DE60038030D1 - Elektrische vorrichtungen und herstellungsverfahren - Google Patents

Elektrische vorrichtungen und herstellungsverfahren

Info

Publication number
DE60038030D1
DE60038030D1 DE60038030T DE60038030T DE60038030D1 DE 60038030 D1 DE60038030 D1 DE 60038030D1 DE 60038030 T DE60038030 T DE 60038030T DE 60038030 T DE60038030 T DE 60038030T DE 60038030 D1 DE60038030 D1 DE 60038030D1
Authority
DE
Germany
Prior art keywords
conductive surface
laminate
laminates
conductive
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60038030T
Other languages
English (en)
Other versions
DE60038030T2 (de
Inventor
Scott Hetherton
Wayne Montoya
Thomas Bruguier
Randy Daering
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corp filed Critical Tyco Electronics Corp
Application granted granted Critical
Publication of DE60038030D1 publication Critical patent/DE60038030D1/de
Publication of DE60038030T2 publication Critical patent/DE60038030T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H01C13/02—Structural combinations of resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49089—Filling with powdered insulation
    • Y10T29/49091—Filling with powdered insulation with direct compression of powdered insulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49098—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Laminated Bodies (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Developing Agents For Electrophotography (AREA)
DE60038030T 1999-09-14 2000-09-13 Elektrische vorrichtungen und herstellungsverfahren Expired - Lifetime DE60038030T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US395869 1989-08-18
US09/395,869 US6640420B1 (en) 1999-09-14 1999-09-14 Process for manufacturing a composite polymeric circuit protection device
PCT/US2000/025118 WO2001020619A2 (en) 1999-09-14 2000-09-13 Electrical devices and process for making such devices

Publications (2)

Publication Number Publication Date
DE60038030D1 true DE60038030D1 (de) 2008-03-27
DE60038030T2 DE60038030T2 (de) 2009-02-05

Family

ID=23564886

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60038030T Expired - Lifetime DE60038030T2 (de) 1999-09-14 2000-09-13 Elektrische vorrichtungen und herstellungsverfahren

Country Status (8)

