * 2015-06-16 2016-12-22 日立化成株式会社 フィルム形成用樹脂組成物及びこれを用いた封止フィルム、支持体付き封止フィルム、半導体装置
RU2628786C1 (ru) * 2016-11-10 2017-08-22 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Многослойный самоклеящийся материал
CN109021503A (zh) * 2018-07-26 2018-12-18 安徽同佳电子科技有限公司 一种绝缘、耐冲击电磁线圈封装材料的制备方法
FI3889222T3 (fi) 2020-03-30 2025-08-21 Henkel Ag & Co Kgaa Erityistä huolta aiheuttavista aineista vapaa kovettuva valukoostumus
JP2025041571A (ja) * 2023-09-13 2025-03-26 達興材料股▲ふん▼有限公司 硬化用組成物、硬化物及びその応用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657992A (en) * 1986-02-18 1987-04-14 Coors Porcelain Company Paste anhydride curing system for cast epoxy resin bodies and method for making the same
DE3913488C2 (de) * 1989-04-25 1994-02-03 Bosch Gmbh Robert Vergußmasse für elektrische und elektronische Bauteile
US5189080A (en) * 1989-04-25 1993-02-23 Robert Bosch Gmbh Epoxy resin composition for encapsulating electric circuit components
US5045609A (en) 1989-07-07 1991-09-03 Hexcel Corporation Toughened, high temperature resin matrix system
US5276073A (en) * 1989-08-26 1994-01-04 Somar Corporation Thermosetting resin composition comprising maleimide, anhydride, epoxy resin and wollastonite
US4999699A (en) 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
US5155066A (en) 1990-10-24 1992-10-13 Johnson Matthey Inc. Rapid-curing adhesive formulation for semiconductor devices
US5195299B1 (en) 1992-02-28 1996-02-13 Johnson Matthey Inc Method of reducing moisture content of hermetic packages containing semiconductor devices
JPH09286840A (ja) * 1996-04-19 1997-11-04 Toshiba Chem Corp エポキシ樹脂組成物
JP2000086869A (ja) * 1998-09-16 2000-03-28 Toshiba Chem Corp エポキシ樹脂組成物およびコイル

Also Published As

Publication number Publication date
ES2269256T3 (es) 2007-04-01
US6462108B1 (en) 2002-10-08
DE60123176D1 (de) 2006-11-02
DE60123176T2 (de) 2007-01-04
EP1174456B1 (en) 2006-09-20
EP1174456A2 (en) 2002-01-23
EP1174456A3 (en) 2003-01-02
PT1174456E (pt) 2006-12-29
JP2002088226A (ja) 2002-03-27

Similar Documents

Publication Publication Date Title
ATE340207T1 (de) Vergussmasse mit hohem tg
DK0738693T3 (da) Glasfibersammensætninger
EP1568723A4 (en) PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION AND PRINTED CIRCUIT BOARDS MADE BY MEANS OF SUCH A COMPOSITION
WO2009041389A1 (ja) エポキシ樹脂組成物、その硬化物及び発光ダイオード
SG158878A1 (en) Epoxy resin composition, method of rendering the same latent, and semiconductor device
EP1548043A4 (en) EPOXY RESIN COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR
ATE271102T1 (de) Kristallin polyimid enthaltende harzzusammensetzung
TW200516109A (en) Polycarbonate resin composition and optical part
EP0738759A4 (en) EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR ARRANGEMENTS
MY143212A (en) Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
ATE212623T1 (de) Diglycidylether
ES2141458T3 (es) Composiciones de silicona endurecibles en presencia de agua o de la humedad del aire.
ATE298771T1 (de) Epoxyharzzusammensetzung zur einkapselung von halbleitern
TW200602701A (en) Photosensitive resin composition for optical waveguide formation and optical waveguide
EP1591486A4 (en) THERMOPLASTIC POLYESTER RESIN COMPOSITION AND FORM BODY
MY137564A (en) Resin composition for encapsulating semiconductor chip and semiconductor device therewith
DE69705826D1 (de) Einkomponentenepoxidharz verarbeitungsmaterial
MY111987A (en) Heat resistant resin composition, heat resistant film adhesive and process for producing the same
MY126833A (en) High temperature underfilling material with low exotherm during use
JPS5657820A (en) Curable epoxy resin composition
ES2100888T3 (es) Una matriz epoxidica con tenacidad aumentada con una tolerancia al daño y un rendimiento termico mejorados.
ATE78843T1 (de) Polyarylensulfidharzzusammensetzungen.
EP0524433A3 (en) Poly-hydroxynaphthalene compounds and epoxy resin composition
JPS5426000A (en) Epoxy resin composition
IT1248349B (it) Formulazioni di matrici a base di resine epossidiche con migliorata stabilita' all'immagazzinamento

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties