ES2212364T3 - Procedimiento y dispositivo para la eliminacion de material de una superficie de una pieza. - Google Patents
Procedimiento y dispositivo para la eliminacion de material de una superficie de una pieza.Info
- Publication number
- ES2212364T3 ES2212364T3 ES98952674T ES98952674T ES2212364T3 ES 2212364 T3 ES2212364 T3 ES 2212364T3 ES 98952674 T ES98952674 T ES 98952674T ES 98952674 T ES98952674 T ES 98952674T ES 2212364 T3 ES2212364 T3 ES 2212364T3
- Authority
- ES
- Spain
- Prior art keywords
- machining
- laser beam
- field
- positioning
- relative position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP1998/006217 WO2000018535A1 (de) | 1998-09-30 | 1998-09-30 | Verfahren und vorrichtung zur materialabtragung aus einer fläche eines werkstücks |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2212364T3 true ES2212364T3 (es) | 2004-07-16 |
Family
ID=8167079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES98952674T Expired - Lifetime ES2212364T3 (es) | 1998-09-30 | 1998-09-30 | Procedimiento y dispositivo para la eliminacion de material de una superficie de una pieza. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6670575B1 (https=) |
| EP (1) | EP1117503B1 (https=) |
| JP (1) | JP4156805B2 (https=) |
| DE (1) | DE59810296D1 (https=) |
| ES (1) | ES2212364T3 (https=) |
| WO (1) | WO2000018535A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10032981A1 (de) * | 2000-07-10 | 2002-01-24 | Alltec Angewandte Laser Licht | Verfahren zur Materialbearbeitung mittels Laser |
| DE10228743B4 (de) * | 2002-06-27 | 2005-05-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Glätten und Polieren von Oberflächen durch Bearbeitung mit Laserstrahlung |
| US7880116B2 (en) * | 2003-03-18 | 2011-02-01 | Loma Linda University Medical Center | Laser head for irradiation and removal of material from a surface of a structure |
| US7057134B2 (en) | 2003-03-18 | 2006-06-06 | Loma Linda University Medical Center | Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure |
| US7060932B2 (en) * | 2003-03-18 | 2006-06-13 | Loma Linda University Medical Center | Method and apparatus for material processing |
| US7038166B2 (en) * | 2003-03-18 | 2006-05-02 | Loma Linda University Medical Center | Containment plenum for laser irradiation and removal of material from a surface of a structure |
| US7286223B2 (en) * | 2003-03-18 | 2007-10-23 | Loma Linda University Medical Center | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
| US7379483B2 (en) * | 2003-03-18 | 2008-05-27 | Loma Linda University Medical Center | Method and apparatus for material processing |
| DE10317322B4 (de) * | 2003-04-15 | 2007-01-25 | Lasertec Gmbh | Verfahren und Vorrichtung zur Ermittlung der Abtragsleistung eines Laserstrahls und zur Herstellung eines Gesenks in einem Werkstück |
| DE10317579B4 (de) * | 2003-04-16 | 2016-04-14 | Lasertec Gmbh | Verfahren und Vorrichtung zur Herstellung eines Gesenks in einem Werkstück |
| DE10324439B4 (de) * | 2003-05-28 | 2008-01-31 | Lasertec Gmbh | Verfahren und Vorrichtung zur Herstellung eines Gesenks |