Country Link
US (2) US6640420B1 (de)
EP (1) EP1212759B1 (de)
JP (2) JP5210480B2 (de)
CN (2) CN100492554C (de)
AT (1) ATE386330T1 (de)
DE (1) DE60038030T2 (de)
TW (1) TW523899B (de)
WO (1) WO2001020619A2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6854176B2 (en) * 1999-09-14 2005-02-15 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
TW583080B (en) * 2001-03-07 2004-04-11 Protectronics Technology Corp Composite material for thermistor having positive temperature coefficient and manufacturing method thereof
TW528210U (en) * 2001-11-12 2003-04-11 Polytronics Technology Corp Battery protection device of multi-layer structure
TW547866U (en) * 2002-07-31 2003-08-11 Polytronics Technology Corp Over-current protection device
US7367114B2 (en) * 2002-08-26 2008-05-06 Littelfuse, Inc. Method for plasma etching to manufacture electrical devices having circuit protection
US20040051622A1 (en) * 2002-09-17 2004-03-18 Tyco Electronics Corporation Polymeric PTC device and method of making such device
KR100485890B1 (ko) * 2002-10-22 2005-04-29 엘에스전선 주식회사 표면실장형 정온계수 전기 장치 및 그 제조 방법
KR100495133B1 (ko) * 2002-11-28 2005-06-14 엘에스전선 주식회사 피티씨 서미스터
WO2004084270A2 (en) * 2003-03-14 2004-09-30 Bourns, Inc. Multi-layer polymeric electronic device and method of manufacturing same
JP4135651B2 (ja) * 2003-03-26 2008-08-20 株式会社村田製作所 積層型正特性サーミスタ
TWI265534B (en) * 2003-12-31 2006-11-01 Polytronics Technology Corp Over-current protection apparatus
TWM254809U (en) * 2004-03-09 2005-01-01 Protectronics Technology Corp Multi-layer over-current protector
US20050225423A1 (en) * 2004-04-12 2005-10-13 Wei Hsu Fast-test printed resistor device with test auxiliary lines
US20060132277A1 (en) * 2004-12-22 2006-06-22 Tyco Electronics Corporation Electrical devices and process for making such devices
US20060202794A1 (en) * 2005-03-10 2006-09-14 Chang-Wei Ho Resettable over-current protection device and method for producing the same
US8183504B2 (en) * 2005-03-28 2012-05-22 Tyco Electronics Corporation Surface mount multi-layer electrical circuit protection device with active element between PPTC layers
FR2885131B1 (fr) * 2005-04-27 2008-03-07 Arkema Sa Structure cellulaire a base de polymere comprenant des nanotubes de carbone, son procede de preparation et ses applications
EP1790916B1 (de) * 2005-11-23 2014-05-21 Eberspächer catem GmbH & Co. KG Elektrische Heizvorrichtung mit Toleranz-PTC-Heizelement
USRE44224E1 (en) * 2005-12-27 2013-05-21 Polytronics Technology Corp. Surface-mounted over-current protection device
US8044763B2 (en) * 2005-12-27 2011-10-25 Polytronics Technology Corp. Surface-mounted over-current protection device
TWI490891B (zh) * 2011-05-03 2015-07-01 Polytronics Technology Corp 過電流與過溫度保護元件
WO2012173183A1 (ja) * 2011-06-17 2012-12-20 タイコエレクトロニクスジャパン合同会社 Ｐｔｃデバイス
KR20140062470A (ko) * 2011-07-29 2014-05-23 타이코 일렉트로닉스 저팬 지.케이. Ptc 디바이스
JP6124793B2 (ja) * 2011-09-15 2017-05-10 Ｌｉｔｔｅｌｆｕｓｅジャパン合同会社 Ｐｔｃデバイス
US8957531B2 (en) 2011-10-20 2015-02-17 International Business Machines Corporation Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
TWI562718B (en) * 2012-06-05 2016-12-11 Ind Tech Res Inst Emi shielding device and manufacturing method thereof
TWI453923B (zh) * 2012-06-22 2014-09-21 Txc Corp Light sensing chip package structure
JP2016515305A (ja) * 2013-03-11 2016-05-26 ボーンズ、インコーポレイテッド ラミネートポリマーを使用するプレーナ磁気技術に関する装置および方法
TWI464756B (zh) * 2013-05-31 2014-12-11 Polytronics Technology Corp 可抑制突波之過電流保護元件
US20140353230A1 (en) * 2013-06-03 2014-12-04 Mann+Hummel Gmbh Filter with heating medium and filter element of a filter
US20150235744A1 (en) * 2014-02-20 2015-08-20 Fuzetec Technology Co., Ltd. Pptc over-current protection device
CN104658926B (zh) * 2015-03-11 2017-07-28 禾邦电子（中国）有限公司 元件绝氧密封方法及其制成的元件
US9959958B1 (en) * 2017-08-01 2018-05-01 Fuzetec Technology Co., Ltd. PTC circuit protection device and method of making the same
CN109427452B (zh) * 2017-08-21 2021-01-29 富致科技股份有限公司 正温度系数电路保护装置及其制法
TWI814547B (zh) * 2022-08-24 2023-09-01 聚鼎科技股份有限公司 電路保護元件

