ES2155490T3 - Caracteristicas estratificadas para integracion de modulo copirolizado. - Google Patents
Caracteristicas estratificadas para integracion de modulo copirolizado.Info
- Publication number
- ES2155490T3 ES2155490T3 ES95113349T ES95113349T ES2155490T3 ES 2155490 T3 ES2155490 T3 ES 2155490T3 ES 95113349 T ES95113349 T ES 95113349T ES 95113349 T ES95113349 T ES 95113349T ES 2155490 T3 ES2155490 T3 ES 2155490T3
- Authority
- ES
- Spain
- Prior art keywords
- copirolized
- stratified
- integration
- module
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000010354 integration Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
UNA ESTRUCTURA DE CIRCUITO MULTICAPA UNIFICADA (10) COMPRENDE UNA PLURALIDAD DE CAPAS AISLANTES DIELECTRICAS PLANAS (11) APILADAS DE MANERA LAMINAR PARA FORMAR UN SUSTRATO. EL SUSTRATO TIENE LADOS FORMADOS POR BORDES DE CAPAS AISLANTES DIELECTRICAS (11). UNAS REGIONES ENCASTRADAS (15, 13) ESTAN FORMADAS EN UNO O MAS LADOS DEL SUSTRATO PARA SU USO EN LA FIJACION DE LA ESTRUCTURA DE CIRCUITO MULTICAPA UNIFICADA (10) A UN CONJUNTO DE MAYOR NIVEL O PARA FIJACION DE LA CIRCUITERIA DE CONTACTO ELECTRICO (17) A LA ESTRUCTURA DE CIRCUITO MULTICAPA UNIFICADA (10).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/296,392 US5498905A (en) | 1994-08-26 | 1994-08-26 | Layered features for co-fired module integration |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2155490T3 true ES2155490T3 (es) | 2001-05-16 |
Family
ID=23141825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95113349T Expired - Lifetime ES2155490T3 (es) | 1994-08-26 | 1995-08-25 | Caracteristicas estratificadas para integracion de modulo copirolizado. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5498905A (es) |
EP (1) | EP0698921B1 (es) |
JP (1) | JP2703522B2 (es) |
DE (1) | DE69520624T2 (es) |
ES (1) | ES2155490T3 (es) |
IL (1) | IL115050A (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5994166A (en) | 1997-03-10 | 1999-11-30 | Micron Technology, Inc. | Method of constructing stacked packages |
US6738600B1 (en) * | 2000-08-04 | 2004-05-18 | Harris Corporation | Ceramic microelectromechanical structure |
US6437981B1 (en) | 2000-11-30 | 2002-08-20 | Harris Corporation | Thermally enhanced microcircuit package and method of forming same |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2449739A1 (de) * | 1974-10-19 | 1976-04-29 | Junghans Gmbh Geb | Kontaktanordnung fuer eine auswechselbare elektronische baueinheit |
JPS63155648A (ja) * | 1986-12-18 | 1988-06-28 | Toshiba Corp | 固体撮像素子用セラミツクパツケ−ジ |
JPH088321B2 (ja) * | 1987-01-19 | 1996-01-29 | 住友電気工業株式会社 | 集積回路パツケ−ジ |
US5136471A (en) * | 1987-02-26 | 1992-08-04 | Nec Corporation | Laminate wiring board |
JPH01217950A (ja) * | 1988-02-26 | 1989-08-31 | Toshiba Corp | 固体撮像装置 |
US4882657A (en) * | 1988-04-06 | 1989-11-21 | Ici Array Technology, Inc. | Pin grid array assembly |
JPH02170382A (ja) * | 1988-12-23 | 1990-07-02 | Nec Corp | パッケージ実装構造 |
JPH0322497A (ja) * | 1989-06-19 | 1991-01-30 | Toshiba Corp | セラミック多層配線基板 |
US5399898A (en) * | 1992-07-17 | 1995-03-21 | Lsi Logic Corporation | Multi-chip semiconductor arrangements using flip chip dies |
US5051869A (en) * | 1990-05-10 | 1991-09-24 | Rockwell International Corporation | Advanced co-fired multichip/hybrid package |
WO1992002040A1 (en) * | 1990-07-25 | 1992-02-06 | Dsm N.V. | Package for incorporating an integrated circuit and a process for the production of the package |
US5245216A (en) * | 1990-09-11 | 1993-09-14 | Kabushiki Kaisha Toshiba | Plastic-molded type semiconductor device |
JP2883458B2 (ja) * | 1991-02-27 | 1999-04-19 | 株式会社東芝 | 混成集積回路用配線板の製造方法 |
JPH0513959A (ja) * | 1991-07-02 | 1993-01-22 | Matsushita Electric Ind Co Ltd | 多層配線回路基板 |
EP0526992B1 (en) * | 1991-07-25 | 1996-05-01 | Ncr International Inc. | Multilayer carrier for mounting an integrated circuit and method of making the same |
US5397916A (en) * | 1991-12-10 | 1995-03-14 | Normington; Peter J. C. | Semiconductor device including stacked die |
JP2903865B2 (ja) * | 1992-06-03 | 1999-06-14 | 富士通株式会社 | プリント板ユニット挿抜構造 |
JPH06120624A (ja) * | 1992-10-08 | 1994-04-28 | Fujitsu Ltd | 微細多層配線板構造 |
-
1994
- 1994-08-26 US US08/296,392 patent/US5498905A/en not_active Expired - Fee Related
-
1995
- 1995-08-23 IL IL115050A patent/IL115050A/xx not_active IP Right Cessation
- 1995-08-25 DE DE69520624T patent/DE69520624T2/de not_active Expired - Fee Related
- 1995-08-25 EP EP95113349A patent/EP0698921B1/en not_active Expired - Lifetime
- 1995-08-25 ES ES95113349T patent/ES2155490T3/es not_active Expired - Lifetime
- 1995-08-28 JP JP7219284A patent/JP2703522B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2703522B2 (ja) | 1998-01-26 |
DE69520624T2 (de) | 2001-08-23 |
EP0698921A2 (en) | 1996-02-28 |
US5498905A (en) | 1996-03-12 |
JPH08172275A (ja) | 1996-07-02 |
IL115050A (en) | 1997-09-30 |
EP0698921B1 (en) | 2001-04-11 |
IL115050A0 (en) | 1995-12-08 |
DE69520624D1 (de) | 2001-05-17 |
EP0698921A3 (en) | 1996-10-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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