ES2061584T3 - Compuesto de resina curable por radiacion de energia activa, conteniendo un polimero copolimerizado por injerto con una cadena que contiene un grupo diciclopentenilo. - Google Patents

Compuesto de resina curable por radiacion de energia activa, conteniendo un polimero copolimerizado por injerto con una cadena que contiene un grupo diciclopentenilo.

Info

Publication number
ES2061584T3
ES2061584T3 ES88115155T ES88115155T ES2061584T3 ES 2061584 T3 ES2061584 T3 ES 2061584T3 ES 88115155 T ES88115155 T ES 88115155T ES 88115155 T ES88115155 T ES 88115155T ES 2061584 T3 ES2061584 T3 ES 2061584T3
Authority
ES
Spain
Prior art keywords
active energy
energy radiation
diciclopentenyl
composite
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES88115155T
Other languages
English (en)
Inventor
Hiromichi Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of ES2061584T3 publication Critical patent/ES2061584T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F285/00Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

LA COMPOSICION COMPRENDE (I) UN POLIMERO COPOLIMERIZADO POR UN INERTO CON UNA CADENA PRINCIPAL QUE CONTIENE UN GRUPO DERIVADO DE DICICLO PENTENILO CON UN PESO MOLECULAR PROMEDIO EN NUMERO DE 5000 O MAYOR Y UN PESO MOLECULAR PROMEDIO EN PESO DE 50000 O MENOR, (II) UN POLIMERO LINEAL CON UN PMPN DE 5000 O MAYOR Y UN PMPP DE 350000 O MENOR Y CON UNA TEMPERATURA DE TRANSICION VITREA DE 60 (GRADOS) C O MAYOR, (III) UN MONOMERO CON UN ENLACE INSATURADO ETILENICAMENTE, Y (IV) UN INICIADOR DE FOTOPOLIMERIZACION CAPAZ DE GENERARA RADICALES LIBRES CON IRRADIACION DE UNA RADIACION ENERGETICA ACTIVA. LA COMPOSICION PUEDE SER CURADA ADECUADAMENTE CON UNA RADIACION ENERGETICA ACTIVA TAL COMO UV O HAZ DE ELECTRONES Y ES CAPAZ DE SER LAMINADA SEGUN UN DISEÑO DESEADO SOBRE UN LAMINADO RECUBIERTO DE COBRE PARA UTILIZAR COMO TARJETA IMPRESA O SOBRE UNA PLACA DE METAL, VIDRIO, CERAMICA O PLASTICO.
ES88115155T 1987-09-16 1988-09-15 Compuesto de resina curable por radiacion de energia activa, conteniendo un polimero copolimerizado por injerto con una cadena que contiene un grupo diciclopentenilo. Expired - Lifetime ES2061584T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22949287 1987-09-16
JP15907688 1988-06-29

Publications (1)

Publication Number Publication Date
ES2061584T3 true ES2061584T3 (es) 1994-12-16

Family

ID=26485990

Family Applications (1)

Application Number Title Priority Date Filing Date
ES88115155T Expired - Lifetime ES2061584T3 (es) 1987-09-16 1988-09-15 Compuesto de resina curable por radiacion de energia activa, conteniendo un polimero copolimerizado por injerto con una cadena que contiene un grupo diciclopentenilo.

Country Status (5)

Country Link
US (1) US5068263A (es)
EP (1) EP0307920B1 (es)
JP (1) JP2656569B2 (es)
DE (1) DE3887414T2 (es)
ES (1) ES2061584T3 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2573661B2 (ja) * 1988-07-09 1997-01-22 キヤノン株式会社 感光感熱型接着剤
JP2719799B2 (ja) * 1988-10-14 1998-02-25 日本合成化学工業株式会社 感光性樹脂組成物
EP0447588B1 (en) * 1990-03-22 1994-08-31 Canon Kabushiki Kaisha Liquid jet recording head and recording apparatus having same
JPH07170054A (ja) * 1993-12-14 1995-07-04 Canon Inc 紫外線硬化性組成物、これを用いたパターン形成方法及び配線基板の製造方法
JPH08165441A (ja) * 1994-10-13 1996-06-25 Canon Inc 活性エネルギー線重合性組成物、これを含む記録媒体及びこれを用いた画像形成方法
DE60223195T2 (de) * 2001-05-25 2008-08-14 Nippon Paint Co., Ltd. Verfahren zum Beschichten von Kunststofformteilen, ultraviolett härtbare Unterschicht für Metallbedampfung und Kunststofformteile
JP4384570B2 (ja) * 2003-12-01 2009-12-16 東京応化工業株式会社 厚膜用ホトレジスト組成物及びレジストパターンの形成方法
WO2009125806A1 (ja) * 2008-04-10 2009-10-15 リンテック株式会社 エネルギー線硬化性層用樹脂組成物および貫通孔形成用シート
US9453139B2 (en) 2013-08-20 2016-09-27 Rohm And Haas Electronic Materials Llc Hot melt compositions with improved etch resistance
CN115703901B (zh) * 2021-08-10 2024-05-07 中国石油天然气股份有限公司 一种abs树脂加工助剂及其制备方法、abs树脂复合加工助剂
CN115124648A (zh) * 2022-07-05 2022-09-30 中国海洋大学 一种含环氧基和双环戊烯基的丙烯酸树脂及其制备方法与它的用途