Family Cites Families (129)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482316A (en) 1945-05-26 1949-09-20 Amalgamated Wireless Australas Lamella resistance unit
US3221145A (en) 1963-09-06 1965-11-30 Armstrong Cork Co Laminated heating sheet
US3351882A (en) 1964-10-09 1967-11-07 Polyelectric Corp Plastic resistance elements and methods for making same
US3435399A (en) 1966-04-19 1969-03-25 Gen Electric Thermistor device and method of producing said device
US3497859A (en) 1968-05-28 1970-02-24 Stackpole Carbon Co Electrical resistors for printed circuits
US3775725A (en) 1970-04-30 1973-11-27 Hokuriku Elect Ind Printed resistor
US3648364A (en) 1970-04-30 1972-03-14 Hokuriku Elect Ind Method of making a printed resistor
GB1415454A (en) 1973-05-04 1975-11-26 Welwyn Electric Ltd Mounting means of electrical components
US3835434A (en) 1973-06-04 1974-09-10 Sprague Electric Co Ptc resistor package
US4330703A (en) 1975-08-04 1982-05-18 Raychem Corporation Layered self-regulating heating article
JPS5441102B2 (de) 1975-03-04 1979-12-06
US4560498A (en) 1975-08-04 1985-12-24 Raychem Corporation Positive temperature coefficient of resistance compositions
US4534889A (en) 1976-10-15 1985-08-13 Raychem Corporation PTC Compositions and devices comprising them
US4388607A (en) 1976-12-16 1983-06-14 Raychem Corporation Conductive polymer compositions, and to devices comprising such compositions
US4200970A (en) 1977-04-14 1980-05-06 Milton Schonberger Method of adjusting resistance of a thermistor
DE2816593A1 (de) 1978-04-17 1979-10-18 Siemens Ag Elektrisches widerstandsbauelement, das aus einem hohlzylinderfoermigen keramischen kaltleiterkoerper besteht
US4304987A (en) 1978-09-18 1981-12-08 Raychem Corporation Electrical devices comprising conductive polymer compositions
US4238812A (en) 1978-12-01 1980-12-09 Raychem Corporation Circuit protection devices comprising PTC elements
US4237441A (en) 1978-12-01 1980-12-02 Raychem Corporation Low resistivity PTC compositions
US4315237A (en) 1978-12-01 1982-02-09 Raychem Corporation PTC Devices comprising oxygen barrier layers
US4255698A (en) 1979-01-26 1981-03-10 Raychem Corporation Protection of batteries
US4327351A (en) 1979-05-21 1982-04-27 Raychem Corporation Laminates comprising an electrode and a conductive polymer layer
US4272471A (en) 1979-05-21 1981-06-09 Raychem Corporation Method for forming laminates comprising an electrode and a conductive polymer layer
US4445026A (en) 1979-05-21 1984-04-24 Raychem Corporation Electrical devices comprising PTC conductive polymer elements
US4371860A (en) 1979-06-18 1983-02-01 General Electric Company Solderable varistor
US5049850A (en) 1980-04-21 1991-09-17 Raychem Corporation Electrically conductive device having improved properties under electrical stress
US4317027A (en) 1980-04-21 1982-02-23 Raychem Corporation Circuit protection devices
US4545926A (en) 1980-04-21 1985-10-08 Raychem Corporation Conductive polymer compositions and devices
US4475138A (en) 1980-04-21 1984-10-02 Raychem Corporation Circuit protection devices comprising PTC element
US4352083A (en) 1980-04-21 1982-09-28 Raychem Corporation Circuit protection devices
US4591700A (en) 1980-05-19 1986-05-27 Raychem Corporation PTC compositions
US4845838A (en) 1981-04-02 1989-07-11 Raychem Corporation Method of making a PTC conductive polymer electrical device
US4426633A (en) 1981-04-15 1984-01-17 Raychem Corporation Devices containing PTC conductive polymer compositions
DE3122612A1 (de) 1981-06-06 1982-12-23 Draloric Electronic GmbH, 8672 Selb "verfahren zur herstellung von chipwiderstaenden"
US4935156A (en) 1981-09-09 1990-06-19 Raychem Corporation Conductive polymer compositions
DE3204207C2 (de) 1982-02-08 1985-05-23 Siemens AG, 1000 Berlin und 8000 München Elektrischer Widerstand mit einem keramischen PTC-Körper und Verfahren zu seiner Herstellung
US4486738A (en) 1982-02-16 1984-12-04 General Electric Ceramics, Inc. High reliability electrical components
EP0092428B1 (de) 1982-04-20 1990-04-04 Fujitsu Limited Herstellungsverfahrenfür einen Piezoelektrischen Resonator
US4463407A (en) 1982-09-27 1984-07-31 Northern Telecom Limited Surface mounted electronic components having pre-applied solder
JPS59185801U (ja) 1983-05-26 1984-12-10 アルプス電気株式会社 チツプ抵抗
US4434416A (en) 1983-06-22 1984-02-28 Milton Schonberger Thermistors, and a method of their fabrication
