ES2104183T3 - Procedimiento para fabricar peliculas finas por evaporacion por laser excimero pulsatorio. - Google Patents

Procedimiento para fabricar peliculas finas por evaporacion por laser excimero pulsatorio.

Info

Publication number
ES2104183T3
ES2104183T3 ES93923279T ES93923279T ES2104183T3 ES 2104183 T3 ES2104183 T3 ES 2104183T3 ES 93923279 T ES93923279 T ES 93923279T ES 93923279 T ES93923279 T ES 93923279T ES 2104183 T3 ES2104183 T3 ES 2104183T3
Authority
ES
Spain
Prior art keywords
laser
pulsatorio
excimero
evaporation
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93923279T
Other languages
English (en)
Inventor
Kenneth Bernard Keating
Stephens Sintsun The
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of ES2104183T3 publication Critical patent/ES2104183T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/087—Oxides of copper or solid solutions thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0521—Processes for depositing or forming copper oxide superconductor layers by pulsed laser deposition, e.g. laser sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/725—Process of making or treating high tc, above 30 k, superconducting shaped material, article, or device
    • Y10S505/73—Vacuum treating or coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/725—Process of making or treating high tc, above 30 k, superconducting shaped material, article, or device
    • Y10S505/73—Vacuum treating or coating
    • Y10S505/732—Evaporative coating with superconducting material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Recrystallisation Techniques (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)

Abstract

SE PRESENTA UN PROCESO PARA LA PRODUCCION DE PELICULAS DELGADAS DE UN MATERIAL SUPERCONDUCTOR QUE CONSISTE EN BOMBARDEAR UN OBJETIVO CALENTADO CON UNA RADIACION PROCEDENTE DE UN LASER DE UV DE ALTA ENERGIA PULSADO PARA FORMAR UNA PLUMA DE MATERIAL OBJETIVO Y DEPOSITAR LA PLUMA SOBRE UN SUSTRATO.
ES93923279T 1992-10-19 1993-10-13 Procedimiento para fabricar peliculas finas por evaporacion por laser excimero pulsatorio. Expired - Lifetime ES2104183T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/963,156 US5290761A (en) 1992-10-19 1992-10-19 Process for making oxide superconducting films by pulsed excimer laser ablation

Publications (1)

Publication Number Publication Date
ES2104183T3 true ES2104183T3 (es) 1997-10-01

Family

ID=25506821

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93923279T Expired - Lifetime ES2104183T3 (es) 1992-10-19 1993-10-13 Procedimiento para fabricar peliculas finas por evaporacion por laser excimero pulsatorio.

Country Status (12)