| DE10352402B4 (de) * | 2003-11-10 | 2015-12-17 | Lasertec Gmbh | Laserbearbeitungsmaschine und Laserbearbeitungsverfahren |
| DE102004013475B4 (de) * | 2004-03-18 | 2007-01-25 | Lasertec Gmbh | Verfahren und Vorrichtung zum Abtragen von Material |
| CA2617120C (en) * | 2005-07-27 | 2014-10-07 | Power Medical Interventions, Inc. | System and method for forming staple pockets of a surgical stapler |
| DE102007012816B4 (de) | 2007-03-16 | 2009-12-03 | Sauer Gmbh Lasertec | Verfahren und Vorrichtung zur Werkstückbearbeitung |
| CN104275552A (zh) * | 2013-07-10 | 2015-01-14 | 苏州矽微电子科技有限公司 | 激光器去除集成电路塑封膜的用途 |
| DE102013217783A1 (de) | 2013-09-05 | 2015-03-05 | Sauer Gmbh Lasertec | Verfahren zur Bearbeitung eines Werkstücks mittels eines Laserstrahls, Laserwerkzeug, Lasermaschine, Maschinensteuerung |
| CN103769749B (zh) * | 2013-12-30 | 2016-10-19 | 德中(天津)技术发展有限公司 | 一种在覆金属箔绝缘基板上制作导电图案的方法 |
| DE102014220525A1 (de) * | 2014-10-09 | 2016-04-14 | Siemens Aktiengesellschaft | Abtragstrategie beim Lasern |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4154530A (en) * | 1977-12-22 | 1979-05-15 | National Semiconductor Corporation | Laser beam error correcting process |
| US5095190A (en) * | 1987-03-03 | 1992-03-10 | Canon Kabushiki Kaisha | Exposure apparatus |
| US4914270A (en) | 1988-11-08 | 1990-04-03 | University Of Southern California | Method and apparatus for shaping articles using a laser beam |
| DE59002985D1 (de) * | 1989-07-14 | 1993-11-11 | Maho Ag | Verfahren und Vorrichtung zum Herstellen von Hohlräumen in Werkstücken mittels Laserstrahls. |
| US5140128A (en) * | 1990-05-03 | 1992-08-18 | General Electric Company | Method and system for providing elements of composite objects |
| JPH04100689A (ja) * | 1990-08-14 | 1992-04-02 | Tsubakimoto Chain Co | レーザ加工機用5軸テーブル |
| JPH0487294U (https=) * | 1990-12-12 | 1992-07-29 | ||
| JP2798530B2 (ja) * | 1991-07-26 | 1998-09-17 | 三菱電機株式会社 | レーザ加工機 |
| DE4209933C2 (de) * | 1992-03-27 | 1994-08-11 | Foba Formenbau Gmbh | Verfahren für den Formabtrag an einem Werkstück durch Laserstrahlverdampfung des Werkstoffes mit einem cw-Nd:YAG-Laser |
| JPH06304769A (ja) * | 1993-04-20 | 1994-11-01 | Iida Kogyo Kk | レーザ彫刻加工方法 |
| JP3077539B2 (ja) * | 1994-12-22 | 2000-08-14 | 松下電器産業株式会社 | レーザ加工方法 |
| JPH10242617A (ja) * | 1997-02-28 | 1998-09-11 | Murata Mfg Co Ltd | セラミックグリーンシートの加工方法及びレーザ加工装置 |
-
1998
- 1998-09-30 EP EP98952674A patent/EP1117503B1/de not_active Expired - Lifetime
- 1998-09-30 DE DE59810296T patent/DE59810296D1/de not_active Expired - Lifetime
- 1998-09-30 US US09/806,353 patent/US6670575B1/en not_active Expired - Lifetime
- 1998-09-30 WO PCT/EP1998/006217 patent/WO2000018535A1/de not_active Ceased
- 1998-09-30 JP JP2000572045A patent/JP4156805B2/ja not_active Expired - Lifetime
- 1998-09-30 ES ES98952674T patent/ES2212364T3/es not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003517375A (ja) | 2003-05-27 |
| US6670575B1 (en) | 2003-12-30 |
| DE59810296D1 (de) | 2004-01-08 |
| EP1117503A1 (de) | 2001-07-25 |
| EP1117503B1 (de) | 2003-11-26 |
| WO2000018535A1 (de) | 2000-04-06 |
| JP4156805B2 (ja) | 2008-09-24 |
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