US4514620A (en) 1983-09-22 1985-04-30 Raychem Corporation Conductive polymers exhibiting PTC characteristics
US4593181A (en) 1984-02-06 1986-06-03 Raychem Corporation Heating element having deformed buss bars
US4780598A (en) 1984-07-10 1988-10-25 Raychem Corporation Composite circuit protection devices
JPH0316251Y2 (de) 1985-03-04 1991-04-08
US4724417A (en) 1985-03-14 1988-02-09 Raychem Corporation Electrical devices comprising cross-linked conductive polymers
US4774024A (en) 1985-03-14 1988-09-27 Raychem Corporation Conductive polymer compositions
US4605471A (en) 1985-06-27 1986-08-12 Ncr Corporation Method of manufacturing printed circuit boards
US4689475A (en) 1985-10-15 1987-08-25 Raychem Corporation Electrical devices containing conductive polymers
US4861966A (en) 1985-10-15 1989-08-29 Raychem Corporation Method and apparatus for electrically heating diesel fuel utilizing a PTC polymer heating element
US4757298A (en) 1986-01-29 1988-07-12 Alps Electric Co., Ltd. Ceramic substrates for tip electronic parts
GB8604519D0 (en) 1986-02-24 1986-04-03 Raychem Sa Nv Electrical devices
JPH0690962B2 (ja) 1986-03-31 1994-11-14 日本メクトロン株式会社 Ｐｔｃ素子の製造法
EP0243602B1 (de) 1986-04-23 1989-12-20 Siemens Aktiengesellschaft Elektrisches Bauelement mit hoher Festigkeit bei Beanspruchung durch Temperaturwechsel und durch Stossströme, insbesondere ein Varistor
US4777718A (en) 1986-06-30 1988-10-18 Motorola, Inc. Method of forming and connecting a resistive layer on a pc board
US4786888A (en) 1986-09-20 1988-11-22 Murata Manufacturing Co., Ltd. Thermistor and method of producing the same
US4706060A (en) 1986-09-26 1987-11-10 General Electric Company Surface mount varistor
JPS6420601A (en) 1987-07-16 1989-01-24 Jgc Corp Composit chip varister
FR2620561B1 (fr) 1987-09-15 1992-04-24 Europ Composants Electron Thermistance ctp pour le montage en surface
US4907340A (en) 1987-09-30 1990-03-13 Raychem Corporation Electrical device comprising conductive polymers
US4924074A (en) 1987-09-30 1990-05-08 Raychem Corporation Electrical device comprising conductive polymers
US5166658A (en) 1987-09-30 1992-11-24 Raychem Corporation Electrical device comprising conductive polymers
US5097492A (en) 1987-10-30 1992-03-17 Four Pi Systems Corporation Automated laminography system for inspection of electronics
JPH01143203A (ja) 1987-11-27 1989-06-05 Murata Mfg Co Ltd 有機正特性サーミスタ
DE8716103U1 (de) 1987-12-05 1988-01-21 Degussa Ag, 6000 Frankfurt, De
US4788523A (en) 1987-12-10 1988-11-29 United States Of America Viad chip resistor
NL8800156A (nl) 1988-01-25 1989-08-16 Philips Nv Chipweerstand en werkwijze voor het vervaardigen van een chipweerstand.
KR900700292A (ko) 1988-02-05 1990-08-13 원본미기재 적층 중합체 시트
EP0327860A1 (de) 1988-02-10 1989-08-16 Siemens Aktiengesellschaft Elektrisches Bauelement in Chip-Bauweise und Verfahren zu seiner Herstellung
US4811164A (en) 1988-03-28 1989-03-07 American Telephone And Telegraph Company, At&T Bell Laboratories Monolithic capacitor-varistor
NL8800853A (nl) 1988-04-05 1989-11-01 Philips Nv Chipweerstand en werkwijze voor het vervaardigen van een chipweerstand.
JPH0616442B2 (ja) 1988-04-06 1994-03-02 株式会社村田製作所 有機正特性サーミスタ
US4882466A (en) 1988-05-03 1989-11-21 Raychem Corporation Electrical devices comprising conductive polymers
US4873508A (en) 1988-06-06 1989-10-10 Therm-O-Disc, Incorporated Variable resistance thermal protector and method of making same
US4967176A (en) * 1988-07-15 1990-10-30 Raychem Corporation Assemblies of PTC circuit protection devices
US5057811A (en) 1988-12-22 1991-10-15 Texas Instruments Incorporated Electrothermal sensor
JPH02181475A (ja) 1989-01-06 1990-07-16 Mitsubishi Electric Corp 太陽電池セル及びその製造方法
US4937551A (en) 1989-02-02 1990-06-26 Therm-O-Disc, Incorporated PTC thermal protector device
US5015824A (en) 1989-02-06 1991-05-14 Thermacon, Inc. Apparatus for heating a mirror or the like
US4904850A (en) 1989-03-17 1990-02-27 Raychem Corporation Laminar electrical heaters
AU637370B2 (en) 1989-05-18 1993-05-27 Fujikura Ltd. Ptc thermistor and manufacturing method for the same
US4993142A (en) 1989-06-19 1991-02-19 Dale Electronics, Inc. Method of making a thermistor
JPH0774328B2 (ja) 1989-09-05 1995-08-09 千住金属工業株式会社 電子部品の仮固定用粘着剤
US5247277A (en) 1990-02-14 1993-09-21 Raychem Corporation Electrical devices
KR970006424B1 (ko) 1990-02-22 1997-04-28 가부시키가이샤 무라타세이사큐쇼 정특성더미스터와 그 제조방법
