ES2040791T3 - Compuesto de resina curable mediante radiaciones de energia activa, que contiene resina epoxi y un monomero con un enlace etilenicamente no saturado. - Google Patents

Compuesto de resina curable mediante radiaciones de energia activa, que contiene resina epoxi y un monomero con un enlace etilenicamente no saturado.

Info

Publication number
ES2040791T3
ES2040791T3 ES198888115154T ES88115154T ES2040791T3 ES 2040791 T3 ES2040791 T3 ES 2040791T3 ES 198888115154 T ES198888115154 T ES 198888115154T ES 88115154 T ES88115154 T ES 88115154T ES 2040791 T3 ES2040791 T3 ES 2040791T3
Authority
ES
Spain
Prior art keywords
active energy
energy radiation
molecular weight
average molecular
monomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198888115154T
Other languages
English (en)
Inventor
Hiromichi Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of ES2040791T3 publication Critical patent/ES2040791T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)

Abstract

LA COMPOSICION COMPRENDE (I) UN POLIMERO COPOLIMERIZADO POR INJERTO QUE TIENE UN PESO MOLECULAR PROMEDIO EN NUMERO DE 5000 O MAYOR Y UN PESO MOLECULAR PROMEDIO EN PESO DE 50000 O MENOR (II) UN POLIMERO LINEAL QUE TIENE UN PESO MOLECULAR PROMEDIO EN NUMERO DE 5000 O MAYOR Y UN PESO MOLECULAR PROMEDIO EN PESO DE 350000 O MENOR Y CON UNA TEMPERATURA DE TRANSICION VITREA DE 60 (GRADOS) C O MAYOR (III) UNA RESINA EPOXI QUE CONTIENE, AL MENOS, UN COMPUESTO QUE TIENE UNO O MAS GRUPOS EPOXI EN MASA MOLECULA (IV) UN MONOMERO CON UN ENLACE INSATURADO ETILENICAMENTE Y (V) UN INICIADOR DE LEWIS POR IRRADIACIONM CON RADIACION ENERGETICA ACTIVA. LA COMPOSICION DE RESINA PUEDE SE CURADA CON UNA RADIACION ENERGETICA ACTIVA TAL COMO UV O HAZ DE ELECTRONES Y ES CAPAZ DE SER LAMINADA SEGUN UN DIBUJO DESEADO SOBRE UN LAMINADO RECUBIERTO DE COBRE PARA UTILIZAR COMO TARJETA IMPRESA O SOBRE UNA PLACA DE METYAL, VIDRIO, CERAMICA O PLASTICO.
ES198888115154T 1987-09-16 1988-09-15 Compuesto de resina curable mediante radiaciones de energia activa, que contiene resina epoxi y un monomero con un enlace etilenicamente no saturado. Expired - Lifetime ES2040791T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP22949287 1987-09-16
JP15907788 1988-06-29

Publications (1)

Publication Number Publication Date
ES2040791T3 true ES2040791T3 (es) 1993-11-01

Family

ID=26485991

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198888115154T Expired - Lifetime ES2040791T3 (es) 1987-09-16 1988-09-15 Compuesto de resina curable mediante radiaciones de energia activa, que contiene resina epoxi y un monomero con un enlace etilenicamente no saturado.

Country Status (4)

Country Link
US (1) US5068259A (es)
EP (1) EP0307919B1 (es)
DE (1) DE3881134T2 (es)
ES (1) ES2040791T3 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2573661B2 (ja) * 1988-07-09 1997-01-22 キヤノン株式会社 感光感熱型接着剤
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
US5578417A (en) * 1989-01-10 1996-11-26 Canon Kabushiki Kaisha Liquid jet recording head and recording apparatus having same
DE69011847T2 (de) * 1990-03-22 1995-01-12 Canon Kk Flüssigkeitsstrahlaufzeichnungskopf und Aufzeichnungsgerät, versehen mit diesem Kopf.
AT404300B (de) * 1992-02-20 1998-10-27 Rsf Elektronik Gmbh Drehgeber
JPH07170054A (ja) * 1993-12-14 1995-07-04 Canon Inc 紫外線硬化性組成物、これを用いたパターン形成方法及び配線基板の製造方法
AU684891B2 (en) * 1994-03-17 1998-01-08 Toppan Printing Co. Ltd. Photosensitive recording material, photosensitive recording medium, and process for producing hologram using this photosensitive recording medium
JPH08165441A (ja) * 1994-10-13 1996-06-25 Canon Inc 活性エネルギー線重合性組成物、これを含む記録媒体及びこれを用いた画像形成方法
JP4667145B2 (ja) * 2004-07-22 2011-04-06 三井化学株式会社 光硬化型樹脂組成物及びそれからなるプラスチック用樹脂組成物
GB201517273D0 (en) * 2015-09-30 2015-11-11 Univ Manchester Resist composition