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3686673T2 (de) * 1985-06-10 1993-04-15 Canon Kk Strahlenhaertbare harzzusammensetzung.
DE3620254C2 (de) * 1985-06-18 1994-05-05 Canon Kk Durch Strahlen mit wirksamer Energie härtbare Harzmischung
US4688054A (en) * 1985-07-09 1987-08-18 Canon Kabushiki Kaisha Liquid jet recording head
US4688052A (en) * 1985-07-13 1987-08-18 Canon Kabushiki Kaisha Liquid jet recording head having a layer of a resin composition curable with an active energy ray
EP0217137B1 (en) * 1985-08-29 1992-04-08 E.I. Du Pont De Nemours And Company Photopolymerizable composition of acrylic copolymer containing dicyclopentenyl acrylate or methacrylate
JPH0686505B2 (ja) * 1986-03-10 1994-11-02 キヤノン株式会社 活性エネルギ−線硬化型樹脂組成物

Also Published As

Publication number Publication date
EP0307920A3 (en) 1989-06-14
JPH0297516A (ja) 1990-04-10
JP2656569B2 (ja) 1997-09-24
EP0307920B1 (en) 1994-01-26
DE3887414D1 (de) 1994-03-10
US5068263A (en) 1991-11-26
EP0307920A2 (en) 1989-03-22
DE3887414T2 (de) 1994-05-26

Similar Documents

Publication Publication Date Title
ES2061584T3 (es) Compuesto de resina curable por radiacion de energia activa, conteniendo un polimero copolimerizado por injerto con una cadena que contiene un grupo diciclopentenilo.
ES2135899T3 (es) Procedimiento de produccion de un producto fotocromico obtenido por endurecimiento.
ES2040791T3 (es) Compuesto de resina curable mediante radiaciones de energia activa, que contiene resina epoxi y un monomero con un enlace etilenicamente no saturado.
ES2040792T3 (es) Compuesto de resina curable por radiaciones de energia activa, que contiene poliuretano fotopolimerizable.
ES2103246T3 (es) Metodo para generar una especie reactiva y aplicaciones del mismo.
ES2098499T3 (es) Macromoleculas inhibidas en el enmarañamiento.
ES2118914T3 (es) Resinas de moldeo y moldes transparentes a la radiacion uv realizados a partir de las mismas.
ES2040790T3 (es) Compuesto de resina curable mediante radiaciones de energia activa, que contiene una resina epoxi dotada de, como minimo, un compuesto que tiene uno o varios grupos epoxi en la molecula.
ATE527099T1 (de) Photohärtbare zusammensetzungen
ES2128786T3 (es) Polimeros ramificados de cadena larga y su produccion.
ES2050120T3 (es) Aditivos de cemento hidraulico y composiciones de cemento hidraulico que los contienen.
ES2040793T3 (es) Compuesto de resina curable con radiaciones de energia activa conteniendo resina epoxi semiesterificada como componente.
ES8707140A1 (es) Un metodo para conformar articulos polimeros compuestos que tienen segmentos polimeros distintos
ES2031891T3 (es) Adhesivo sensible a la presion reticulado por monomeros de cetona aromatica copolimerizable.
ES2059496T3 (es) Composicion de resina epoxidica curable.
ES2040794T3 (es) Compuesto de resina curable mediante radiaciones de energia activa, que contiene una resina epoxi semi-esterificada y monomero que tiene un enlace etilenicamente insaturado.
ES2090011T3 (es) Modificador resistente al impacto, para plasticos.
ES2137925T3 (es) Polioles modificados con resina epoxidica como dispersantes para polioles de polimeros con alto contenido en solidos y alto contenido en estireno.
IT8123806A0 (it) Procedimento di preparazione di polimeri oppure di copolimeri acrilici idrosolubili di peso molecolare elevato e a basso contenuto in monomero (monomeri)residuo (residui).
GR3021493T3 (en) Process for producing flexible, fibre-based, protective, auxiliary and insulating materials for electrical purposes using impregnating materials curable by high-energy radiation
NO874994L (no) Varmtherdende anhydridmonomer.
GR78977B (es)
JPS53110543A (en) Optical branching and coupling circuit
ES2073436T3 (es) Uso de dispersantes de peso molecular elevado en un procedimiento para preparar polioles-polimeros estables en polioles que tienen pesos moleculares superiores a 4.000.
NZ219854A (en) Liquid thermal or radiation curable polymer containing more than one pendant group having two hydroxy groups, one esterified by an acrylic acid or derivative and the other esterified by maleic acid or a derivative

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 307920

Country of ref document: ES