AU627663B2 (en) 1990-07-25 1992-08-27 Matsushita Electric Industrial Co., Ltd. Sic thin-film thermistor
US5089801A (en) 1990-09-28 1992-02-18 Raychem Corporation Self-regulating ptc devices having shaped laminar conductive terminals
US5382938A (en) 1990-10-30 1995-01-17 Asea Brown Boveri Ab PTC element
JPH04167501A (ja) 1990-10-31 1992-06-15 Daito Tsushinki Kk Ｐｔｃ素子
US5142263A (en) 1991-02-13 1992-08-25 Electromer Corporation Surface mount device with overvoltage protection feature
EP0509582B1 (de) 1991-04-16 1996-09-04 Koninklijke Philips Electronics N.V. SMD-Widerstand
US5196136A (en) 1991-06-20 1993-03-23 E. I. Du Pont De Nemours And Company Cleaning composition of hydrocarbon component, surfactant and multibasic ester additive
JPH0521207A (ja) 1991-07-12 1993-01-29 Daito Tsushinki Kk Ｐｔｃ素子
DE4126913A1 (de) 1991-08-14 1993-02-18 Siemens Ag Verfahren zum beloten und montieren von leiterplatten mit bauelementen
US5303115A (en) 1992-01-27 1994-04-12 Raychem Corporation PTC circuit protection device comprising mechanical stress riser
US5166656A (en) 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
US5378407A (en) 1992-06-05 1995-01-03 Raychem Corporation Conductive polymer composition
KR100275161B1 (ko) 1992-07-09 2000-12-15 허버트 지. 버카드 전기 장치
US5852397A (en) * 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
US5488348A (en) 1993-03-09 1996-01-30 Murata Manufacturing Co., Ltd. PTC thermistor
US5347258A (en) 1993-04-07 1994-09-13 Zycon Corporation Annular resistor coupled with printed circuit board through-hole
JPH06302404A (ja) * 1993-04-16 1994-10-28 Murata Mfg Co Ltd 積層型正特性サ−ミスタ
US5451919A (en) 1993-06-29 1995-09-19 Raychem Corporation Electrical device comprising a conductive polymer composition
US5451921A (en) 1993-10-04 1995-09-19 Raychem Corporation Electrical devices
US5907273A (en) 1993-11-24 1999-05-25 Rochester Gauges, Inc. Linear positioning indicator
CN1030873C (zh) * 1993-12-04 1996-01-31 清华大学 一种制备多层叠片热敏电阻器的方法
US5847436A (en) * 1994-03-18 1998-12-08 Kabushiki Kaisha Tokai Rika Denki Seisakusho Bipolar transistor having integrated thermistor shunt
EP0853323A3 (de) * 1994-05-16 1998-09-02 Raychem Corporation Elektrisches Gerät mit einem PTC-Widerstandelement
US5582770A (en) 1994-06-08 1996-12-10 Raychem Corporation Conductive polymer composition
EP0952590B1 (de) * 1994-06-08 2004-09-22 Tyco Electronics Corporation Elektrische Vorrichtungen enthaltend leitfähige Polymere
JPH10501373A (ja) 1994-06-09 1998-02-03 レイケム・コーポレイション 電気デバイス
EP0815569B1 (de) 1995-03-22 2004-10-27 Tyco Electronics Corporation Leitfähige polymerzusammensetzung und vorrichtung
WO1996029711A1 (en) 1995-03-22 1996-09-26 Raychem Corporation Electrical device
DE69636245T2 (de) 1995-08-07 2007-04-12 Bc Components Holdings B.V. Mehrelement-ptc-widerstand
US5801612A (en) 1995-08-24 1998-09-01 Raychem Corporation Electrical device
JPH09162004A (ja) * 1995-12-13 1997-06-20 Murata Mfg Co Ltd 正特性サーミスタ素子
US5907272A (en) * 1996-01-22 1999-05-25 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element and a fusible link
JPH09219302A (ja) 1996-02-13 1997-08-19 Daito Tsushinki Kk Ｐｔｃ素子
JP3284873B2 (ja) * 1996-03-27 2002-05-20 三菱マテリアル株式会社 チップ型サーミスタの製造方法
JPH09266103A (ja) * 1996-03-28 1997-10-07 Mitsubishi Materials Corp チップ型サーミスタ及びその製造方法
WO1998029879A1 (fr) * 1996-12-26 1998-07-09 Matsushita Electric Industrial Co., Ltd. Thermistance ctp et son procede de fabrication
US5818676A (en) 1997-05-16 1998-10-06 Yazaki Corporation Multiple element PTC overcurrent protection device
US6104587A (en) 1997-07-25 2000-08-15 Banich; Ann Electrical device comprising a conductive polymer
US6020808A (en) * 1997-09-03 2000-02-01 Bourns Multifuse (Hong Kong) Ltd. Multilayer conductive polymer positive temperature coefficent device
US6242997B1 (en) * 1998-03-05 2001-06-05 Bourns, Inc. Conductive polymer device and method of manufacturing same
US6172591B1 (en) * 1998-03-05 2001-01-09 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
US6606023B2 (en) * 1998-04-14 2003-08-12 Tyco Electronics Corporation Electrical devices
US6429533B1 (en) * 1999-11-23 2002-08-06 Bourns Inc. Conductive polymer device and method of manufacturing same
TW507220B (en) * 2001-03-13 2002-10-21 Protectronics Technology Corp Surface mountable polymeric circuit protection device and its manufacturing process