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1194637A (en) * 1982-04-26 1985-10-01 Charles R. Morgan Uv and thermally curable, thermoplastic-containing compositions
DE3688956T2 (de) * 1985-06-26 1994-02-17 Canon Kk Strahlenhärtbare Zusammensetzung.
US4688053A (en) * 1985-07-13 1987-08-18 Canon Kabushiki Kaisha Liquid jet recording head having a layer of a resin composition curable with an active energy ray
US4688056A (en) * 1985-07-13 1987-08-18 Canon Kabushiki Kaisha Liquid jet recording head having a layer of a resin composition curable with an active energy ray

Also Published As

Publication number Publication date
US5068259A (en) 1991-11-26
DE3881134D1 (de) 1993-06-24
EP0307919A3 (en) 1989-06-14
EP0307919A2 (en) 1989-03-22
EP0307919B1 (en) 1993-05-19
DE3881134T2 (de) 1993-09-16

Similar Documents

Publication Publication Date Title
ES2040791T3 (es) Compuesto de resina curable mediante radiaciones de energia activa, que contiene resina epoxi y un monomero con un enlace etilenicamente no saturado.
ES2040790T3 (es) Compuesto de resina curable mediante radiaciones de energia activa, que contiene una resina epoxi dotada de, como minimo, un compuesto que tiene uno o varios grupos epoxi en la molecula.
ES2061584T3 (es) Compuesto de resina curable por radiacion de energia activa, conteniendo un polimero copolimerizado por injerto con una cadena que contiene un grupo diciclopentenilo.
ES2040792T3 (es) Compuesto de resina curable por radiaciones de energia activa, que contiene poliuretano fotopolimerizable.
ES2040793T3 (es) Compuesto de resina curable con radiaciones de energia activa conteniendo resina epoxi semiesterificada como componente.
ES2098499T3 (es) Macromoleculas inhibidas en el enmarañamiento.
ES410715A1 (es) Un procedimiento para la preparacion de un elastomero de copoliester termoplastico segmentado mejorado.
DE3854827T2 (de) Härtbare Zusammensetzungen
ES2114637T3 (es) Copolimeros que contienen grupos hidroxilo, su preparacion y su utilizacion en agentes de revestimiento con alto contenido de cuerpos solidos.
ES2136235T3 (es) Placas de impresion en relieve blandas fotopolimericas para impresion flexografica.
ES2059496T3 (es) Composicion de resina epoxidica curable.
EP0372584A3 (en) Acrylate functional organosiloxane/oxyalkylene copolymers and electrically conductive compositions containing same and a solubilized lithium salt
ES2040794T3 (es) Compuesto de resina curable mediante radiaciones de energia activa, que contiene una resina epoxi semi-esterificada y monomero que tiene un enlace etilenicamente insaturado.
ES2087887T3 (es) Poliesteres acrilatos curables por radiacion.
IL84711A0 (en) Beta-stageable thermosettable compositions,their preparation and their use
KR870000177A (ko) 열저항 구조층의 제조방법
NZ219854A (en) Liquid thermal or radiation curable polymer containing more than one pendant group having two hydroxy groups, one esterified by an acrylic acid or derivative and the other esterified by maleic acid or a derivative
JPS53110543A (en) Optical branching and coupling circuit
ES2073436T3 (es) Uso de dispersantes de peso molecular elevado en un procedimiento para preparar polioles-polimeros estables en polioles que tienen pesos moleculares superiores a 4.000.
ES2057120T3 (es) Polioles polimeros estables con alto contenido de estireno que emplean polioles modificados con resinas epoxidicas como dispersantes.
FR2472768B1 (es)
ES2093483T3 (es) Electrolito polimerico a base de polieter solido.
ES2066246T3 (es) Componente para la absorcion de energias de choque.
Brown et al. Production of neutral weak bosons in high-energy electron and muon experiments
DE3271275D1 (en) Curing compositions

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 307919

Country of ref document: ES