ES2040790T3 - Compuesto de resina curable mediante radiaciones de energia activa, que contiene una resina epoxi dotada de, como minimo, un compuesto que tiene uno o varios grupos epoxi en la molecula. - Google Patents
Compuesto de resina curable mediante radiaciones de energia activa, que contiene una resina epoxi dotada de, como minimo, un compuesto que tiene uno o varios grupos epoxi en la molecula.Info
- Publication number
- ES2040790T3 ES2040790T3 ES198888115153T ES88115153T ES2040790T3 ES 2040790 T3 ES2040790 T3 ES 2040790T3 ES 198888115153 T ES198888115153 T ES 198888115153T ES 88115153 T ES88115153 T ES 88115153T ES 2040790 T3 ES2040790 T3 ES 2040790T3
- Authority
- ES
- Spain
- Prior art keywords
- active energy
- compound
- molecular weight
- average molecular
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
UNA COMPOSICION DE RESINA QUE PARA DE ENERGIA ACTIVA MEJORADA QUE COMPRENDE (I) UN POLIMERO COPOLIMERIZADO DE INJERTO QUE TIENE UN PESO MOLECULAR MEDIO DE NUMERO DE 5,000 O MAS Y UN PESO MOLECULAR MEDIO DE PESO DE 50,000 O MENOS; (II) UN POLIMERO LINEAL QUE TIENE UN PESO MOLECULAR MEDIO DE NUMERO 5,000 O MAS Y UN PESO MOLECULAR MEDIO DE PESO 350,000 O MENOS Y QUE TIENE UNA TEMPERATURA DE TRANSMISION DE CRISTAL DE 60 C O MAS; (III) UNA RESINA EPOXI QUE CONTIENE AL MENOS UN COMPONENTE QUE TENGA UNO O MAS GRUPOS EPOXI EN UNA MOLECULA; (IV) UN INICIADOR DE POLIMERIZACION CAPAZ DE GENERAR UN CUADRO LEWIS POR IRRADIACION DE UN RAYO DE ENERGIA ACTIVA. LA COMPRESION DE RESINA PUEDE SER CONVENIENTEMENRE CURADA CON UN RAYUO DE ENERGIA ACTIVA TAL COMO UN RAYO ULTRAVIOLETA O HAZ ELECTRONICO Y ES CAPAZ DE SER LAMINADO EN UN MODELO DESEADO SOBRE UNA LAMINA CUBIERTA DE COBRE PPARA USAR COMO UNA TABLA IMPRIMIDA O EN UNA LAMINA DE METAL, VIDRIO, CERAMICA O PLASTICO.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22949287 | 1987-09-16 | ||
JP15907488 | 1988-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2040790T3 true ES2040790T3 (es) | 1993-11-01 |
Family
ID=26485987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES198888115153T Expired - Lifetime ES2040790T3 (es) | 1987-09-16 | 1988-09-15 | Compuesto de resina curable mediante radiaciones de energia activa, que contiene una resina epoxi dotada de, como minimo, un compuesto que tiene uno o varios grupos epoxi en la molecula. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5068260A (es) |
EP (1) | EP0307918B1 (es) |
DE (1) | DE3881311T2 (es) |
ES (1) | ES2040790T3 (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2573661B2 (ja) * | 1988-07-09 | 1997-01-22 | キヤノン株式会社 | 感光感熱型接着剤 |
JP2660352B2 (ja) * | 1989-09-20 | 1997-10-08 | 日本ゼオン株式会社 | レジスト組成物 |
US5578418A (en) * | 1990-03-21 | 1996-11-26 | Canon Kabushiki Kaisha | Liquid jet recording head and recording apparatus having same |
DE69011844T2 (de) * | 1990-03-22 | 1995-01-12 | Canon Kk | Flussigkeitsstrahlaufzeichnungskopf und Aufzeichnungsgerät, versehen mit diesem Kopf. |
JPH0539444A (ja) * | 1990-11-30 | 1993-02-19 | Hitachi Chem Co Ltd | ポジ型感光性アニオン電着塗料樹脂組成物、これを用いた電着塗装浴、電着塗装法及びプリント回路板の製造方法 |
JPH07170054A (ja) * | 1993-12-14 | 1995-07-04 | Canon Inc | 紫外線硬化性組成物、これを用いたパターン形成方法及び配線基板の製造方法 |
JPH08165441A (ja) * | 1994-10-13 | 1996-06-25 | Canon Inc | 活性エネルギー線重合性組成物、これを含む記録媒体及びこれを用いた画像形成方法 |
WO1998058024A1 (fr) * | 1997-06-19 | 1998-12-23 | Mitsui Chemicals, Inc. | Composition de resine a mouler |
DE19917965A1 (de) | 1999-04-21 | 2000-10-26 | Daimler Chrysler Ag | Strahlungshärtbare Verbundschichtplatte oder -folie |
WO2005011755A2 (en) * | 2003-07-30 | 2005-02-10 | Tennant Company | Ultraviolet sanitation device |
JP4451193B2 (ja) * | 2004-04-12 | 2010-04-14 | 大日本印刷株式会社 | パターン形成体の製造方法 |
KR20210049228A (ko) * | 2019-10-24 | 2021-05-06 | 삼성디스플레이 주식회사 | 커버 글라스 및 이의 제조 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4593051A (en) * | 1983-02-07 | 1986-06-03 | Union Carbide Corporation | Photocopolymerizable compositons based on epoxy and polymer/hydroxyl-containing organic materials |
EP0209753B1 (en) * | 1985-06-26 | 1993-09-01 | Canon Kabushiki Kaisha | Active energy ray-curing resin composition |
US4688053A (en) * | 1985-07-13 | 1987-08-18 | Canon Kabushiki Kaisha | Liquid jet recording head having a layer of a resin composition curable with an active energy ray |
US4688056A (en) * | 1985-07-13 | 1987-08-18 | Canon Kabushiki Kaisha | Liquid jet recording head having a layer of a resin composition curable with an active energy ray |
-
1988
- 1988-09-15 ES ES198888115153T patent/ES2040790T3/es not_active Expired - Lifetime
- 1988-09-15 EP EP88115153A patent/EP0307918B1/en not_active Expired - Lifetime
- 1988-09-15 US US07/244,339 patent/US5068260A/en not_active Expired - Lifetime
- 1988-09-15 DE DE8888115153T patent/DE3881311T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5068260A (en) | 1991-11-26 |
DE3881311D1 (de) | 1993-07-01 |
EP0307918B1 (en) | 1993-05-26 |
EP0307918A3 (en) | 1989-06-14 |
EP0307918A2 (en) | 1989-03-22 |
DE3881311T2 (de) | 1993-09-16 |
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Legal Events
Date | Code | Title | Description |
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FG2A | Definitive protection |
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