Also Published As

Publication number Publication date
US7343671B2 (en) 2008-03-18
DE60038030T2 (de) 2009-02-05
WO2001020619A2 (en) 2001-03-22
JP2012099845A (ja) 2012-05-24
EP1212759A2 (de) 2002-06-12
CN101521066A (zh) 2009-09-02
TW523899B (en) 2003-03-11
CN101521066B (zh) 2012-06-27
JP2003515245A (ja) 2003-04-22
ATE386330T1 (de) 2008-03-15
WO2001020619A3 (en) 2001-12-06
US6640420B1 (en) 2003-11-04
US20040090304A1 (en) 2004-05-13
JP5210480B2 (ja) 2013-06-12
CN1379905A (zh) 2002-11-13
EP1212759B1 (de) 2008-02-13
CN100492554C (zh) 2009-05-27

Similar Documents

Publication Publication Date Title
DE60038030D1 (de) Elektrische vorrichtungen und herstellungsverfahren
EP0961533A3 (de) Leiterplatte und Verfahren zu deren Herstellung
TW337035B (en) Semiconductor device and method of manufacturing the same
WO2005017967A3 (en) Nanotube device structure and methods of fabrication
WO2005124787A3 (en) Electrical device having a programmable resistor connected in series to a punch-through diode and method of manufacturing therefor
WO2003030602A1 (fr) Plaque d'enroulement de circuit multicouche, boitier ci et procede de production de la plaque d'enroulement de circuit multicouche
WO2002019430A3 (en) Hybrid substrate with embedded capacitors and methods of manufacture
WO2005125298A3 (en) Method for manufacturing an electronics module comprising a component electrically connected to a conductor- pattern layer
TR200000511T2 (tr) Elektrikli cihazlar ve bunları imal etmek için bir yöntem.
SG130055A1 (en) Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
EP1170795A3 (de) Elektronikkomponente mit Seitenkontakten und ihre Herstellung
WO2006056643A3 (en) Method for manufacturing an electronics module
EP2079292A3 (de) Herstellungsverfahren eines mehrschichtigen Substrats und durch dieses Herstellungsverfahren hergestelltes mehrschichtiges Substrat
TW359862B (en) PTC conductive polymer protection device for surface mounting on a printed circuit board
DE60219815D1 (de) Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren
ATE287198T1 (de) Leiterplattenanordnung und verfahren zu ihrer herstellung
EP1270694A4 (de) Poröse klebefolie, halbleiterwafer mit poröser klebefolie sowie verfahren zu dessen herstellung
TW200512778A (en) Circuit device and fabricating method of the same
DE60321040D1 (de) Bauelement aus leitendem polymer und verfahren zu seiner herstellung
TW200715930A (en) Method for manufacturing a substrate embedded with an electronic component and device from the same
TW200503230A (en) Post cmp porogen burn out process
WO2002029890A3 (en) Semiconductor stacked die devices and methods of forming semiconductor stacked die devices
EP1603158A4 (de) Leiterplatte, verfahren zu ihrer herstellung, anschlusskammkapselung und optisches modul
TW369711B (en) Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame
WO2002054839A3 (en) Layered circuit boards and methods of production thereof

Legal Events

Date Code Title Description
8364 No opposition during term of opposition