Country Link
US (1) US5290761A (es)
EP (1) EP0664927B1 (es)
JP (1) JPH08502626A (es)
KR (1) KR950703799A (es)
AT (1) ATE155613T1 (es)
CA (1) CA2146629A1 (es)
DE (1) DE69312307T2 (es)
DK (1) DK0664927T3 (es)
ES (1) ES2104183T3 (es)
GR (1) GR3024785T3 (es)
TW (1) TW232098B (es)
WO (1) WO1994009518A1 (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5660746A (en) * 1994-10-24 1997-08-26 University Of South Florida Dual-laser process for film deposition
US5535128A (en) * 1995-02-09 1996-07-09 The United States Of America As Represented By The Secretary Of The Air Force Hierarchical feedback control of pulsed laser deposition
US6716795B2 (en) * 1999-09-27 2004-04-06 Ut-Battelle, Llc Buffer architecture for biaxially textured structures and method of fabricating same
US5741377A (en) * 1995-04-10 1998-04-21 Martin Marietta Energy Systems, Inc. Structures having enhanced biaxial texture and method of fabricating same
US5711810A (en) * 1996-12-04 1998-01-27 The United States Of America As Represented By The Secretary Of The Army Apparatus for variable optical focusing for processing chambers
US5964966A (en) * 1997-09-19 1999-10-12 Lockheed Martin Energy Research Corporation Method of forming biaxially textured alloy substrates and devices thereon
US6027564A (en) * 1997-09-23 2000-02-22 American Superconductor Corporation Low vacuum vapor process for producing epitaxial layers
US6022832A (en) 1997-09-23 2000-02-08 American Superconductor Corporation Low vacuum vapor process for producing superconductor articles with epitaxial layers
US6458223B1 (en) 1997-10-01 2002-10-01 American Superconductor Corporation Alloy materials
US6428635B1 (en) 1997-10-01 2002-08-06 American Superconductor Corporation Substrates for superconductors
US6137110A (en) * 1998-08-17 2000-10-24 The United States Of America As Represented By The United States Department Of Energy Focused ion beam source method and apparatus
US6114287A (en) * 1998-09-30 2000-09-05 Ut-Battelle, Llc Method of deforming a biaxially textured buffer layer on a textured metallic substrate and articles therefrom
US6296701B1 (en) 1998-09-30 2001-10-02 Ut-Battelle, Llc Method of depositing an electrically conductive oxide film on a textured metallic substrate and articles formed therefrom
US6143366A (en) * 1998-12-24 2000-11-07 Lu; Chung Hsin High-pressure process for crystallization of ceramic films at low temperatures
US6475311B1 (en) 1999-03-31 2002-11-05 American Superconductor Corporation Alloy materials
KR100450749B1 (ko) * 2001-12-28 2004-10-01 한국전자통신연구원 어븀이 도핑된 실리콘 나노 점 어레이 제조 방법 및 이에이용되는 레이저 기화 증착 장비
US6858841B2 (en) * 2002-02-22 2005-02-22 Agilent Technologies, Inc. Target support and method for ion production enhancement
US6825462B2 (en) * 2002-02-22 2004-11-30 Agilent Technologies, Inc. Apparatus and method for ion production enhancement
JP2007063631A (ja) * 2005-08-31 2007-03-15 Dowa Holdings Co Ltd レーザーアブレージョン用ターゲットおよびその製造方法
JP6043487B2 (ja) * 2012-01-31 2016-12-14 株式会社フジクラ 超電導薄膜作製用ターゲットの製造方法と酸化物超電導線材の製造方法
JP6326379B2 (ja) 2012-03-08 2018-05-16 ディー−ウェイブ システムズ，インコーポレイテッド 超伝導集積回路の製作のためのシステムおよび方法
EP3577700B1 (en) 2017-02-01 2022-03-30 D-Wave Systems Inc. Systems and methods for fabrication of superconducting integrated circuits
EP3540090A1 (en) 2018-03-12 2019-09-18 Solmates B.V. Method for pulsed laser deposition
US20200152851A1 (en) 2018-11-13 2020-05-14 D-Wave Systems Inc. Systems and methods for fabricating superconducting integrated circuits
WO2020168097A1 (en) 2019-02-15 2020-08-20 D-Wave Systems Inc. Kinetic inductance for couplers and compact qubits
CN115004393B (zh) 2019-12-05 2025-11-04 D-波系统公司 用于制造超导集成电路的系统和方法
WO2021231224A1 (en) 2020-05-11 2021-11-18 D-Wave Systems Inc. Kinetic inductance devices, methods for fabricating kinetic inductance devices, and articles employing the same
WO2021262741A1 (en) * 2020-06-23 2021-12-30 D-Wave Systems Inc. Methods for fabricating superconducting integrated circuits
US12392823B2 (en) 2021-11-05 2025-08-19 D-Wave Systems Inc. Systems and methods for on-chip noise measurements

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5017554A (en) * 1988-08-24 1991-05-21 E. I. Du Pont De Nemours And Company Superconducting metal oxide Tl-Pb-Ca-Sr-Cu-O compositions and processes for manufacture and use
US5019552A (en) * 1990-02-20 1991-05-28 The United States Of America As Represented By The United States Department Of Energy Long-laser-pulse method of producing thin films
JPH0532493A (ja) * 1991-07-29 1993-02-09 Sumitomo Electric Ind Ltd 複合酸化物超電導薄膜の成膜方法

Also Published As

Publication number Publication date
JPH08502626A (ja) 1996-03-19
DK0664927T3 (da) 1997-09-01
EP0664927A1 (en) 1995-08-02
TW232098B (es) 1994-10-11
CA2146629A1 (en) 1994-04-28
KR950703799A (ko) 1995-09-20
ATE155613T1 (de) 1997-08-15
US5290761A (en) 1994-03-01
GR3024785T3 (en) 1998-01-30
DE69312307T2 (de) 1997-12-11
WO1994009518A1 (en) 1994-04-28
DE69312307D1 (de) 1997-08-21
EP0664927B1 (en) 1997-07-16

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