ES2118316T3 - Separacion electrolitica del paladio o de aleaciones de paladio. - Google Patents

Separacion electrolitica del paladio o de aleaciones de paladio.

Info

Publication number
ES2118316T3
ES2118316T3 ES94250090T ES94250090T ES2118316T3 ES 2118316 T3 ES2118316 T3 ES 2118316T3 ES 94250090 T ES94250090 T ES 94250090T ES 94250090 T ES94250090 T ES 94250090T ES 2118316 T3 ES2118316 T3 ES 2118316T3
Authority
ES
Spain
Prior art keywords
paladium
palladium
alloys
biquinolyl
electrolytic separation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94250090T
Other languages
English (en)
Inventor
Rudolf Klein
Robert Dr Ruther
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2118316T3 publication Critical patent/ES2118316T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)

Abstract

LA INVENCION SE REFIERE A UNA SOLUCION PARA SEPARACION ELECTROLITICA DE PALADIO O ALEACIONES DE PALADIO, QUE CONTIENE PREFERENTEMENTE SULFATO DE PALADIO Y/O SULFAMATO DE PALADIO Y AL MENOS UN FORMADOR COMPLEJO PARA IONES DE PALADIO, ASI COMO ADICIONALMENTE AL MENOS UN COMPUESTO HETEROCICLICO. COMO COMPUESTOS HETEROCICLICOS PUEDEN SER UTILIZADOS EL 2,3 IL) TROLINA Y/O 4,4'' SE REFIERE ADEMAS A UN PROCESO PARA EL RECUBRIMIENTO ELECTROLITICO DE SUPERFICIES DE SUBSTRATO CON CAPACIDAD DE CONDUCCION ELECTRICA CON SOLUCIONES DE ESTE TIPO.
ES94250090T 1993-04-07 1994-04-07 Separacion electrolitica del paladio o de aleaciones de paladio. Expired - Lifetime ES2118316T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4311983 1993-04-07

Publications (1)

Publication Number Publication Date
ES2118316T3 true ES2118316T3 (es) 1998-09-16

Family

ID=6485332

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94250090T Expired - Lifetime ES2118316T3 (es) 1993-04-07 1994-04-07 Separacion electrolitica del paladio o de aleaciones de paladio.

Country Status (4)

Country Link
EP (1) EP0619386B1 (es)
AT (1) ATE167531T1 (es)
DE (2) DE59406250D1 (es)
ES (1) ES2118316T3 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004040787A1 (de) * 2004-08-23 2006-03-02 Heinzl, Joachim, Prof. Dr.-Ing. Verfahren zur Steigerung der Dauerfestigkeit von Legierungen
US20110147225A1 (en) 2007-07-20 2011-06-23 Rohm And Haas Electronic Materials Llc High speed method for plating palladium and palladium alloys
CN103249256A (zh) * 2012-02-14 2013-08-14 景硕科技股份有限公司 线路图案的表面处理结构
US9364822B2 (en) 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
IT202000000391A1 (it) * 2020-01-13 2021-07-13 Italfimet Srl Procedimento galvanico, e relativo bagno, di elettrodeposizione di palladio ad alta resistenza alla corrosione.
AT523922B1 (de) 2020-09-08 2022-01-15 Iwg Ing W Garhoefer Ges M B H Elektrolytbad für Palladium-Ruthenium-Beschichtungen

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU572539A1 (ru) * 1976-04-29 1977-09-15 Минский радиотехнический институт Электролит дл осаждени паллади
US4406755A (en) * 1982-03-08 1983-09-27 Technic Inc. Bright palladium electrodeposition
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
DE3609309A1 (de) * 1986-03-20 1987-09-24 Duerrwaechter E Dr Doduco Bad zum elektrolytischen abscheiden von silber-palladium-legierungen

Also Published As

Publication number Publication date
EP0619386A1 (de) 1994-10-12
DE59406250D1 (de) 1998-07-23
DE4412253C2 (de) 1996-05-15
ATE167531T1 (de) 1998-07-15
DE4412253A1 (de) 1994-10-13
EP0619386B1 (de) 1998-06-17

Similar Documents

Publication Publication Date Title
DE69728812T2 (de) Verfahren zur Erhöhung der Lötbarkeit einer Oberfläche
US4673472A (en) Method and electroplating solution for deposition of palladium or alloys thereof
US10883027B2 (en) Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite
ES2118316T3 (es) Separacion electrolitica del paladio o de aleaciones de paladio.
DE60220723T2 (de) Verfahren zum aussenstromlosen abscheiden von silber
KR910006008A (ko) 금속화된 폴리이미드 복합체의 제조방법
US5015538A (en) Process for pulse electroplating electroactive polymers and articles derived therefrom
AU571392B2 (en) Aqueous flux for hot dip metallizing process
US20040007472A1 (en) Lead-free chemical nickel alloy
Capelato et al. Complexing power of alkanesulfonate ions: the lead-methanesulfonate system
DE10226328B3 (de) Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen
US4316779A (en) Process for electroplating palladium on articles comprising copper
JP3677617B2 (ja) 無電解金めっき液
ES2046055T3 (es) Solucion caustica.
US4299670A (en) Palladium plating procedure and bath
KR890016216A (ko) 안정한 합금 조성물을 갖는 전기도금된 합금 피복물 및 그의 도금방법
US5032467A (en) Process for electroplating electroactive polymers and articles derived therefrom
Nobel et al. Cyanide-free plating solutions for monovalent metals
JPH0465914B2 (es)
Abys Palladium plating
DE4211152C1 (de) Verfahren zur Metallisierung von Nichtleitern und Anwendung des Verfahrens
KR850000807B1 (ko) 무전해 주석 도금액조성물
JPH05311491A (ja) 金めっき材封孔処理法
Foust et al. Method for Preparing Metallized Polyimide Composites
Fujimura Suggestions for tin and tin-lead plating process

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 619386

Country of ref document: ES